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1. 发明专利

JP2013018081A Grinding plate and grinding method 有权
标题翻译：研磨板和研磨方法
公开(公告)号：JP2013018081A
公开(公告)日：2013-01-31
申请号：JP2011153217
申请日：2011-07-11
申请人： Nsk Ltd , 日本精工株式会社
发明人： NISHIDE KOJI , NAKANO SUSUMU , ISHIKAWA YOSHIAKI , SAKAMOTO TSUBASA
IPC分类号： B24B49/02 , B23Q15/24 , B24B19/06
CPC分类号： B24B51/00 , B23Q15/04 , B24B5/37 , B24B5/40 , B24B19/06 , B24B49/02 , B24B49/03 , B24B49/05 , G05B19/404 , G05B2219/34389 , G05B2219/36196 , G05B2219/49319
摘要： PROBLEM TO BE SOLVED: To provide a grinding technique, which is capable of shortening a time required for replacing a set of workpieces and start-up thereof, and also capable of eliminating the occurrence of defective products, even when an in-process gauge is not used, thereby grinding good products with the aimed sizes at the first grinding.SOLUTION: A grinding plate includes: executing the teaching (teach-in) work; grinding a workpiece 2 by only a predetermined "trial grinding amount A" from the teach-in position SX, and then measuring a diameter of the workpiece; calculating a residual amount to be ground (residual grinding amount) before the workpiece has the finished dimensions based on the results of the measurement; and executing the grinding by only the "residual grinding amount R".
摘要翻译：要解决的问题：为了提供一种能够缩短更换一组工件和启动所需的时间并且也能够消除不合格产品的发生的磨削技术，不使用工艺规格，从而在第一次研磨时研磨具有目标尺寸的良好产品。
解决方案：研磨盘包括：执行教学（教学）工作; 从教导位置SX仅将预定的“试磨研磨量A”研磨工件2，然后测量工件的直径; 基于测量结果计算在工件具有最终尺寸之前要研磨的残余量（残余研磨量）; 并且仅通过“残余研磨量R”执行研磨。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2013013971A Grinding machine and grinding method 有权
标题翻译：研磨机和研磨方法
公开(公告)号：JP2013013971A
公开(公告)日：2013-01-24
申请号：JP2011148538
申请日：2011-07-04
申请人： Nsk Ltd , 日本精工株式会社
发明人： NISHIDE KOJI
IPC分类号： B24B49/02 , B24B49/10 , B24B51/00
CPC分类号： B24B51/00 , B24B49/02
摘要： PROBLEM TO BE SOLVED: To shorten time for a set change by achieving teaching-less and automating the set change of a workpiece, and to produce a non-defective product on the first attempt by completely eliminating the occurrence of a defective product.SOLUTION: With reference to a center position CP of a support shaft 6 for supporting the grinding wheel 4, a diameter of a first workpiece 2 before grinding is denoted by ID, a diameter of a grinding wheel is denoted by WD, a grinding completion position of the first workpiece after the grinding is denoted by S4, and an actual grinding start position of each grinding wheel used in a second or later workpiece before the grinding is denoted by S0. When a temporary grinding start position S0' is calculated based on ID, WD, S4 and S0, the grinding wheel is moved from the temporary grinding start position to execute the grinding, and in the vicinity of the grinding completion position S4, the grinding wheel is separated from the first workpiece by the minutes of S4, thereby fixing the actual grinding start position S0. The temporary grinding start position is set by a calculation of S0'=ID-WD-S4-Sα in consideration of an allowance amount Sα between the actual grinding start position and itself.
摘要翻译：要解决的问题：通过实现无缺陷和自动化工件的设定变化，缩短设定更改的时间，并通过完全消除缺陷产品的出现，首次尝试生产无缺陷产品。解决方案：参考用于支撑砂轮4的支撑轴6的中心位置CP，将研磨之前的第一工件2的直径表示为ID，砂轮的直径由WD表示，a 研磨后的第一工件的磨削完成位置由S4表示，并且在磨削前在第二个或更后的工件中使用的每个砂轮的实际磨削开始位置由S0表示。当基于ID，WD，S4和S0计算临时磨削开始位置S0'时，砂轮从临时磨削开始位置移动以执行研磨，并且在磨削完成位置S4附近，砂轮通过S4的分数与第一工件分离，从而固定实际研磨开始位置S0。考虑到实际研磨开始位置和其自身之间的允许量Sα，通过计算S0'= ID-WD-S4-Sα来设定临时研磨开始位置。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2005279903A Grinding tool oscillation method in internal grinding and internal grinder 有权
标题翻译：内部研磨和内部研磨的研磨工具振荡方法
公开(公告)号：JP2005279903A
公开(公告)日：2005-10-13
申请号：JP2004102119
申请日：2004-03-31
申请人： Nsk Ltd , 日本精工株式会社
发明人： NISHIDE KOJI
IPC分类号： B24B49/02 , B24B5/06
摘要： PROBLEM TO BE SOLVED: To provide a grinding tool oscillation method in internal grinding and an internal grinder capable of improving grinding efficiency while securing sizing accuracy in grinding.
SOLUTION: This grinding tool oscillation method in the internal grinding comprises a step S1 grinding the internal surface relative to a cylindrical work W while oscillating a grinding tool 2, and an in-process measuring step S2 grinding the work W while oscillating the grinding tool 2 in a stroke larger than that in a coarse grinding step, and measuring the ground surface when the grinding tool 2 is retreated from the ground surface of the work W.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供内部研磨中的研磨工具振动方法和能够在确保研磨中的施胶精度的同时提高研磨效率的内部研磨机。解决方案：内部研磨中的该研磨工具振动方法包括在振动研磨工具2的同时，相对于圆筒形工件W研磨内表面的步骤S1以及在振动时对工件W进行研磨的过程中测量步骤S2 研磨工具2的行程大于粗磨步骤中的磨削工具2，并且当研磨工具2从工件W的地面退回时测量地面。（C）2006，JPO＆NCIPI

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