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    • 4. 发明专利
    • SEMICONDUCTOR MANUFACTURING DEVICE
    • JPH01206630A
    • 1989-08-18
    • JP3247288
    • 1988-02-15
    • NIPPON OXYGEN CO LTDSHARP KK
    • MATSUMOTO ISAOYAMAGISHI KOJIUEDA TORU
    • H01L21/302H01L21/205H01L21/3065H01L21/31
    • PURPOSE:To manufacture a semiconductor manufacturing device capable of controlling ultraviolet ray irradiated in a reaction chamber in the specified intensity by a method wherein a dimming chamber for distributing dimming gas is provided while an ultraviolet ray control means is added to control the concentration of ultraviolet ray absorbent contained in the dimming gas corresponding to the intensity of ultraviolet ray in the reaction chamber. CONSTITUTION:Respective translucent plates 4, 6 in a light source chamber 2 and a reaction chamber 1 are oppositely arranged to provide a dimming chamber 3 for distributing dimming gas containing ultraviolet ray absorbent between these translucent plates 4 and 6 while an ultraviolet ray control means C is provided to control the concentration of the ultraviolet ray absorbent contained in the dimming gas corresponding to the intensity of ultraviolet ray in the reaction chamber 1. Through these procedures, the intensity of ultraviolet ray constantly irradiated in the reaction chamber 1 can be equalized regardless of the adhesion of any reaction product to the translucent plates 4, 6 as well as the economical decline in the luminescent intensity resultant from the aging deterioration of an ultraviolet ray source 7 so that the excellent processings such as etching, ashing, annealing etc., in addition to the film formation may be performed.
    • 7. 发明专利
    • EL DISPLAY PANEL
    • JPS54116198A
    • 1979-09-10
    • JP2384578
    • 1978-03-01
    • SHARP KK
    • MATSUMOTO ISAOOOBA TOSHIHIROYASUDA SHIYUUHEIOOTANI NAGAMOTOKANETANI YOSHIHARU
    • G09F13/22G09F9/00G09F9/30
    • PURPOSE:To enable to increase the reliability, small size and low cost, by fixing the display panel on the one side main surface of the both side printed board and mounting the drive circuits on opposite side main surface. CONSTITUTION:The thin film EL panel of matrix electrode construction consisting of the glass board 1, transparent electrode 2, first dielectric substance layer 3, ZnS light emission layer 4, second dielectric substance layers 5a and 5b of two layers, multi-layered aluminum film 11 absorbing external light, back electrode 13 and package 8, is electrically connected with soldering on the copper foil on the first circuit printed board consisting of the both side printed board with the lead terminal 10 made of phosphor bornz connected to the electrodes 2 and 13 and is supported elastically with floating condition with a given distance. Further, the back film 15 is provided at the main surface of the board 14 and electronic components 16, 16'' are located on the second circuit board 17 connected to the board 14 with the screw 20 and connector terminals 19 and 18 to other side, forming the drive circuit and control circuit etc.