会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明专利
    • ACCELERATING CAVITY RESONATOR
    • JPH01260800A
    • 1989-10-18
    • JP8736788
    • 1988-04-11
    • SUMITOMO HEAVY INDUSTRIES
    • YAMADA TOSHIHARUSOTOHA YOSHIYUKI
    • H05H7/18H01P7/06H05H9/00
    • PURPOSE:To minimize the movement of the tuner so as to improve the reliability and the life time of a cavity resonator by controlling the circulating flow rate of coolant basing on the temperature of the cavity body detected with a temperature detecting means. CONSTITUTION:The temperature of a cavity body 10 is detected with a thermometer 11 and compared with a preset temperature with a flow rate controller 12, and when the preset value is higher than the detected value the opening of a flow rate controlling valve 13 is increased depending on the temperature difference. On the other hand, when the preset value is lower than the detected value the opening of the flow rate controlling valve 13 is decreased depending on the temperature difference. Thereby the flow rate of pure water flowing in a cooling tube 5 is controlled by the said valve 13 so as that the temperature of the cavity body is kept nearly at the preset temperature. Thereby when adjusting the resonance frequency the movement of the tuner can be minimized to obtain an accelerating cavity resonator of high reliability and long life time.
    • 10. 发明专利
    • COOLING/HEATING PLATE FOR WAFER CHUCK AND WAFER CHUCK
    • JP2002124560A
    • 2002-04-26
    • JP2000315569
    • 2000-10-16
    • SUMITOMO HEAVY INDUSTRIES
    • YAMADA TOSHIHARU
    • H01L21/683F25D1/02F25D9/00H01L21/205H01L21/68
    • PROBLEM TO BE SOLVED: To provide a cooling/heating plate for wafer chuck that can secure the minimum thickness required for cooling or heating characteristics and stiffness, and at the same time the required flow rate of a heat medium. SOLUTION: In this cooling/heating plate for wafer chuck, two heat exchanger plates having a plurality of channels radially formed from a center-section side to an outer-periphery one are mutually overlapped. On a side-wall plate 12, an outer- periphery channel 21 of the upper-side heat transfer plate, and heat medium gateways 16b and 16a for upper and lower sides are provided in parallel so that each of the heat medium gateways communicates with the outer-periphery channel of a lower-side heat transfer plate. Notches 80b and 80a are provided in a region corresponding to the heat medium gateway for the upper side in a partition board member 80 for partitioning the upper- and lower-side outer-periphery channels, and a region corresponding to the heat medium gateway for the lower side. At the edge section of the notch 80a, the upper-side outer-periphery channel 21 and an upper-side partition wall 81b for partitioning are provided. Then, at the edge section of the notch 80b, the lower-side outer-periphery channel and a lower-side partition wall 81a for partitioning are provided, thus setting the diameter of the heat medium gateway for the upper and lower sides larger than a dimension determined according to the thickness of the heat transfer plate.