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1. 发明专利

JP2003040941A Crosslinked polymer, contact lens and their production methods 有权
标题翻译：交联聚合物，接触透镜及其生产方法
公开(公告)号：JP2003040941A
公开(公告)日：2003-02-13
申请号：JP2001227079
申请日：2001-07-27
申请人： Nof Corp , 日本油脂株式会社
发明人： SHIINO TAIJIRO , NAKAZATO KATSUMI
IPC分类号： G02C7/04 , C08F218/14 , C08F220/00 , C08F226/02 , C08F230/02 , G02B1/04
摘要： PROBLEM TO BE SOLVED: To provide a crosslinked polymer obtained from a fumaric acid derivative having a phosphorylcholine-analogous group and other types of monomers, a contact lens obtained through the same process of the crosslinked polymer and having a high water content ratio suppressing adhesion and deposition of stained proteins and lipids, and to provide a method for producing the crosslinked polymer. SOLUTION: The crosslinked polymer is obtained by polymerizing a monomer composition containing each specified amount of a fumaric acid derivative having a phosphorylcholine-analogous group (A), a monomer having a carboxy or amide group (B), a dicarboxylic acid divinyl or diallyl compound (C) and further 5-40 wt.% of added water based on 100 wt.% of the total amount of the mixed monomers, and is characterized by having content ratio of the monomer (A) of >=15-45 wt.% at the dried state, water content ratio of >=50-80 wt.% at the swelled state and the tensile strength of >=50 gf/mm .
摘要翻译：要解决的问题：提供由具有磷酸胆碱类似基团的其它类型的单体的富马酸衍生物获得的交联聚合物，通过相同的交联聚合物的方法获得并具有高的含水率抑制粘合的隐形眼镜沉积染色的蛋白质和脂质，并提供生产交联聚合物的方法。解决方案：交联聚合物通过聚合含有每个指定量的具有磷酰胆碱类似基团（A）的富马酸衍生物，具有羧基或酰胺基的单体（B），二羧酸二乙烯基或二烯丙基化合物（C）和另外5-40重量％的加入水，基于混合单体总量的100重量％，其特征在于，单体（A）的含量比≥15-45重量％在干燥状态下的％，在膨胀状态下的含水比> 50-80重量％，拉伸强度> 50gf / mm 2。

