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1. 发明专利

JPH10261896A METHOD AND APPARATUS FOR TAPING METAL TERMINAL PIECE, METAL TERMINAL PIECE TAPED BY TAPING METHOD OR APPARATUS AND MOUNTING METHOD OF METAL TERMINAL PIECE 失效
公开(公告)号：JPH10261896A
公开(公告)日：1998-09-29
申请号：JP6614597
申请日：1997-03-19
申请人： ROHM CO LTD
发明人： INOUE TANEICHI , NOZAKI MASAFUMI
IPC分类号： H05K13/04 , B65B15/04 , H05K13/02
摘要： PROBLEM TO BE SOLVED: To increase the speed of a process for holding a metal terminal piece on a long stripe tape and mounting the metal terminal piece on a board body. SOLUTION: The apparatus for holding a plurality of metal terminal pieces 94 sequentially on a long stripe tape 6 (65) while transferring the tape 6 (65) on a specified transfer passage comprises a unit 50 for feeding the tape 6 (65), a unit 90 for feeding a long stripe metal hoop material 9, a unit 8 for cutting the metal hoop material 9 continuously at a specified length to produce a metal terminal piece 94, a unit 7 for mounting the metal terminal piece 94 at a constant interval on the tape 6 (65), and a unit 51 for winding the tape 6 (65) held by the metal terminal piece 94.

2. 发明专利

JPH10247449A PRINTED CIRCUIT BOARD WITH FUSE FUNCTION 失效
公开(公告)号：JPH10247449A
公开(公告)日：1998-09-14
申请号：JP4911397
申请日：1997-03-04
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI
IPC分类号： H05K1/16 , H01H37/76 , H01H85/02 , H01H85/046 , H01H85/17 , H01H85/175 , H01H85/48 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board applied with a fuse function with a simple means without enlarging the printed circuit board by forming a fuse film having conductivity and cutting a current to release a circuit when the current or temperature exceeds a prescribed value. SOLUTION: A through hole 30 is formed at a proper section of a printed circuit board 3, and a fuse film 4 is formed astride the through hole 30. The printed circuit board 3 is made of a glass epoxy resin, and conductor pads are formed at the portions pinching the through hole 30. A wiring pattern electrically connected to the conductor pads is formed on the surface of the printed circuit board 3. A desired electronic component mounted on the printed circuit board 3 is electrically connected to the conductor pads. The fuse film 4 is formed to bridge the conductor pads astride the through hole 30 by the well- known method such as sputtering with a metal or an allow, for example.

3. 发明专利

JPH11240132A MARKING DEVICE FOR ELECTRONIC PART 失效
公开(公告)号：JPH11240132A
公开(公告)日：1999-09-07
申请号：JP4201098
申请日：1998-02-24
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI
IPC分类号： B41F17/36 , B41K3/04 , B41K3/62 , H05K13/00
摘要： PROBLEM TO BE SOLVED: To provide a marking device wherein marking can be performed on electronic parts by a simple method and a marking agent in a marking pen can be prevented from being evaporated and the marking agent is always kept under a stable condition and marking with excellent quality can be performed. SOLUTION: The titled marking device consists of a marking pen 1 impregnated with a volatile marking agent, a holder for holding the marking pen 1, a moving means 2 for sliding this holder in the axial direction of the marking pen 1 in order to perform marking by bringing the apex 11 of the marking pen 1 into contact with an article 9 to be marked, a rotating means 3 for rotating the marking pen 1 by a definite angle and a cap 4 for covering the apex 11 of the marking pen 1 and the cap 4 is provided at a position where the apex 11 of the marking pen 1 is covered with the cap 4 by sliding the marking pen 1 in the axial direction by the moving means 2 under a condition where this holder is separated from the marking face of the article 9 to be marked and is rotated.

4. 发明专利

JPH06232331A MANUFACTURE OF PROTECTIVE ELEMENT FOR SEMICONDUCTOR DEVICE USE 失效
公开(公告)号：JPH06232331A
公开(公告)日：1994-08-19
申请号：JP1424893
申请日：1993-01-29
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI
IPC分类号： H01L23/58
摘要： PURPOSE:To prevent variation from being generated in the performance characteristics of each through hole-mounted protective element and to reduce the cost of the protective element when the through hole-mounted protective elements are manufactured using a lead frame provided integrally with pairs of lead terminals at appropriate intervals. CONSTITUTION:Bonding pad parts 1a on the lead terminals 1 on one side of both lead terminals 1 and 2 and bonding pad parts 2a on the other lead terminals 2 are arranged in such a way that they are arranged in the direction roughly rectangular to the longitudinal direction of a lead frame A, while metal wires 3 are respectively provided between both of these bonding pad parts 1a and 2a in such a way that the metal wires 3 are extended in the direction roughly rectangular to the longitudinal direction of the lead frame A.

