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1. 发明专利

JPS5898906A IRON CORE 失效
公开(公告)号：JPS5898906A
公开(公告)日：1983-06-13
申请号：JP19822781
申请日：1981-12-08
申请人： OMRON TATEISI ELECTRONICS CO
发明人： OOBA MASATOSHI , YOSHIDA HAJIME , EGUCHI NOBORU
IPC分类号： H05K1/16 , H01F17/00 , H01F17/04 , H01F27/24 , H01H50/36
摘要： PURPOSE:To contrive the titled device to be more compact and thinner, by employing an iron core obtained by forming a coil pattern on the peripheral surface of a magnetic material by photoetching, electroforming or the like. CONSTITUTION:A coil pattern 3 is formed on the peripheral surface of a magnetic material 1 through an insulating layer 2 by a processing method such as photoetching or electroforming. The thickness of the pattern 3 should be 5- 10mum; the width thereof should be 10-20mum; and the insulating space between the adjacent conductors should be 10-25mum. As the magnetic material 1, pure iron, silicon steel, permalloy and amorphous magnetic material can be employed. It is to be noted that second and third coil patterns may be further formed on the coil pattern 3 through insulating films. In addition, a plurality of iron cores thus formed can be laid one on top of the other. By employing such an iron core, the device using the same can be made more compact and thinner, and the troublesome winding operation can be omitted.

2. 发明专利

JPS5884409A ELECTROMAGNET DEVICE 失效
公开(公告)号：JPS5884409A
公开(公告)日：1983-05-20
申请号：JP18293281
申请日：1981-11-12
申请人： OMRON TATEISI ELECTRONICS CO
发明人： IMAI YOSHIKIYO , YOSHIDA HAJIME
IPC分类号： H01F7/14 , H01H50/16
摘要： PURPOSE:To contrive the improvement in the magnetic efficiency and the performance characteristics of the titled divice as well as to prevent the deformation of its spacer itself by a method wherein an amorphous magnetic metal piece is used for said spacer. CONSTITUTION:The middle leg 6 of a core 5 is inserted in the center hole 4 of a spool 3, whereon the coil 2 of the electromagnet device is wound around, and the terminal 8a of a movable iron piece 8 is supported by a hinge 9 to the terminal 5a of the core 5. Also, in between the core 5 and the movable iron piece 8, an amorphous magnetic metal piece 10, which was punched out in the same shape as the core 5, is interposed. The iron piece 10 consists of an amorphous material having a soft magnetic property and can be obtained by performing a roll-forming method wherein a piece of metal having certain iron in a high-temperature melting state is chilled. Said metal piece 10 is fixed to the core 5 in advance by performing a seam welding, a spot welding, an adhesive bonding method or the like.

3. 发明专利

JPS587736A ELECTROMAGNETIC RELAY 失效
公开(公告)号：JPS587736A
公开(公告)日：1983-01-17
申请号：JP10665081
申请日：1981-07-07
申请人： OMRON TATEISI ELECTRONICS CO
发明人： AGATAHAMA SHIYUNICHI , ARAO MAKI , MAENISHI KOUZOU , KISHIMOTO SHIYUUICHI , YOSHIDA KEIICHI , TSURUYOSHI KENICHI , SANO TAKEZOU , YOSHIDA HAJIME
IPC分类号： H01H50/64

4. 发明专利

JPS57137443A ELECTRICAL CONTACT MATERIAL 失效
公开(公告)号：JPS57137443A
公开(公告)日：1982-08-25
申请号：JP2461181
申请日：1981-02-20
申请人： OMRON TATEISI ELECTRONICS CO
发明人： YOSHIDA HAJIME , TANIGUCHI TOMIO , TAKASAKI TAKAO
IPC分类号： C22C5/06 , C22C32/00 , H01H1/02 , H01H1/023 , H01H11/04
摘要： PURPOSE:To enhance the hardly dissipative property and melt-sticking resistance of the resulting electrical contact material and to make the electric conductivity almost equal to that of silver by providing a specified composition contg. titanium nitride, carbon and silver. CONSTITUTION:This electrical contact material is a ternary material consisting of

5. 发明专利

JPS5810339A ELECTROMAGNETIC RELAY 失效
公开(公告)号：JPS5810339A
公开(公告)日：1983-01-20
申请号：JP10849581
申请日：1981-07-11
申请人： OMRON TATEISI ELECTRONICS CO
发明人： AGATAHAMA SHIYUNICHI , ARAO MAKI , MAENISHI KOUZOU , KISHIMOTO SHIYUUICHI , YOSHIDA KEIICHI , TSURUYOSHI KENICHI , SANO TAKEZOU , YOSHIDA HAJIME
IPC分类号： H01H50/04

6. 发明专利

JPS57188636A ELECTRICAL CONTACT MATERIAL 失效
公开(公告)号：JPS57188636A
公开(公告)日：1982-11-19
申请号：JP7379381
申请日：1981-05-15
申请人： OMRON TATEISI ELECTRONICS CO
发明人： TANIGUCHI TOMIO , YOSHIDA HAJIME , OOBA MASATOSHI , TAKASAKI TAKAO
IPC分类号： C22C5/06 , H01H1/02 , H01H1/023 , H01H11/04
摘要： PURPOSE:To obtain an electrical contact material provided with satisfactory hardly dissipative property, melt sticking resistance and other performance without using Cd by adding a specified amount of V to Ag. CONSTITUTION:This electrical contact material consists of 0.1-50vol% V and the balance Ag. By adding V, the hardness of a contact is increased, and both of the hardly dissipative property and melt sticking resistance are enhanced. Even if V is oxidized by load switching, since V oxide has low resistivity, the contact resistance of the contact is maintained in a stable state. The contact has superior melt sticking resistance and hardly dissipative property. The contact resistance is slightly increased, yet performance required as a contact is well satisfied.