2. 发明专利

JP2005152912A Composition of flux for soldering, soldering paste, and soldering method 有权
标题翻译：用于焊接，焊接和焊接方法的焊剂的组成
公开(公告)号：JP2005152912A
公开(公告)日：2005-06-16
申请号：JP2003392093
申请日：2003-11-21
申请人： Nof Corp , 日本油脂株式会社
发明人： SAITO TAKASHI , NAKAZATO KATSUMI , KATO YUKIHIRO
IPC分类号： B23K35/363 , B23K35/22 , C08G63/672 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a flux for soldering and a paste of high reliability which do not impair soldering property, reduce the occurrence of cracking and deterioration in the flux residues remaining on a printed circuit board even when the flux residues are subjected to a temperature change after soldering, and which do not give rise to an insulation defect and migration even under a high-temperature and high-humidity environment. SOLUTION: The flux composition for soldering containing compound with one or more carboxylic groups and oxcetane groups which are made latent in one molecule and the paste compounded with the same resin and solder powder are provided. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供不会损害焊接性能的高可靠性焊剂和糊剂，减少残留在印刷电路板上的焊剂残留物的开裂和劣化，即使焊剂残留物为在焊接后经历温度变化，即使在高温高湿环境下也不会引起绝缘缺陷和迁移。解决方案：提供用于焊接的助焊剂组合物，其含有一个或多个在一个分子中潜伏的羧基和氧代十八烷基的化合物和与相同的树脂和焊料粉末复合的浆料。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2006167802A Solder paste 审中-公开
标题翻译：焊膏
公开(公告)号：JP2006167802A
公开(公告)日：2006-06-29
申请号：JP2005095962
申请日：2005-03-29
申请人： Nof Corp , 日本油脂株式会社
发明人： SAITO TAKASHI , NISHIMURA NAOYA , NAKAZATO KATSUMI , KATO YUKIHIRO
IPC分类号： B23K35/22 , B23K35/26 , B23K35/363 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide solder paste in which the wettability of solder is excellent, and the generation of voids or the dimensions of voids in the joints of the solder can be suppressed.
SOLUTION: The soldering paste is composed of 5 to 20 wt.% flux (F) comprising a carboxylic acid derivative (A) obtained by bringing hydroxyl groups in a compound (a1) having the hydroxyl groups by two or more in one molecule into ring-opening half esterification reaction with a cyclic acid anhydride (a2) having a carbon six-membered ring structure, and 80 to 95 wt.% solder powder (M).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供其中焊料的润湿性优异的焊膏，并且可以抑制焊料的接合中的空隙的产生或空隙的尺寸。解决方案：焊膏由5〜20重量％的通量（F）组成，该通量（F）包含通过将羟基的化合物（a1）中的羟基在两个或多个上形成羟基而得到的羧酸衍生物（A）分子与具有碳六元环结构的环状酸酐（a2）和80〜95重量％的焊料粉末（M）进行开环半酯化反应。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005075892A Thermosetting composition 有权
标题翻译：热成分
公开(公告)号：JP2005075892A
公开(公告)日：2005-03-24
申请号：JP2003306485
申请日：2003-08-29
申请人： Nof Corp , 日本油脂株式会社
发明人： SAITO TAKASHI , SATO ATSUSHI , NAKAZATO KATSUMI , KATO YUKIHIRO , NISHIMURA NAOYA
IPC分类号： C08G65/26 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting composition that provides a cured material having excellent chemical performance, mechanical properties, particularly toughness (persistence) and weather resistance at a relatively low temperature and has improved storage stability and is usable as a one pack type having low viscosity and a high solid content.
SOLUTION: The thermosetting composition comprises a compound (A) obtained by reacting a compound (a1) containing two or more carboxy groups in one molecule with a compound (a2) containing two or more vinyl(thio) ether groups in one molecule and a compound (B) containing two or more oxetane groups in one molecule.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：待解决的问题：为了获得提供在较低温度下具有优异的化学性能，机械性能，特别是韧性（持久性）和耐候性的固化材料并具有改善的储存稳定性并可用作一种的热固性组合物包装型具有低粘度和高固含量。解决方案：热固性组合物包含通过一分子中含有两个或多个羧基的化合物（a1）与在一个分子中含有两个或更多个乙烯基（硫代）醚基团的化合物（a2））反应获得的化合物（A）和在一个分子中含有两个或多个氧杂环丁烷基团的化合物（B）。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004291019A Flux composition for soldering, soldering paste and soldering method 审中-公开
公开(公告)号：JP2004291019A
公开(公告)日：2004-10-21
申请号：JP2003086590
申请日：2003-03-26
申请人： Nof Corp , 日本油脂株式会社
发明人： SAITO TAKASHI , NAKAZATO KATSUMI , KATO HIROYUKI , SATO ATSUSHI
IPC分类号： B23K3/00 , B23K35/26 , B23K35/363 , B23K101/42 , C22C13/00 , C22C13/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a flux composition for soldering which has satisfactory preservation stability, is excellent in wettability of solder, and has satisfactory wettability with a component lead subjected to plating treatment, and to provide solder paste. SOLUTION: The flux composition for soldering comprises (A) a compound having one or more carboxy groups made latent in one molecule, and (B) a nonionic organic halide. Preferably, it is the flux composition for soldering described in the claim 1 in which the compound (A) having one or more carboxy groups made latent in one molecule of the component is a compound obtained by the reaction between a compound having one or more carboxy groups in one molecule and a compound having one or more vinyl ether groups in one molecule. COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2004002781A Polyhemiacetal ester resin 审中-公开
公开(公告)号：JP2004002781A
公开(公告)日：2004-01-08
申请号：JP2003097390
申请日：2003-03-31
申请人： Nof Corp , 日本油脂株式会社
发明人： NAKAZATO KATSUMI , SAITO TAKASHI , NAKADA ISAO , KATO YUKIHIRO
IPC分类号： C08G63/00
摘要： PROBLEM TO BE SOLVED: To provide a novel polyhemiacetal ester resin suitable for water-washing flux or the like.
SOLUTION: The polyhemiacetal ester resin is a resin having a molecular weight of 500-100,000 obtained by reacting one or more of acid anhydride selected from the group consisting of the acid anhydride such as succinic anhydride, maleic anhydride or the like with a polyhydric alcohol having two or more of hydroxyl groups selected from the group consisting of ethylene glycol, diethylene glycol, trimethylol propane and an ethylene oxide additive of these polyhydric alcohols to obtain a half ester of carboxylic acid and addition-polymerizing remaining carboxylic acid with one or more of divinyl ether selected from the group consisting of divinyl ethers such as ethylene glycol divinyl ether, polyethylene glycol divinyl ether, propylene glycol divinyl ether and polypropylene glycol divinyl ether.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2004202518A Flux composition for soldering, solder paste, and method for soldering 审中-公开
标题翻译：用于焊接的焊剂组合物，焊膏和焊接方法
公开(公告)号：JP2004202518A
公开(公告)日：2004-07-22
申请号：JP2002372269
申请日：2002-12-24
申请人： Nof Corp , 日本油脂株式会社
发明人： SAITO TAKASHI , NAKAZATO KATSUMI , KATO YUKIHIRO
IPC分类号： B23K35/363 , B23K35/26 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a flux composition which exhibit high solder-wettability, have excellent electric reliability after joining, and further have good storage stability, and a solder paste.
SOLUTION: A flux composition for soldering that contains a carboxylic acid amine salt or a carboxylic acid anhydride is made to contain an oxetane compound. A solder paste is made to contain the resultant flux composition for soldering and powdery solder. Soldering is conducted using the resultant solder paste.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有高焊料润湿性的焊剂组合物，在接合后具有优异的电可靠性，并且还具有良好的储存稳定性和焊膏。解决方案：制备含有羧酸胺盐或羧酸酐的用于焊接的焊剂组合物以含有氧杂环丁烷化合物。制成焊膏以容纳所得的用于焊接的焊剂组合物和粉末状焊料。使用所得到的焊膏进行焊接。版权所有（C）2004，JPO＆NCIPI

