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1. 发明专利

JP2009037008A Resin composition for color filter protective film and color filter 有权
标题翻译：用于彩色滤光片保护膜和彩色滤光片的树脂组合物
公开(公告)号：JP2009037008A
公开(公告)日：2009-02-19
申请号：JP2007201375
申请日：2007-08-01
申请人： Nof Corp , 日油株式会社
发明人： GOTO TAKAMICHI , FUJIMURA TOSHINOBU , NAKAJIMA KIWA , SATO HIROSHI , TAGUCHI HIROYUKI , SAITO TAKASHI
IPC分类号： G02B5/20 , C08F20/26 , C08G59/42 , C08G63/42 , G02F1/1333 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a color filter protective film having excellent barrier property, liquid crystal staining property and chemical resistance, and a color filter having excellent protective film properties. SOLUTION: The resin composition for the color filter protective film comprises (A) a hemiacetal ester compound represented by formula (1) (wherein R 1 is a 3-30C alkyl group, a cycloalkyl group, an aryl group or an isocyanuric trialkyl group; n is an integer of 2-8; m is an integer of 1-4; R 2 is a 1-4C alkylene group; and R 3 is a hydrogen atom or a methyl group) and (B) a compound having two or more epoxy groups or oxetanyl groups per molecule, wherein the mol equivalent ratio of hemiacetal ester groups which the component (A) has to the epoxy groups or oxetanyl groups which the component (B) has, [(A)/(B)] is 2/10 to 50/10. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供具有优异的阻隔性，液晶染色性和耐化学性的滤色器保护膜用树脂组合物和具有优异保护膜性能的滤色器。＆lt; P＆gt;解决方案：滤色器保护膜用树脂组合物包含（A）由式（1）表示的半缩醛酯化合物（其中R 1 为3-30C烷基，环烷基，芳基或异氰脲酸三烷基; n是2-8的整数; m是1-4的整数; R 2是一个1-4C的亚烷基; R“SP” 3是氢原子或甲基）和（B）每分子具有两个以上环氧基或氧杂环丁烷基的化合物，其中，（A）成分的半缩醛酯基的摩尔当量比与组分（B）具有的[（A）/（B）]的环氧基或氧杂环丁烷基为2/10〜50/10。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008273876A Method for producing 1,2,3,4-cyclobutane tetracarboxylic acid 有权
标题翻译：生产1,2,3,4-环己基四羧酸的方法
公开(公告)号：JP2008273876A
公开(公告)日：2008-11-13
申请号：JP2007119588
申请日：2007-04-27
申请人： Nof Corp , 日油株式会社
发明人： SAITO TAKASHI , NISHIMURA NAOYA
IPC分类号： C07C51/09 , C07C61/04
摘要： PROBLEM TO BE SOLVED: To provide a method for producing 1,2,3,4-cyclobutane tetracarboxylic acid in a high yield, with an easy production process, while dramatically reducing industrial waste materials.
