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1. 发明专利

JP2005034972A Dry abrasive and dry polishing device using it 审中-公开
标题翻译：干磨和干燥抛光设备使用它
公开(公告)号：JP2005034972A
公开(公告)日：2005-02-10
申请号：JP2003276371
申请日：2003-07-18
申请人： North:Kk , 株式会社ノース
发明人： OSAWA MASAYUKI
IPC分类号： B24B29/02 , B24D3/00 , B24D11/00 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To reduce the replacement frequency without causing deterioration in polishing effect even after a long-time use in an insulating sheet layer and a protective sheet formed on the surface of a metal bump forming side of a metal foil in which a metal bump is selectively formed on one surface and an abrasive for polishing the metal bump until the top of the metal bump is exposed. SOLUTION: A mixture of abrasive powder 8 and an adhesive 10 comprising a hard powder is applied onto at least one surface of a flat base 4 having rigidity, and the dried and cured surface forms a flat abrasive layer 6. A material formed by impregnating a fabric with a resin and curing the fabric is preferably used as a base 2, and carborundum or diamond powder is preferably used as the abrasive powder 8. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使在绝缘片层和形成在金属箔的金属凸块形成侧的表面上的保护片长时间使用后，也可以降低抛光效果而不会导致更换频率的降低在一个表面上选择性地形成金属凸块和用于抛光金属凸块的研磨剂，直到暴露金属凸块的顶部。解决方案：将磨料粉末8和包含硬粉末的粘合剂10的混合物施加到具有刚性的平坦基底4的至少一个表面上，并且干燥和固化的表面形成平坦的磨料层6.形成的材料通过用树脂浸渍织物并固化织物优选用作基底2，并且优选使用金刚砂或金刚石粉末作为磨料粉8。版权所有（C）2005，JPO＆NCIPI

2. 发明专利

JP2005197582A Manufacturing method for connecting element between wiring films, and manufacturing device thereof 有权
标题翻译：用于连接接线片之间的元件的制造方法及其制造设备
公开(公告)号：JP2005197582A
公开(公告)日：2005-07-21
申请号：JP2004004215
申请日：2004-01-09
申请人： North:Kk , 株式会社ノース
发明人： OSAWA MASAYUKI
IPC分类号： B32B15/08 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent a metal bump 56 from falling down from an insulated sheet 58 brought together with a carrier sheet 52 when peeling and removing the carrier sheet 52 from a laminating member 50. SOLUTION: The carrier sheet 52 is peeled and removed in such a way that the laminating member 50 is pressed down by a press tool 72 with an anti-metal bump forming face, the end of the carrier sheet 52 is held while maintaining the state where the laminating member 50 is pressed down with the press tool 72, the front side from the edge of the press tool is peeled and removed with the carrier sheet 52, and the carrier sheet 52 is peeled and removed by making the press tool 72 draw back while applying force from the above side edge of the laminating member 50 to the opposite side edge. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了防止金属凸块56从层压构件50剥离和移除载体片52时从与载体片52一起收集的绝缘片58落下。解决方案：载体片材52被剥离和去除，使得层压构件50被具有反金属凸块形成面的压制工具72压下，承载板52的端部保持同时保持层压构件50的状态用压制工具72压下，从工具边缘边缘的前侧用载体片52剥离并移除，并且通过使压制工具72拉回而将载体片52拉出并移除，同时施加力层叠构件50的上述侧边缘到相对侧边缘。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004356661A Wiring circuit board 审中-公开
公开(公告)号：JP2004356661A
公开(公告)日：2004-12-16
申请号：JP2004273121
申请日：2004-09-21
申请人： North:Kk , 株式会社ノース
发明人： IIJIMA ASAO , OSAWA MASAYUKI
IPC分类号： H05K1/11 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To achieve cost reduction of the connection means between top and bottom conductor circuits, and further not only to make it possible to cope with the production in small quantity and large variety but also to enhance the productivity of the wiring circuit board provided with conductor circuits having patterns that differ depending on a device model and also to cope with the production in large variety and small quantity.
SOLUTION: The wiring circuit board has, as a means for connecting between top and bottom conductors, a multitude of protrusions for connecting between the top and bottom conductors 53 (57) made of metal penetrating through an interlayer insulation film 55 interposed between the metal layers, wherein the protrusions for connecting between the top and bottom conductors 53 (57) are arranged on respective intersections of the above-described lattice arrayed at constant intervals. It is feasible to raise the productivity of a large variety of products by exclusively employing specified protrusions for the interlayer connection and excluding other protrusions from composing the circuit, wherein, alternatively, unnecessary protrusions can be eliminated by etching through slight overetching.
COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2005328101A Method for producing multilayer wiring board, and metal sheet for forming wiring board 有权
标题翻译：生产多层接线板的方法和用于成型接线板的金属板
公开(公告)号：JP2005328101A
公开(公告)日：2005-11-24
申请号：JP2005233981
申请日：2005-08-12
申请人： North:Kk , 株式会社ノース
发明人： KATO YOSHIRO , OHIRA HIROSHI , OSAWA MASAYUKI , IIJIMA ASAO , KUROSAWA INATARO
IPC分类号： H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a novel multilayer wiring board, which can obtain a highly integrated multilayer wiring board, in which formation of fine vias are attained between every layers. SOLUTION: In the manufacturing method includes preparing a plurality kind of fundamental wiring boards 50α, 50γ, and 50γ having a multilayer wiring structure, in which using multilayer metal sheet; forming a wiring film on at least one surfaces of the boards; forming a wiring film or wiring film forming metal sheet on the other surfaces of the boards; conducting interlayer insulation is by an insulation film, and conducting interlayer connections by bumps made of metal; and laminating a plurality of the fundamental wiring boards 50α, 50γ, and 50γ, including different kinds of boards of the plurality of kinds of fundamental wiring boards. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种新颖的多层布线板的制造方法，其可以获得在各层之间形成微细通孔的高度集成的多层布线基板。解决方案：在制造方法中，包括制备具有多层布线结构的多种基本布线板50α，50γ和50γ，其中使用多层金属片; 在所述板的至少一个表面上形成布线膜; 在所述基板的其他表面上形成布线膜或布线膜形成金属片; 导电层间绝缘是通过绝缘膜，并由金属制成的凸块进行层间连接; 并且层叠多根基布线基板50α，50γ，50γ，其中包括多种基本布线板的不同种类的基板。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005032964A Method of manufacturing wiring circuit board 有权
标题翻译：制造电路板的方法
公开(公告)号：JP2005032964A
公开(公告)日：2005-02-03
申请号：JP2003195931
申请日：2003-07-11
申请人： North:Kk , 株式会社ノース
发明人： OSAWA MASAYUKI
IPC分类号： H01L23/32
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board in which low price protection film and cushion material formed of polypropylene or the like are used and the protection film is never peeled even during the polishing.
SOLUTION: A bump 21 for connection is formed to the effective region of a metal foil 11, and a hold bump 22 is also formed to a peripheral region surrounding the effective region in order to hold a protection sheet 50. The effective region to which the bump 21 is formed is covered with an insulating sheet 40, and this insulating sheet 40 and the peripheral region are covered with the protection film 50. When pressure is applied from above the protection film 50 via the cushion material 60, the hold bump 22 provided through the peripheral part of the protection film 50, and thereby the protection film 50 is held and fixed with the metal foil 11.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造其中使用由聚丙烯等形成的低价格保护膜和缓冲材料的布线电路板的方法，并且即使在抛光期间保护膜也不会被剥离。解决方案：用于连接的凸起21形成在金属箔11的有效区域上，并且保持凸起22也形成在围绕有效区域的周边区域，以便保持保护片50.有效区域凸起21形成的绝缘片40被绝缘片40覆盖，并且该绝缘片40和周边区域被保护膜50覆盖。当通过缓冲材料60从保护膜50的上方施加压力时，保持凸起22通过保护膜50的周边部分设置，从而保护膜50与金属箔11保持和固定。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2005026714A Wiring circuit substrate 审中-公开
标题翻译：接线电路
公开(公告)号：JP2005026714A
公开(公告)日：2005-01-27
申请号：JP2004273239
申请日：2004-09-21
申请人： North:Kk , 株式会社ノース
发明人： IIJIMA ASAO , OSAWA MASAYUKI
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To abolish generation of a voltage drop which cannot be ignored by a protrusion for connecting between upper and lower conductors for passing a large current by passing even a small current or large current through the protrusion 53 for connecting between the upper and lower conductors, generation of heating, or possibility of disturbance of improving an integration degree, by exclusively incorporating the wasteful large area of the protrusion which conducts small current by passing even small current or large current through the protrusion for connecting between relatively large upper and lower conductors.
