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1. 发明专利

JP2004142003A Polishing device and polishing method 审中-公开
公开(公告)号：JP2004142003A
公开(公告)日：2004-05-20
申请号：JP2002308771
申请日：2002-10-23
申请人： Sony Corp , ソニー株式会社
发明人： HAYASAKA TAKASHI , MINAGAWA TAKUYA
IPC分类号： B24B21/00 , G11B5/60 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method for a thin film magnetic head for improving production efficiency, and simplifying a machining process when applying blend processing to a work-piece. SOLUTION: This device is provided with a holding member 15 for holding the approximately rectangular head tips 11 arranged at specified intervals, a polishing tape 4, which is arranged at a place opposing to the head tip 11 for polishing each corner section 14 of the head tip 11 with the corner section 14 of the head tip 11 knocked and slidden, feeding mechanisms 21 and 22 for feeding the polishing tape 4, a guide member 6 for guiding the polishing tape 4 so as to make the polishing tape 4 overhang on the side of the head tip 11, and a moving mechanism 7 for moving the holding member 15 in the directions to approach and separate from the polishing tape 4, a cross direction orthogonal to the longitudinal direction of the polishing tape 4 and a direction in which the head tip 11 is arranged. The moving mechanism 7 moves the holding member 15 to make each corner section 14 of the head tip 11 slide on the polishing tape 4 made to be overhang by the guiding member 16. COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2002170101A METHOD AND APPARATUS FOR INSPECTING PATTERN 失效
公开(公告)号：JP2002170101A
公开(公告)日：2002-06-14
申请号：JP2000368999
申请日：2000-12-04
申请人： SONY CORP
发明人： MINAGAWA TAKUYA , ONODERA KAZUNORI , YAMAUCHI MASAYA
IPC分类号： G01B11/24 , G06T1/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To appropriately inspect in a short time a thin-film pattern serving as the subject of inspection. SOLUTION: When a number of thin-film patterns formed in the same shape on a wafer are inspected across a multitude of wafers, an image close to a preset master image which serves as a reference is selected as a reference image for each wafer and for each wafer the selected reference image is compared with an image of the thin-film pattern to be inspected, whereby the thin- film patterns serving as the subject of inspection are inspected. To select the reference image for each wafer, images of a certain number of thin-film patterns among a multitude of thin-film patterns formed on the wafer are sequentially obtained and the closeness between the image of the thin-film pattern obtained and the master image is evaluated by a numerical rank. An image of the thin- film pattern which is evaluated to be above a certain level of numerical rank and the highest numerical rank is selected as a reference image of the wafer.

3. 发明专利

JPH10144630A DRAWING SEPARATION INTO SEMICONDUCTOR WAFERS AND APPARATUS THEREOF 失效
公开(公告)号：JPH10144630A
公开(公告)日：1998-05-29
申请号：JP29860696
申请日：1996-11-11
申请人： SONY CORP
发明人： MINAGAWA TAKUYA , KIYOKAWA AKIKAZU , SAITO AKIRA
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method for expandingly separating a wafer sheet reliably into individual bar-shaped semiconductor wafers by moving the sheet in a expanding separation step, and also to provide an apparatus therefor. SOLUTION: A wafer sheet 2 having semiconductor wafers 1 bonded thereonto after completion of a cleavage break step is held at both ends in a direction perpendicular to break lines 13. A drawing clamp 11 for expanding the sheet 2 in the direction perpendicular to the break lines 13 as well as a sheet holding clamp 12 are provided. The apparatus also includes a depressing pressure applier 16 for depressing cleavage parts 14 of wafers 1 toward the sheet 2 for each cleavage part, and a rotary support 17 positioned as opposed to the applier 16 with the sheet 2 held therebetween for supporting the cleavage part 14 adjacent to the depressing cleavage part from underside of the sheet 2.

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