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    • 2. 发明专利
    • SINTERED HARD FILM COATED MEMBER AND ITS PRODUCTION
    • JPH0912397A
    • 1997-01-14
    • JP18066395
    • 1995-06-23
    • OSAKA DIAMOND IND
    • MATSUMOTO YASUSHIKAWANISHI MAKOTOTOMIMORI HIROSHI
    • C30B29/04C23C16/26C23C16/27
    • PURPOSE: To make continuous production possible while a base material is held loaded in a reaction vessel by subjecting the surface of a sintered hard alloy base material to a heat treatment in an atmosphere where carbon atoms exist, cleaning the base material in a heated hydrogen atmosphere and forming diamond and/or diamond-like carbon by a vapor phase synthesis method on the surface of the base material. CONSTITUTION: A CVD apparatus shown in Fig. consists of a reaction vessel 1, an atmosphere gas introducing valve 2, a tungsten filament 3, a cooling base 4, the sintered hard alloy base material (e.g.: sintered hard chip of WC-25%Co) 5, and a gas discharge valve 6. The cobalt of the bond phase precipitates on the base material surface when the atmosphere gas is formed of H2 -1%CH4 , its pressure thereof is set under 100Torr and the base material is heated to 900 deg.C for 60 to 120 minutes. The base material is then exposed into the heated hydrogen atmosphere, by which the base material is subjected cleaning (pressure 100Torr and 900 deg.C). The atmosphere gas is changed over to H2 -1%CH4 and the diamond film is formed at >=10μm under the press of 100Torr and the base material temp. of 900 deg.C. The surface of the film is then polished.
    • 9. 发明专利
    • INTEGRATED CIRCUIT LEAD BENDING WORK TOOL
    • JPH0817986A
    • 1996-01-19
    • JP16996794
    • 1994-06-28
    • OSAKA DIAMOND IND
    • MATSUMOTO YASUSHIKAWAI NARIYOSHIKAWANISHI MAKOTOTOMIMORI HIROSHI
    • B21D5/01H01L23/50
    • PURPOSE:To contrive improvement of the molding accuracy of an integrated circuit lead bending work use tool and increase in the production efficiency of the tool by a method wherein the contact surface of the tool is constituted of a diamond sintered body, which is hard, has a bad wettability with a plating, such as solder, and makes hard to generate adhesion of the plating to the contact surface of the tool, and the surface roughness of the contact surface is flat finished so as to prevent a deposit from being generated on the contact surface. CONSTITUTION:An integrated circuit lead bending work use tool consists of a die 2 and a punch. The die 2 is constituted by mounting integrally members 6, which has a soldered diamond sintered body piece D, to a die main body 21 by screws 7. The sintered body piece D is made by a method wherein a diamond sintered body layer A is provided on a carbide alloy base material layer B and the layer A is cut out at an angle Q of inclination and is formed into a sliding inclined plane 22. The surface roughness of the plane 22 is finished into a roughness of 0.03mum Ra or lower so as to prevent a deposit from being generated on the plane 22. Thereby, adhesion of a plating to the tool is very little, the molding accuracy of the tool is improved and at the same time, the frequency of production stops for a cleaning work is decreased and the production efficiency of the tool is increased.