SOLUTION: This method of production comprises the following processes I to III. The method for producing the 1,2,3,4-cyclobutane tetracarboxylic acid is characterized by performing the following processes I to III. The process I: a process of obtaining a maleic acid dihemiacetal ester by protecting with an α-unsaturated ether. The process II: a process of obtaining 1,2,3,4-cyclobutane tetracarboxylic acid tetrahemiacetal ester by the photocyclization dimerization of the maleic acid dihemiacetal ester obtained in the process I. The process III: a process of obtaining 1,2,3,4-cyclobutane tetracarboxylic acid by deprotecting the α-unsaturated ether from the 1,2,3,4-cyclobutane tetracarboxylic acid tetrahemiacetal ester obtained in the process II.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：待解决的问题：提供一种以高产率制备1,2,3,4-环丁烷四羧酸的方法，其制备方法简单，同时显着减少工业废料。
解决方案：该生产方法包括以下步骤I至III。制备1,2,3,4-环丁烷四羧酸的方法的特征在于进行以下方法I至III。方法I：通过用α-不饱和醚保护获得马来酸二缩水甘油酯的方法。方法II：通过在方法I中获得的马来酸二缩水甘油酯的光环化二聚获得1,2,3,4-环丁烷四羧酸四缩水甘油酯的方法。方法III：获得1,2,3 ，4-环丁烷四羧酸，由方法II中得到的1,2,3,4-环丁烷四羧酸四缩水甘油酯脱保护α-不饱和醚。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2008101134A Resin composition for sealing optical semiconductor 审中-公开
标题翻译：用于密封光学半导体的树脂组合物
公开(公告)号：JP2008101134A
公开(公告)日：2008-05-01
申请号：JP2006285303
申请日：2006-10-19
申请人： Nof Corp , 日油株式会社
发明人： SAITO TAKASHI , NISHIMURA NAOYA
IPC分类号： C08G59/40 , C08G59/20
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for the sealing of an optical semiconductor, having high reliability, developing little discoloration under the light irradiation at a high temperature and high energy radiation (light resistance to the light of short wavelength range), having excellent resistance to heat generated by light emission (heat-resistance), giving a cured product having sufficiently satisfiable void-free nature and moisture-resistant reliability and having excellent storage stability of the composition. SOLUTION: The resin composition for the sealing of an optical semiconductor is composed of the following components (A) and (B) and has a (hemiacetal group)/(epoxy group) equivalent ratio N A /N B of 0.2-2.0. The component A is a curing agent produced by the addition reaction of (a1) a 1,2,3,4-cyclobutanetetracarboxylic acid compound with (a2) a 2,3-dihydrofuran compound and the component B is a base resin composed of (b1) an epoxy resin having a cyclohexane ring skeleton and (b2) an epoxy-modified silicone resin, wherein the weight ratio of the component (b1) to the component (b2) is 50/50 to 90/10. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于密封光学半导体的树脂组合物，具有高可靠性，在高温和高能量辐射（对短波长范围的光的耐光性）下在光照射下几乎不发生变色），具有优异的耐发光性（耐热性）的耐热性，得到具有充分满足无空隙性和耐湿可靠性的固化物，并具有优异的组合物保存稳定性。解决方案：用于密封光学半导体的树脂组合物由以下组分（A）和（B）组成，并且具有（半缩醛基）/（环氧基）当量比N A / N B 为0.2-2.0。组分A是通过（a1）1,2,3,4-环丁烷四羧酸化合物与（a2）2,3-二氢呋喃化合物的加成反应制备的固化剂，组分B是由（ b1）具有环己烷环骨架的环氧树脂和（b2）环氧改性的有机硅树脂，其中组分（b1）与组分（b2）的重量比为50/50至90/10。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2008100949A Hemiacetal ester compound, thermosetting composition, and cured product 有权
标题翻译： HEMAACETAL ESTER化合物，热固化组合物和固化产品
公开(公告)号：JP2008100949A
公开(公告)日：2008-05-01
申请号：JP2006285305
申请日：2006-10-19
申请人： Nof Corp , 日油株式会社
发明人： SAITO TAKASHI , NISHIMURA NAOYA
IPC分类号： C07C69/74 , C07D307/20 , C07D309/12 , C08G59/40
摘要： PROBLEM TO BE SOLVED: To provide a hemiacetal ester compound suffering little from discoloration under high-temperature high-energy irradiation conditions (resistance to light in a short-wavelength region) and being excellent in resistance to heat generated upon e.g., emission (heat resistance) and a thermosetting composition containing the same and to provide a photosemiconductor encapsulating resin composition having excellent curability, being colorless and transparent, suffering little from discoloration under high-temperature and high-energy irradiation conditions, and being excellent in properties such storage stability in the form a resin composition.
