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1. 发明专利

JP2010040920A Optical semiconductor device and method of manufacturing same 审中-公开
标题翻译：光学半导体器件及其制造方法
公开(公告)号：JP2010040920A
公开(公告)日：2010-02-18
申请号：JP2008204351
申请日：2008-08-07
申请人： Panasonic Corp , パナソニック株式会社
发明人： OBARA NAOKI , TAKEHARA HIROSHIGE , ISHIDA HIROYUKI , YOSHIKAWA NORIYUKI
IPC分类号： H01L31/02
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor device accurately covered with a sealing resin by avoiding a light reception region of a semiconductor light reception element; and a method of manufacturing the same. SOLUTION: This optical semiconductor device is based on an optical semiconductor device including a semiconductor light reception element arranged on a mounting substrate and having a light reception region, an electrode body on the mounting substrate and a connection body electrically connecting the semiconductor light reception element to the electrode body. In the optical semiconductor device, an insulation wall is formed around the light reception region of the semiconductor light reception element. The sealing resin contacts a circumferential surface of the insulation wall, and covers the semiconductor light reception element and the mounting substrate in a range throughout an outer edge of the mounting substrate. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过避免半导体光接收元件的光接收区域来提供用密封树脂精确地覆盖的光学半导体器件; 及其制造方法。解决方案：该光学半导体器件基于包括设置在安装基板上并具有光接收区域的半导体光接收元件，安装基板上的电极体和将半导体光电连接的连接体的光学半导体器件接收元件到电极体。在光半导体装置中，在半导体光接收元件的光接收区域的周围形成绝缘壁。密封树脂与绝缘壁的周面接触，并且在安装基板的整个外缘的范围内覆盖半导体光接收元件和安装基板。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2009099680A Optical device and method of manufacturing the same 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：JP2009099680A
公开(公告)日：2009-05-07
申请号：JP2007268122
申请日：2007-10-15
申请人： Panasonic Corp , パナソニック株式会社
发明人： NANO MASANORI , ISHIDA HIROYUKI , YOSHIKAWA NORIYUKI
IPC分类号： H01L21/56 , H01L27/14 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L24/97 , B29C45/14418 , B29C45/14655 , B29C2045/14663 , H01L27/14618 , H01L27/14683 , H01L31/0203 , H01L31/18 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48227 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/12041 , H01L2924/1815 , H01L2924/00014 , H01L2224/85 , H01L2224/83
摘要： PROBLEM TO BE SOLVED: To provide a compact optical device which can be manufactured inexpensively and has an exposed optical function region. SOLUTION: An optical element 10 mounted on a wiring board 20 is sealed by a sealing resin 15 except the optical function region 12. Wires 24 connecting the wiring board 10 with the optical element 10 are also sealed. The optical function region 12 is exposed as a bottom surface 31 of a recess 30 whose side surface is formed by the sealing resin 15. A boundary portion between the side surface 32 of the recess 30 and a top surface portion 60 is cut to have a rounded shape. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可廉价制造且具有曝光的光学功能区域的紧凑型光学装置。解决方案：安装在布线板20上的光学元件10被除了光学功能区域12之外的密封树脂15密封。连接布线板10与光学元件10的导线24也被密封。光学功能区域12作为侧面由密封树脂15形成的凹部30的底面31露出。凹部30的侧面32与顶面部60之间的边界部分被切割成具有圆形。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2009081346A Optical device and method for manufacturing same 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：JP2009081346A
公开(公告)日：2009-04-16
申请号：JP2007250714
申请日：2007-09-27
申请人： Panasonic Corp , パナソニック株式会社
发明人： NANO MASANORI , TANIGUCHI MASAKI , ISHIDA HIROYUKI , YOSHIKAWA NORIYUKI
IPC分类号： H01L23/28 , H01L21/56 , H01L27/14 , H01L31/02 , H01L33/56 , H01L33/62
CPC分类号： H01L33/60 , H01L24/73 , H01L24/97 , H01L27/14618 , H01L31/0203 , H01L33/486 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/01029 , H01L2924/12041 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/92247
摘要： PROBLEM TO BE SOLVED: To provide a compact optical device that can be manufactured by a simple and inexpensive method and in which an optically functional region is exposed. SOLUTION: An optical element 10 mounted on a wiring board 20 is sealed with a sealing resin 15 except for an optically functional region 12 and a wire 24 that connects the wiring board 20 and the optical element 10 is also sealed. The optically functional region 12 is exposed as a bottom 31 of a recess part 30 with the sealing resin 15 as a side surface 35. The recess part 30 has a two-stage configuration of a hollow 40 on the bottom and a part on the upper side thereof, and a step part 36 extends from the top of a first side surface 34 of the hollow 40 on the bottom to the bottom of a second side surface 32. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供可以通过简单且便宜的方法制造并且其中暴露光学功能区域的紧凑型光学器件。解决方案：除了光学功能区域12之外，安装在布线板20上的光学元件10被密封树脂15密封，并且连接布线板20和光学元件10的导线24也被密封。光学功能区域12以密封树脂15作为侧面35作为凹部30的底部31露出。凹部30具有底部的中空部40的上部和上部的一部分的两级结构并且台阶部分36从底部的中空部分40的第一侧表面34的顶部延伸到第二侧表面32的底部。版权所有：（C）2009，JPO＆INPIT

4. 发明专利

JP2009147032A Semiconductor device, and optical pickup device 审中-公开
标题翻译：半导体器件和光学拾取器件
公开(公告)号：JP2009147032A
公开(公告)日：2009-07-02
申请号：JP2007321445
申请日：2007-12-13
申请人： Panasonic Corp , パナソニック株式会社
发明人： YOSHIKAWA NORIYUKI , ISHIDA HIROYUKI
IPC分类号： H01S5/022 , G11B7/125 , G11B7/13
CPC分类号： H01L23/49562 , G11B7/123 , G11B7/127 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： PROBLEM TO BE SOLVED: To secure holding strength of a lead terminal by a resin while securing strength of the lead terminal during a manufacturing process and achieving thickness reduction. SOLUTION: The width of the lead terminal 2, connected to a die pad 1, nearby the die pad 1 is increased and a slit 9 and a projection plate are formed on the lead terminal in a region wherein a resin 5 is formed to secure the holding strength of the lead terminal by the resin 5 while securing the strength of the lead terminal during the manufacturing process and achieving the thickness reduction. COPYRIGHT: (C)2009,JPO&INPIT

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