SOLUTION: A wiring circuit board includes protrusions 53x, 53y for connecting between the upper and lower conductors having a plurality of different kinds of diameters. The protrusion through which the large current passes in response to a passing current each increases its diameter (53x), and the protrusion through which the small current passes can be reduced in the diameter (53y). Thus, the possibility of arising the problem that the voltage drop occurs due to the large current flowing through the protrusion having the small diameter, a Joule heat is generated, or a wasteful area is exclusively incorporated in the protrusion due to the large diameter because of the small current flow.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了消除由用于通过大电流的上下导体连接的突起而不能忽视的电压降的产生，通过使小电流或大电流通过突起53，用于连接上，下导体，发热或产生干扰的可能性提高一体化程度，通过仅通过使较小的电流或大电流通过突起来排放较小的电流而导致小的电流的浪费的大面积，用于连接较大的电流上下导体。解决方案：布线电路板包括用于连接具有多种不同种类的直径的上导体和下导体之间的突起53x和53y。大电流响应于通过电流而通过的突起各自增加其直径（53x），并且小电流通过的突起可以减小直径（53y）。因此，产生由于流过具有小直径的突起的大电流而产生电压下降的问题的可能性，产生焦耳热，或者由于大直径而将浪费的区域专门结合在突起中，因为电流小。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2005340306A Film processing apparatus 有权
标题翻译：电影处理设备
公开(公告)号：JP2005340306A
公开(公告)日：2005-12-08
申请号：JP2004153934
申请日：2004-05-24
申请人： Kitagawa Elaborate Mach Co Ltd , North:Kk , 北川精機株式会社 , 株式会社ノース
发明人： OKAZAKI SHIZUAKI , YUMITO RYOJI , OSAWA MASAYUKI
IPC分类号： H05K3/00 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a film processing apparatus for processing the surface of a film formed with bumps which can process the film so that heights of the bumps may be uniformed regardless of the roughness, density, and profile of the film.
SOLUTION: The film processing apparatus comprises a cylindrical roll having the film, an object to be processed pasted on the cylindrical surface thereof; a roll driving means for rotating the roll around the axis; a blade which can be arranged near the cylindrical surface of the roll so as to be brought into contact with the object to be processed; and a blade vibrating means for vibrating the blade in a direction parallel to the axis of the roll.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于处理形成有凸起的膜的表面的膜处理设备，其可以处理膜，使得凸块的高度可以均匀，而与膜的粗糙度，密度和轮廓无关。解决方案：膜处理设备包括：具有该膜的圆柱形辊，待加工物体粘贴在其圆柱形表面上; 卷轴驱动装置，用于围绕轴旋转辊; 可以布置在辊的圆柱形表面附近以与待处理物体接触的刀片; 以及用于在平行于辊的轴线的方向上使叶片振动的叶片振动装置。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005285849A Interlayer member for manufacturing multilayer wiring board and its manufacturing method 审中-公开
标题翻译：制造多层布线板的层间成员及其制造方法
公开(公告)号：JP2005285849A
公开(公告)日：2005-10-13
申请号：JP2004093693
申请日：2004-03-26
申请人： North:Kk , 株式会社ノース
发明人： OSAWA KENJI , OSAWA MASAYUKI , SHIMADA TOMOKAZU , ENDO KIMIYOSHI , IIJIMA ASAO
IPC分类号： H01L21/4763 , H01L21/48 , H01L21/60 , H01L23/50 , H05K1/11 , H05K1/16 , H05K3/40 , H05K3/42 , H05K3/46
CPC分类号： H05K3/4614 , H01L2924/0002 , H05K3/423 , H05K3/4647 , H05K2201/0355 , H05K2201/10378 , H05K2203/0384 , H05K2203/0726 , H05K2203/0733 , H05K2203/1152 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve disposition density by enhancing the accuracy of the size of an interlayer member for manufacturing a multilayer wiring board interposed between two wiring layers for ensuring interlayer insulation between the wiring layers and interlayer electrical connection. SOLUTION: A mask film 4 is formed on the principal surface of a sheet-shaped carrier layer 2, and a metal post 8 for interlayer connection is formed on the principal surface of the carrier layer 2 by plating copper with the mask film 