SOLUTION: Provided are a hemiacetal compound obtained by the addition reaction between a 1,2,3,4-cyclobutanetetracarboxylic acid derivative and a monovinyl ether compound or an unsaturated cycloether compound; a thermosetting composition essentially consisting of the hemiacetal compound and a cyclohexane-skeleton epoxy resin; and a photosemiconductor encapsulating resin composition.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供在高温高能辐照条件（耐短波区域的耐光性）下几乎不变色的半缩醛酯化合物，并且例如在发射时产生的耐热性优异（耐热性）和含有该组合物的热固性组合物，并提供具有优异固化性的光半导体封装树脂组合物，其无色透明，在高温高能辐射条件下几乎不变色，并且具有优异的储存性树脂组合物形式的稳定性。解决方案：提供通过1,2,3,4-环丁烷四羧酸衍生物与单乙烯基醚化合物或不饱和环醚化合物之间的加成反应获得的半缩醛化合物; 基本上由半缩醛化合物和环己烷骨架环氧树脂组成的热固性组合物; 和光半导体封装树脂组合物。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2008101137A Epoxy resin composition for sealing optical semiconductor 审中-公开
标题翻译：用于密封光学半导体的环氧树脂组合物
公开(公告)号：JP2008101137A
公开(公告)日：2008-05-01
申请号：JP2006285308
申请日：2006-10-19
申请人： Nof Corp , 日油株式会社
发明人： NISHIMURA NAOYA , SAITO TAKASHI
IPC分类号： C08G59/42 , H01L33/56
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor which can be formed into a thick film, is superior in storage stability, causes no change in composition ratio during hardening and shows superior physical properties; and an optical semiconductor device formed by using the epoxy resin composition as a sealing agent and superior in crack resistance. SOLUTION: The epoxy resin composition for sealing optical semiconductor comprises a component (A); a hardening agent obtained by addition reaction of cyclohexanecarboxylic acid compound (a1) and 2,3-dihydrofuran compound or 3,4 dihydro-2H-pyran compound, and a component (B); an epoxy resin having a cyclohexane ring skeleton. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决问题：提供一种用于密封可形成厚膜的光学半导体的环氧树脂组合物，其储存稳定性优异，在硬化期间组成比率不变化，并且具有优异的物理性能; 以及通过使用环氧树脂组合物作为密封剂形成并且具有优异的抗裂性的光学半导体器件。
解决方案：用于密封光学半导体的环氧树脂组合物包含组分（A）; 通过环己烷羧酸化合物（a1）和2,3-二氢呋喃化合物或3,4-二氢-2H-吡喃化合物与成分（B）的加成反应获得的硬化剂; 具有环己烷环骨架的环氧树脂。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2008274125A Optical semiconductor sealing thermosetting resin composition 审中-公开
标题翻译：光学半导体密封热固性树脂组合物
公开(公告)号：JP2008274125A
公开(公告)日：2008-11-13
申请号：JP2007119587
申请日：2007-04-27
申请人： Nof Corp , 日油株式会社
发明人： NISHIMURA NAOYA , SAITO TAKASHI
IPC分类号： C08G59/20 , C08G59/42 , H01L23/29 , H01L23/31 , H01L33/56
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor sealing thermosetting resin composition which can be used in sealing a light-emitting device having high output at a short wavelength demanded in recent years, is free from surface tack of a cured product, and excels in light resistance, thermal yellowing resistance, and thermal shock resistant reliability. SOLUTION: The optical semiconductor sealing thermosetting resin composition comprises 10-60 wt.% of (A) an epoxy group-containing polysiloxane having two or more epoxy groups and 90-40 wt.% of (B) a carboxy group-containing polysiloxane having two or more carboxyl groups. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种光密封型热固性树脂组合物，其可用于密封近年来要求的短波长输出的高发光装置，无需固化产物的表面粘着，并具有耐光性，耐热黄变性和耐热冲击性的可靠性。解决方案：光学半导体密封热固性树脂组合物包含10-60重量％的（A）具有两个或更多个环氧基的含环氧基的聚硅氧烷和90-40重量％的（B）羧基 - 含有两个以上羧基的聚硅氧烷。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008101135A Resin composition for sealing optical semiconductor 审中-公开