5. 发明专利

JPS63278868A PRODUCTION OF THERMAL HEAD 失效
公开(公告)号：JPS63278868A
公开(公告)日：1988-11-16
申请号：JP11436387
申请日：1987-05-11
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI , OKUBO SHINYA
IPC分类号： B41J2/335 , B41J2/345
摘要： PURPOSE:To control the grinding amount on the basis of a conductive pattern and to enhance a production efficiency by a measurement simultaneous with grinding, by a method wherein, on a substrate, a checking conductive film is formed between a heating part and and end part of the substrate in the vicinity of the heating part, and a substrate end face in the vicinity of the heating part is ground with the measurement of a value of electrical resistance between the checking conductive film and a grinding tool. CONSTITUTION:Resistor layers 3, 4 are formed on a substrate 1 and a glaze layer 2, and thereon metallic layers 5, 6, and 7 are formed. The resistor layer 4 and the metallic layer 7 thereon are patterned between a substrate end part in the vicinity of a heating part and used as a checking electrode. Then, in the grinding of a substrate end face, he checking electrode 7 is noncommunicative to a grinding wheel in a range of L1-L2. When the grinding wheel reaches the point L2 to come into contact with the checking electrode 7, a value of resistance is remarkably reduced. When the wheel grinds the substrate end surface further to a point L3, a contact area between the grinding wheel and the checking electrode is reduced, and with this reduction a value of resistance is remarkably raised. In this manner, the detection of the decrease/increase of a value of resistance enables either the point L2 or L3 to be finished as an end face.

6. 发明专利

JPH0864109A ELECTRONIC PART AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0864109A
公开(公告)日：1996-03-08
申请号：JP19939894
申请日：1994-08-24
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI
IPC分类号： H01H85/48 , H01H85/02 , H01H85/045 , H01H85/06 , H01H85/143 , H01H85/17 , H01H85/175
摘要： PURPOSE: To provide an electronic part which is easily miniaturized and dispenses with resin aiding and is not blown off from a base board on which it is mounted even when rapid heating is brought about and its manufacturing method. CONSTITUTION: A bonding pad 8 is formed in one sheet of a base board and after that, is divided in a rectangular form to form an end surface electrode 7, and a main body 5 is formed by dicing it. A lead wire 2 is welded thereto, a JCR 3 is dripped and a hard coat 6 is formed thereon.

7. 发明专利

JPH0513632A LEAD FRAME, ELECTRONIC DEVICE USING IT, AND MANUFACTURE OF THEM 失效
公开(公告)号：JPH0513632A
公开(公告)日：1993-01-22
申请号：JP16457491
申请日：1991-07-04
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI
IPC分类号： H01L23/48 , H01L25/04 , H01L25/18
摘要： PURPOSE:To work a lead frame with its a plurality of heat sinks combined together via a connection for a resin molding process and, after the resin molding process, cut off only the connecting part of each heat sink to obtain electronic devices. CONSTITUTION:A lead frame 1 to form a plurality of electronic devices provided with a heat sink 12 integrally resin sealed. The lead frame 1 is provided with resin sealing areas 14 corresponding to each electronic device and electronic device forming parts 15 with terminal leads 5 led out of the areas. Further, in the border 4 between the adjacent electronic device forming parts 15, an opening 11 is provided to cut off the connection coupling one heat sink with another.

8. 发明专利

JPH03251847A METHOD AND DEVICE FOR EXPOSING PHOTORESIST 失效
公开(公告)号：JPH03251847A
公开(公告)日：1991-11-11
申请号：JP5017890
申请日：1990-03-01
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI , OTA AKIO
IPC分类号： G03F7/20 , H01L21/027 , H01L21/30
摘要： PURPOSE:To simplify a process by rotating a substrate after exposing of a 1st exposing surface, then exposing a 2nd exposing surface, thereby executing the patterning of electrodes at one time. CONSTITUTION:A DC servo motor 25 rotates and a base 21 retreats to the prescribed position right under a photomask 16 when a work chuck 40 attracts and fixes the substrate 2. An actuator 29 operates and a member 30 rises to position the substrate 2 near to the mask 16. The photoresist on the substrate surface 2b is exposed by being irradiated with UV rays from above the mask 16. The chuck 40 rotates while the substrate 2 is held mounted thereon and the substrate end face 2a is positioned right under the pattern 16a for the end face of the photomask 16, by which the end face 2a is brought near to the mask 16 and the photoresist on the end face 2a is exposed by UV rays.

9. 发明专利

JPH03248157A METHOD FOR APPLYING PHOTORESIST 失效
公开(公告)号：JPH03248157A
公开(公告)日：1991-11-06
申请号：JP4500790
申请日：1990-02-26
申请人： ROHM CO LTD
发明人： NOZAKI MASAFUMI , OTA AKIO
IPC分类号： G03F7/16 , B05D1/18 , B05D1/40 , B05D3/00 , B41J2/335 , H01L21/027 , H01L21/30 , H01L21/56
摘要： PURPOSE:To optimize and uniformize the film thickness of a photoresist on a substrate having non-plane parts by dipping the substrate into a photoresist liquid to stick the photoresist to the surface of this substrate and rotating this substrate around a revolving shaft at a high speed, thereby splashing the excess photoresist. CONSTITUTION:The substrate having the non-plane parts 1a is dipped into the photoresist liquid P to stick the photoresist on the surface of this substrate. This substrate 1 is rotated around the revolving shaft to splash the excess photoresist. Namely, the film thickness is nonuniform and the liquid may sag in the state right after dipping, but the excess photoresist is splashed form the substrate 1 by centrifugal force at the time of the high-speed revolution; in addition, the photoresist is uniformly spread. The photoresist is applied at the correct and uniform film thickness even on the substrate, such as substrate of an end face type thermal head, having the non-plane parts in this way.

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