4 used as a mask. Then, the mask 4 is removed, and an interlayer insulating layer 10 and a protective sheet 12 are stacked on the principal surface of the carrier layer 2 so as to permit it to be penetrated by the metal post 8 for interlayer connection, and the upper surface of the metal post 8 for interlayer connection is exposed beyond the interlayer insulating layer 10 and the protective sheet 12. Thereafter, the carrier layer is removed, and the protective sheet 12 is also removed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：通过提高用于制造布线在两个布线层之间的多层布线板的层间构件的尺寸的精度来提高布置层的密度，以确保布线层之间的层间绝缘和层间电连接。解决方案：在片状载体层2的主表面上形成掩模膜4，在载体层2的主表面上通过用掩模膜电镀铜形成层间连接用金属柱8 4用作面具。然后，去除掩模4，并且在载体层2的主表面上堆叠层间绝缘层10和保护片12，以允许其穿过用于层间连接的金属柱8，并且上层用于层间连接的金属柱8的表面暴露在层间绝缘层10和保护片12之外。此后，移除载体层，并且还去除保护片12。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2006080572A Wiring circuit board 有权
标题翻译：接线电路板
公开(公告)号：JP2006080572A
公开(公告)日：2006-03-23
申请号：JP2005348682
申请日：2005-12-02
申请人： North:Kk , Socketstrate Inc , ソケットストレート,インコーポレイテッド , 株式会社ノース
发明人： IIJIMA ASAO , OSAWA MASAYUKI
IPC分类号： H05K1/11
摘要： PROBLEM TO BE SOLVED: To enhance noise immunity of a wiring circuit board in which high-density mounting can be realized.
SOLUTION: A planar or mesh-shaped ground line 13b or a power source line 13a composed of a copper wiring film is formed on a surface of a substrate 2. A copper bump 5 is formed by a copper foil as the mother material on the copper wiring film that forms the ground line 13b or the power source line 13a. Another copper wiring film composed of a copper wiring film 6 and a copper foil is thermo-compression-bonded to the top face of the copper bump 5 to make the copper bump 5 an interlayer connection means between the copper wiring film 13 and the copper wiring film 6. More preferably, the top face or the surface including the top face of the metal bump 5 or the copper bump to which the copper wiring film 6 is connected by thermo-compression bonding or simply by compression bonding is roughened.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提高能够实现高密度安装的布线电路板的抗噪声性。解决方案：在基板2的表面上形成由铜布线膜构成的平面或网状接地线13b或电源线13a。铜凸块5由铜箔形成为母材在形成接地线13b或电源线13a的铜布线膜上。由铜布线膜6和铜箔构成的另一铜布线膜被热压接在铜凸块5的顶面上，以使铜凸块5成为铜布线膜13和铜布线之间的层间连接装置更优选地，包括金属凸块5的顶面或铜布线膜6通过热压接或简单地通过压接而连接的铜凸块的顶面或表面被粗糙化。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005036299A Etching system 审中-公开
标题翻译：蚀刻系统
公开(公告)号：JP2005036299A
公开(公告)日：2005-02-10
申请号：JP2003276596
申请日：2003-07-18
申请人： North:Kk , 株式会社ノース
发明人： OSAWA MASAYUKI
IPC分类号： C23F1/08
摘要： PROBLEM TO BE SOLVED: To attain uniform etching using an etching system.
SOLUTION: The position, in a direction orthogonal to a conveyance direction, of conveyance rollers 26 which are attached to a roller-supporting shaft 20 (e.g. 20b) having a direction orthogonal to a conveyance direction and being disposed at equal spaces along the conveyance direction is regulated so that it is dislocated, each by a preset amount X in a preset direction (e.g. a direction of an arrow (a)), from the position, in the direction orthogonal to the conveyance direction, of the conveyance rollers 26 of the roller-supporting shaft 20 (e.g. 20a) neighboring on the conveyance-direction side of the above roller-supporting shaft 20.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：使用蚀刻系统来获得均匀的蚀刻。
解决方案：沿与传送方向正交的方向上的传送辊26的位置，该传送辊26附接到具有与传送方向正交的方向的辊支撑轴20（例如20b）并且以相等的间隔布置传送方向被调整为使得在从传送方向正交的方向上的输送辊的位置处，在预设方向（例如，箭头（a）的方向）上以预设量X，（C）2005，JPO＆NCIPI（C）2005，JPO＆NCIPI

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