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1. 发明专利

JP2007243227A Method of manufacturing semiconductor apparatus 有权
标题翻译：制造半导体器件的方法
公开(公告)号：JP2007243227A
公开(公告)日：2007-09-20
申请号：JP2007165827
申请日：2007-06-25
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： KAWADA YOICHI , KOIZUMI KOJI , SUGIYAMA MICHIAKI
IPC分类号： H01L25/18 , H01L23/50 , H01L25/065 , H01L25/07
CPC分类号： H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent the displacement of a dam bar caused by the injection pressure of resin at mold-forming in manufacturing of semiconductor apparatus which seals two semiconductor chips to a single package with resin using two lead frames.
SOLUTION: A short dummy lead 7 which is present at a direction of the width of a dam bar 6 is formed at the side of the dam bar 6 of a second lead frame LF2. The dummy lead 7 is formed only at the central part of a space region of a lead 1, and is not formed at both ends of the space region (in the neighborhood of the lead 1). This leads to that the dam bar 6 has a larger width by the length of the dummy lead 7 at the central part of the space region of the lead 1 and also has a smaller width at the both ends of the space region (in the neighborhood of the lead 1).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了防止在使用两个引线框使用树脂将两个半导体芯片密封到单个封装的半导体器件的制造中在模具成型时树脂的注射压力引起的位移。解决方案：在第二引线框架LF2的阻挡杆6的侧面形成有在阻挡杆6的宽度方向上存在的短虚拟引线7。虚拟引线7仅形成在引线1的空间区域的中心部分，并且不形成在空间区域（引线1附近）的两端。这导致阻挡杆6在引线1的空间区域的中心部分处具有较大的虚拟引线7的长度的宽度，并且在空间区域的两端具有较小的宽度的领导1）。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006074073A Manufacturing method of semiconductor device 有权
标题翻译：半导体器件的制造方法
公开(公告)号：JP2006074073A
公开(公告)日：2006-03-16
申请号：JP2005344949
申请日：2005-11-30
申请人： Renesas Technology Corp , 株式会社ルネサステクノロジ
发明人： FUJISHIMA ATSUSHI , NAKAJIMA YASUYUKI , HAGIWARA TAKATOSHI , KOIZUMI KOJI , KAWADA YOICHI , SUGIYAMA MICHIAKI
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
CPC分类号： H01L2224/45144 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2924/00 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To solve the problem for a semiconductor device, wherein two semiconductor chips are laminated and sealed by one resin-sealing body, that debris or the like occurred during welding leads of the semiconductor chips causes the yield of the semiconductor device to decrease. SOLUTION: In the manufacturing method of a semiconductor device having a resin-sealing body, first and second semiconductor chips with electrode on the front surface of their front and rear surfaces, a first lead extending through the inside and outside of the resin-sealing body and electrically connected to the electrode of the first semiconductor chip, and a second lead extending through the inside and outside of the resin-sealing body and electrically connected to the electrode of the second semiconductor chip, after forming the resin-sealing body with superposing the respective first and second leads, the first and second leads are respectively jointed by welding. The welding is performed, by making the laser light irradiated from the upper side of any one of the first and second leads. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了解决半导体器件的问题，其中两个半导体芯片由一个树脂密封体层压和密封，在半导体芯片的焊接引线期间发生碎屑等，导致半导体器件减少。解决方案：在具有树脂密封体的半导体器件的制造方法中，具有在其前表面和前表面的前表面上的电极的第一和第二半导体芯片，延伸穿过树脂的内部和外部的第一引线与第一半导体芯片的电极电连接的第二引线，以及在树脂密封体的内部和外部延伸并与第二半导体芯片的电极电连接的第二引线，在形成树脂密封体通过叠加相应的第一和第二引线，第一和第二引线分别通过焊接接合。通过使从第一和第二引线中的任一个的上侧照射的激光进行焊接。版权所有（C）2006，JPO＆NCIPI

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