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1. 发明专利

JPH05232493A 失效
公开(公告)号：JPH05232493A
公开(公告)日：1993-09-10
申请号：JP28517292
申请日：1992-09-30
申请人： PHOTON DYNAMICS INC
发明人： JINETSUTO ADEIIGO , FURANSOA JIEI HENRII , KINGU SHII SHIEN
IPC分类号： B23K26/00 , G02F1/1343
摘要： PURPOSE: To enable a repairing system for circuit and panel composed mainly of a laser to effectively deposit a conductive material to a target area by distributing a solution in the target area so that the solution can excellently bond the conductive material to the target area and can be uniformly dried. CONSTITUTION: The method for distributing a solution in a target area of the repairing system composed mainly of a laser for removing materials from circuit panels is composed of a process for discharging the solution from a nozzle 88 which is excited with ultrasonic waves while the nozzle 88 is moved relatively to the target area and the nozzle 88 generates a thin film in the target area for making preparations for the disintegration by means of a second laser. The nozzle 88 has a head 104 which vibrates at such an ultrasonic frequency that causes a standing wave across a recessed section having a fluid distributing orifice at its central part. The fluid distributing orifice is composed of a hollow tube in a channel and the hollow tube has one opening and is separated from the wall of the opening with a clearance in between. The tube is fixedly held on the plane of vibration of the head 104.

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