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    • 2. 发明专利
    • BOARDLIKE MATERIAL
    • JP2000038801A
    • 2000-02-08
    • JP20776898
    • 1998-07-23
    • TOYO ALUMINIUM KK
    • MORIWAKI HIDEZOTAKAHASHI KAZUTOSHISHIBAMURA YOSHIAKI
    • E04C2/26B32B3/12B32B15/12E04C2/36
    • PROBLEM TO BE SOLVED: To obtain a broardlike material excellent in strength by providing a number of closed voids in the inside and constituting the material out of a paper panel having a specified apparent density and boardlike shapes at both faces, barrier thin films having a specified vapor permeability laminated at both faces, and cardboard having a specified basis weight. SOLUTION: A boardlike material 1 is constituted of barrier thin films 2 having 0.5 g/cm2/24 hr or less vapor permeability laminated at both faces of a paper panel 10 having 0.15-0.4 apparant density forming boardlike shapes at both faces and having a number of closed voids in the inside, and paper board 3 having 100 g/cm2 or larger basis weight laminated with the films. In case of an apparent density lower than 0.15, the mechanical strength is inferior, and in case of an apparant density higer than 0.4, the whole weight is heavy. Since paper panel 10 absorbs moisture in the air if it is left as it is and a warp arises, it is shielded by the barrier thin films 2. When the vapor permeability exceeds 0.5, there is a fear that a warp arises in the boardlike material 1. In this way, a light weight plate which has a small vapor permeability and no warp, and a large shock-resistance, can be obtained.
    • 5. 发明专利
    • MOLDED PACKAGING MATERIAL FOR SUPPOSITORY
    • JPH0986560A
    • 1997-03-31
    • JP24444595
    • 1995-09-22
    • TOYO ALUMINIUM KK
    • KUBO HIROSHIOTA ATSUSHISHIBAMURA YOSHIAKI
    • B65D65/40B32B7/12
    • PROBLEM TO BE SOLVED: To provide a material wherein improved draw forming characteristics, low temperature heat adhesion properly, suppository-resisting property are provided, and good sealing property can be maintained for a long period of time and unsealing can be easily achieved by providing, on one side of a base material, a heat adhesive layer comprising a blend resin in which low-molecular polyethylene resin of specific pts.wt. and polybutene-1 resin are mixed. SOLUTION: A base material 21 comprises a single body or laminated body such as metal foil, i.e., aluminum foil having a thickness of 30-100μm and synthetic resin film such as stretched polypropylene having a thickness of 20-80μm. A heat adhesive layer 22 comprises a blend resin having a thickness of 15-80μm wherein low-molecular polyethylene resin of 25-87 pts.wt. is mixed with polybutene-1 resin of 13-75 pts.wt., preferably 20-30 pts.wt. A packaging material 20 comprising the material 21 and layer 22 is molded into a rocket shape and the peripheral portions and side surface portions are heat bonded over a predetermined width, leaving opposite tops of the molded body, and molten seating agent is charged from the top of the molded body, and then the top is heat bonded. As a result, moldability, oil resistance, seating property of the material can be improved and unsealing can be made easily.
    • 7. 发明专利
    • LAMINATED MATERIAL FOR CIRCUIT
    • JPH03214789A
    • 1991-09-19
    • JP1107190
    • 1990-01-19
    • TOYO ALUMINIUM KKREADER KK
    • SHIBAMURA YOSHIAKI
    • G03F7/004B32B15/08B32B15/082C23F1/00H05K3/06
    • PURPOSE:To make it possible to remove completely a resist ink layer from a metal layer by merely performing a short-time heating by a method wherein a depolymerizable methacrylate alkyl ester copolymerizate is used as the main resin component of the resist ink layer. CONSTITUTION:A laminated material 1 for circuit use is one formed by a method wherein a metal thin film layer 3 for circuit use is formed on a plastic sheet 2 and moreover, a resist ink layer 4 is provided on the outer surface of the layer 3. In this case, the layer 4 contains a methacrylate ester copolymerizate, whose monomeric composition is constituted of 30 to 99.5wt.% of methacrylate alkyl ester, 0.5 to 20wt.% of a polymerizable carboxylic acid and 0 to 50wt.% of a copolymerizable monomer, which is chosen from among acryl ester and the like, vinyl ester and the like and a vinyl compound, as its resin component. In such a way, as the methacrylate ester copolymerizate, which does not burn by a heat treatment and is depolymerized, is used as the main resin component of the resist ink layer, a removal of a carbide and the like are not needed and a treating time can be reduced.
    • 10. 发明专利
    • Apparatus for forming belt-like coating film and method of forming a plurality of coating films simultaneously
    • 用于形成类似薄膜的装置和形成多层涂膜的方法同时
    • JP2003010753A
    • 2003-01-14
    • JP2001205688
    • 2001-07-06
    • Toyo Aluminium Kk東洋アルミニウム株式会社
    • SHIBAMURA YOSHIAKI
    • B05D1/26B05C3/20B05C11/04B05D1/32B05D7/00B05D7/24
    • PROBLEM TO BE SOLVED: To provide a coating film forming apparatus which has a simple structure and in which a plurality of belt-like coating films are formed simultaneously, the degree of freedom in the change of the width of the coating film, the number of installations or the like is high and the high dimensional precision of the coating film is attained.
      SOLUTION: A belt like film 8 for partially intercepting the gap between a back roll 2 and a roll knife 3 is provided, a paste like coating agent 9 is passed through the gap between the back roll 2 and the roll knife 3 to apply on a sheet like member 10 and a non-coated part is formed on a place corresponding to the film 8 by partially intercepting the flow of the coating agent 9 with the film 8. As a result, the simultaneous forming or the like of a plurality of the coating films are simply performed.
      COPYRIGHT: (C)2003,JPO
    • 要解决的问题:为了提供一种结构简单并且同时形成多个带状涂膜的涂膜形成装置,涂膜宽度的变化的自由度, 装置等高,并且获得了涂膜的高尺寸精度。 解决方案:提供用于部分地遮挡后辊2和辊刀3之间的间隙的带状膜8,使糊状涂层剂9穿过背辊2和辊刀3之间的间隙,以涂覆在辊 片状构件10和未涂覆部分形成在与膜8相对应的位置上,部分地利用膜8截取涂覆剂9的流动。结果,同时形成多个 涂膜简单地进行。