7. 发明专利

JPS57108207A PRODUCTION OF MULTILAYERED CONTACTS 失效
公开(公告)号：JPS57108207A
公开(公告)日：1982-07-06
申请号：JP18679080
申请日：1980-12-25
申请人： OMRON TATEISI ELECTRONICS CO
发明人： NISHIDA KATSUHIKO , YOSHIDA HAJIME , TAKASAKI TAKAO
IPC分类号： B22F7/00 , B22F7/06 , H01H11/04
摘要： PURPOSE:To produce multilayered contacts of high interlayer adhesive strength with good productivity by pressure molding powder contact material of noble metals and powder contact materials of base metals successively in layers then sintering these. CONSTITUTION:A powder contact material 2a of a noble metal is loaded into a bottom plug 1a, and is prepressurized with a top force 1b, whereby a contact material layer 3a on one side is formed. A powder contact material 2b of base metal is loaded on the layer 3a and is similarly prepressurized to form a base material layer 3b. Then, a powder contact material 2c of a noble metal is loaded on the layer 3b, and is subjected to regular pressurizing to form the other contact material layer 3c. Then, the three layered contact material 4 consisting in laminating and pressurizing the materials 2a, 2b, 2c is sintered, after which it is subjected to forming, whereby a rivet-like multilayered contact 5 is formed. Thence, it is applied with barrel working and noble metal plating to smooth the surfaces of the layers 3a, 3c.

8. 发明专利

JPS55154018A METHOD OF MACHINING MOVABLE CONTACT PIECE 失效
公开(公告)号：JPS55154018A
公开(公告)日：1980-12-01
申请号：JP6088079
申请日：1979-05-17
申请人： OMRON TATEISI ELECTRONICS CO
发明人： YOSHIDA HAJIME , EGUCHI NOBORU , TAKASAKI TAKAO , NISHIDA KATSUHIKO
IPC分类号： H01H11/04

9. 发明专利

JPS5893305A ELECTROMAGNET DEVICE 失效
公开(公告)号：JPS5893305A
公开(公告)日：1983-06-03
申请号：JP19322381
申请日：1981-11-30
申请人： OMRON TATEISI ELECTRONICS CO
发明人： OOBA MASATOSHI , YOSHIDA HAJIME , EGUCHI NOBORU
IPC分类号： H01F7/08 , H01F7/06 , H01H50/16
摘要： PURPOSE:To form a magnetic circuit while largely reducing the number of required parts and improve the magnetic property, by employing as an iron core an amorphous magnetic metal piece showing a soft magnetic property. CONSTITUTION:A plurality of amorphous magnetic metal pieces 10 showing a soft magnetic property are laminated and elastically bent at a substantially central part thereof to form forked side piece parts 13, 14. The end surfaces of the respective side piece parts 13, 14 are made to face each other with a predetermined gap maintained therebetween. One side piece part 13 is wound with an excitation coil 3. when the coil 3 is energized, a magnetic circuit is formed at an iron core 1. The side piece part 14 slightly swings owing to the elasticity of the bent part 15, and a magnetic pole surface 12 is attracted to a magnetic pole surface 11. When the energization is stopped, the bending stress stored in the bent part 15 causes the side piece part 14 to return.

10. 发明专利

JPS57188700A PRODUCTION OF ELECTRICAL CONTACT 失效
公开(公告)号：JPS57188700A
公开(公告)日：1982-11-19
申请号：JP7319781
申请日：1981-05-14
申请人： OMRON TATEISI ELECTRONICS CO
发明人： YOSHIDA HAJIME , TANIGUCHI TOMIO , TAKASAKI TAKAO
IPC分类号： C25D7/00 , C25D15/00 , C25D15/02 , H01H11/04
摘要： PURPOSE:To obtain a contact material layer which has uniform structure and sufficient strength and contains a metal having a solid solubility limit at a high rate by applying a dispersion plating method in forming the contact material layer on a contact point base material. CONSTITUTION:Dispersion plating is applied on a contact base material consisting of, for example, a copper alloy in a bath of the 1st metal, for example, silver, suspended with the 2nd metal, for example, Ni particles. In this way, the plating layer wherein the Ni having a solid solubility limit for silver is dispersed and deposited in the matrix of silver at said limit or above is formed. In the case of working the formed layer to a contact shape, cracking and breakdown are virtually eliminated by this. As a result, the properties are improved, and the cost is reduced; further, the need for joining states of the base material and the contact and an intermediate layer of noble metals for the purpose of joining is eliminated. It is equally well to apply strike plating on the surface of the base material in order to improve the adhesiveness between the base material and the contact material layer further.

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