标题翻译：用于密封光学半导体的树脂组合物
公开(公告)号：JP2008101135A
公开(公告)日：2008-05-01
申请号：JP2006285306
申请日：2006-10-19
申请人： Nof Corp , 日油株式会社
发明人： SAITO TAKASHI , NISHIMURA NAOYA
IPC分类号： C08G59/42 , H01L31/02 , H01L33/56
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for the sealing of an optical semiconductor, developing little discoloration under the light irradiation at a high temperature and high energy radiation (light resistance to the light of short wavelength range), having excellent resistance to heat generated by light emission (heat-resistance), and having sufficiently satisfiable moisture-resistant reliability. SOLUTION: The resin composition for the sealing of an optical semiconductor contains the following components (A) and (B). The component A is one or more kinds of cyclobutane carboxylic acid compound selected from (a0) a 1,2,3,4-cyclobutane tetracarboxylic acid which may have a 1-3C alkyl group on the cyclobutane ring, (a1) the monoanhydride of the above carboxylic acid and (a2) the dianhydride of the above carboxylic acid, and the component B is an epoxy resin having a cyclohexane ring skeleton. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于密封光学半导体的树脂组合物，在高温和高能量辐射（对短波长范围的光的耐光性）的光照射下几乎不发生变色，具有优异的耐发光（耐热）产生的热，并且具有足够可靠的耐湿可靠性。解决方案：用于密封光学半导体的树脂组合物包含以下组分（A）和（B）。组分A是选自（a0）在环丁烷环上可以具有1-3C烷基的1,2,3,4-环丁烷四羧酸的一种或多种环丁烷羧酸化合物，（a1）上述羧酸和（a2）上述羧酸的二酐，组分B是具有环己烷环骨架的环氧树脂。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2008100262A Flux composition for soldering, and solder paste 有权
标题翻译：用于焊接的焊剂组合物和焊膏
公开(公告)号：JP2008100262A
公开(公告)日：2008-05-01
申请号：JP2006285304
申请日：2006-10-19
申请人： Nof Corp , 日油株式会社
发明人： SAITO TAKASHI , NISHIMURA NAOYA
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a flux composition for soldering and a solder paste, which are excellent in soldering wettability, suppress the generation of voids in a soldered part, and are excellent in joint reliability and electric reliability.
SOLUTION: The flux composition for soldering contains A: a resin that is obtained by bringing a polyhydric alcohol (a1) and a cyclic acid anhydride (a2) having a six-membered carbocyclic ring structure into a ring-opening half esterification reaction, and B: a silicon compound expressed by the formula (1). In the formula (1), r is 2 or 3, and X is a radical group, which is selected from a hydrogen atom, a bromine atom, a chlorine atom, and hydroxy groups and may be identical to or different from each other.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供焊接润湿性优异的钎焊用焊剂组合物和焊膏，抑制焊接部分中的空隙的产生，并且接合可靠性和电可靠性优异。＆lt; P＆gt;解决方案：用于焊接的焊剂组合物包含A：将具有六元碳环结构的多元醇（a1）和环状酸酐（a2）引入开环半酯化反应中获得的树脂，B：由式（1）表示的硅化合物。式（1）中，r为2或3，X为选自氢原子，溴原子，氯原子和羟基的自由基，可以相同也可以不同。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2008083420A Thermosetting resin composition for color filter protective film and color filter using same 有权
标题翻译：用于彩色滤光片保护膜和彩色滤光片的热固性树脂组合物
公开(公告)号：JP2008083420A
公开(公告)日：2008-04-10
申请号：JP2006263636
申请日：2006-09-27
申请人： Nof Corp , 日油株式会社
发明人： TAMURA MIEKO , FUJIMURA TOSHINOBU , NAKAJIMA KIWA , NISHIWAKI YUJIRO , SAITO TAKASHI
IPC分类号： G02B5/20 , C08G59/42 , G02F1/1335
