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    • 1. 发明专利
    • Coated conductor powder and conductive paste
    • 涂层导电粉和导电胶
    • JP2006196421A
    • 2006-07-27
    • JP2005009507
    • 2005-01-17
    • Noritake Co Ltd株式会社ノリタケカンパニーリミテド
    • AZEGAMI KOICHIABE NORIYUKI
    • H01B5/00B22F1/00B22F1/02H01B1/22H01G4/12
    • PROBLEM TO BE SOLVED: To provide conductive paste having superior solder resistance and coated conductor powder for constituting the paste.
      SOLUTION: Because silver particles are coated with a coating film, including both a first metal component with sintering-restraining actions and a second metal component with sintering-accelerating actions, reactivity of mutual silver particles are reduced by the first metal component, while the reactivity of the mutual silver particles are enhanced by the second metal component. Therefore, as to a conductor film formed by using such coated silver powder, its soldering resistance is enhanced by the first metal component and also, lowering of a sintering property of the coated silver powder accompanied by addition of the first metal component is moderated by the second metal component. Accordingly, the coating film can be thickened, while the sintering properties of the silver powder sufficiently are high.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供具有优异的阻焊性的导电糊料和用于构成糊料的涂覆导体粉末。 解决方案:由于银颗粒涂覆有包括具有烧结抑制作用的第一金属组分和具有烧结促进作用的第二金属组分的涂膜,所以相互银颗粒的反应性被第一金属组分降低, 而相互银颗粒的反应性被第二金属组分增强。 因此,对于通过使用这种涂覆的银粉而形成的导体膜,其耐焊接性由第一金属成分提高,并且伴随添加第一金属成分的被覆银粉的烧结性能的降低由 第二金属部件。 因此,可以增厚涂膜,同时银粉的烧结性能充分。 版权所有(C)2006,JPO&NCIPI
    • 2. 发明专利
    • Conductive paste and its use
    • 导电胶及其使用
    • JP2004139838A
    • 2004-05-13
    • JP2002303301
    • 2002-10-17
    • Noritake Co Ltd株式会社ノリタケカンパニーリミテド
    • NAGAI ATSUSHITOMITA HIDEYUKIABE NORIYUKI
    • H01B1/22H05K1/09
    • H05K1/092H01B1/22
    • PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming into a conductor pattern excellent in accuracy of form; and to provide an electronic part manufacturing method using the conductive paste.
      SOLUTION: The conductive paste includes a conductive powder (typically an Ag powder) containing a noble metal or an alloy having a noble metal as the main constituent and an organic vehicle, where the following conditions are satisfied: (1) the conductive powder constitutes 80 mass% or more of the conductive paste; (2) the mean diameter of the particle of the conductive powder is less than 0.8 μm; and (3) the ratio (D
      50 /D
      0 ) of the median D
      50 of the diameter of the particle of the conductive powder to the minimum value D
      0 detectable as the diameter of the particle is less than 5. Preferably, the ratio (V
      1rpm /V
      10rpm ) of the viscosity V
      1rpm at 1 rpm to the viscosity V
      10rpm at 10 rpm is in a rage of 2-5.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供能够形成为形式精度优异的导体图案的导电糊料; 并提供使用导电膏的电子部件制造方法。 导电浆料包含含有贵金属或贵金属作为主要成分的合金的导电粉末(通常为Ag粉末)和满足以下条件的有机载体:(1)导电性 粉末占导电膏的80质量%以上; (2)导电粉末的平均直径小于0.8μm; 和(3)导电粉末颗粒直径的中值D 50 的比例(D 50 / D 0 可以作为颗粒直径检测的最小值D 0 小于5.优选地,比率(V SB> 1rpm / SB SB / V SB> 10rpm / s) 在10rpm下,1rpm下的粘度V SB为1rpm / 10秒,粘度V SB为10rpm。 版权所有(C)2004,JPO
    • 4. 发明专利
    • PRODUCTION OF MONODISPERSIVE NOBLE METAL POWDER AND THE SAME NOBLE METAL POWDER
    • JPH083605A
    • 1996-01-09
    • JP22270394
    • 1994-08-25
    • NORITAKE CO LTD
    • FUKUDA YOICHIFUKUI YASUTAKAABE NORIYUKITAKIMOTO AKIONAGAO AKIHIRO
    • B22F9/24B22F1/00
    • PURPOSE:To produce globular monodispersive noble metal powder having an approximately certain particle size by adding a reducing agent-contg. aq. soln. to a noble metal salt-contg. aq. soln. in which a dispersing agent is previously added to any of the same, precipitating noble metal powder and furthermore adding a dispersing agent thereto, CONSTITUTION:A reducing agent-contg. aq. soln. is added to a noble metal salt-contg. aq. soln. to precipitate noble metal powder by reduction. At this time, a dispersing agent is previously added to any one of the aq. solns. Furthermore, both aq. solns. are mixed, and moreover, after the precipitation of the noble metal powder and before the generation of the secondary aggregation of the particles, a dispersing agent is furthermore added thereto. In the primary addition of the dispersing agent, it is used by the amt. in the minimum range in which globular particles having an optional size are uniformly precipitated, and for this purpose, dextran, triethanolamine, gelatin, glycerol or the like are suitably used. Moreover, in the secondary addition of the dispersing agent, it is used by the minimum amt. in which secondary aggregation preventing effect is shown or above, and gelatin or the like are suitably used. Furthermore, (NH4)2CO3, NH4HCO3, dry ice, liq. N2 or the like generating gas in the reactive solns. immediately before or after the same are preferably added thereto.