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for a color filter protective film, the composition having excellent curing property and basic performances such as heat resistance and solvent resistance of a layer of the cured resin, and further having excellent transparency and hardness. SOLUTION: The resin composition for a color filter protective film comprises the following components (A), (B) and (C). They are: (A) an epoxy group-containing polymer polymerized by using monomers containing an ethylenic unsaturated bond and an epoxy group: (B) a polyfunctional epoxy resin selected from a group consisting of bisphenol-A or novolac epoxy resin or nuclear hydrogenated compound of the epoxy resin; and (C) a cyclobutanetetracarboxylic acid hemiacetal ester compound obtained by addition reaction of a 1,2,3,4-cyclobutanetetracarboxylic acid compound (c01) which may have a 1-3C alkyl group on a cyclobutane ring and a vinylether compound (c11) or a unsaturated cyclic ether compound (c12). COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种滤色器保护膜用树脂组合物，该组合物具有优异的固化性和固化树脂层的耐热性和耐溶剂性的基本性能，并且还具有优异的透明性和硬度。＆lt; P＆gt;解决方案：滤色器保护膜用树脂组合物包含以下成分（A），（B）和（C）。它们是：（A）通过使用含有烯属不饱和键和环氧基的单体聚合的含环氧基的聚合物：（B）选自双酚A或酚醛环氧树脂或核氢化化合物的多官能环氧树脂的环氧树脂; 和（C）通过在环丁烷环上具有1-3C烷基的1,2,3,4-环丁烷四羧酸化合物（c01）和乙烯基醚化合物（c11）的加成反应获得的环丁烷四羧酸半缩醛化合物化合物，或不饱和环醚化合物（c12）。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007246553A Resin composition for sealing semiconductor 审中-公开
标题翻译：用于密封半导体的树脂组合物
公开(公告)号：JP2007246553A
公开(公告)日：2007-09-27
申请号：JP2006067809
申请日：2006-03-13
申请人： Nof Corp , 日本油脂株式会社
发明人： SAITO TAKASHI , NISHIMURA NAOYA , KATAOKA SHINGO
IPC分类号： C08L67/07 , C08G63/676 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor, exhibiting an excellent flux effect for an oxide film on the surface of a metal such as a bump electrode and substrate plate electrode, capable of repairing a part after reflow, and further capable of preventing the generation of inferiority on sealing characteristics such as the generation of crack by thermal distortion stress, peeling, etc., since actually cured resin cured material by after curing has an excellent mechanical characteristics.
SOLUTION: This resin composition for sealing the semiconductor contains the following components (A) and (B) by 35 to 75 wt.% (A) and 25 to 65 wt.% (B). (A) an aromatic branched polyhemiacetal ester condensate having 1,500 to 100,000 weight-average molecular weight obtained by performing the addition reaction of a divinylether compound to a mixture obtained by mixing (a1) an aromatic dicarboxylic acid compound with (a2) an aromatic tricarboxylic acid by (a1:a2)=(70:30) to (95:5) ratio. (B) an epoxy resin (b1) or an oxetane resin (b2).
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题的方案为了提供一种用于密封半导体的树脂组合物，在诸如凸块电极和基板平板电极的金属的表面上对氧化膜表现出优异的磁通效应，能够在回流之后修复零件并且由于固化后的固化树脂固化物具有优异的机械特性，因此能够防止由热变形应力，剥离等产生裂纹等密封特性的劣化。解决方案：用于密封半导体的树脂组合物含有35至75重量％（A）和25至65重量％（B）的下列组分（A）和（B）。（A）通过将二乙烯基醚化合物与通过将（a1）芳香族三羧酸（a1）和（a2）芳族二羧酸化合物（a1）混合得到的混合物进行加成反应而得到的具有1500〜100000重均分子量的芳香族支链聚缩醛缩合物（a1：a2）=（70:30）〜（95:5）的比例。（B）环氧树脂（b1）或氧杂环丁烷树脂（b2）。版权所有（C）2007，JPO＆INPIT

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