8. 发明专利

JP2004083670A Polyhemiacetal ester resin and method for producing the same 审中-公开
标题翻译：聚酯酯树脂及其制造方法
公开(公告)号：JP2004083670A
公开(公告)日：2004-03-18
申请号：JP2002244321
申请日：2002-08-23
申请人： Nof Corp , 日本油脂株式会社
发明人： NAKAZATO KATSUMI , SAITO TAKASHI , KATO YUKIHIRO , NAKADA ISAO
IPC分类号： C07C67/04 , C07C69/67 , C07C319/20 , C07C323/12 , C08G63/676 , C08G63/688
摘要： PROBLEM TO BE SOLVED: To obtain a new polyhemiacetal ester resin suitable as a flux for lead-free solder and an activator in a solder paste, especially a zinc-based solder paste and to provide a method for producing the same.
SOLUTION: The polyhemiacetal ester resin comprises at least ≥50 wt.% of a constituent unit represented by formula (1) (R
1 is a bifunctional 1-50C hydrocarbon group; X is an oxygen atom or a sulfur atom) in the molecule. The method for producing the polyhemiacetal ester resin comprises reacting 2, 4-diethylglutaric acid with a divinyl ether compound and/or a divinyl thioether compound.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：获得适合作为无铅焊料助焊剂和焊膏，特别是锌基焊膏中的活化剂的新型聚缩醛树脂，并提供其制造方法。解决方案：聚缩醛树脂包含至少≥50重量％的由式（1）表示的结构单元（R 1 是双官能1-50℃烃基; X是氧原子或硫原子）。制造聚缩醛酯树脂的方法包括使2,4-二乙基戊二酸与二乙烯基醚化合物和/或二乙烯基硫醚化合物反应。版权所有（C）2004，JPO

9. 发明专利

JP2004058104A Soldering flux and soldering paste 审中-公开
标题翻译：焊接焊剂和焊膏
公开(公告)号：JP2004058104A
公开(公告)日：2004-02-26
申请号：JP2002220378
申请日：2002-07-29
申请人： Nof Corp , 日本油脂株式会社
发明人： NAKAZATO KATSUMI , SAITO TAKASHI , KATO YUKIHIRO , NAKADA ISAO
IPC分类号： B23K35/363 , B23K35/22 , B23K35/26 , C22C13/00
摘要： PROBLEM TO BE SOLVED: To provide zinc-based flux and solder paste in which the activity is high in spite of non-halogen, any secular changes hardly occur, and solderability is excellent even during the reflow soldering in the atmosphere.
SOLUTION: The soldering flux contains 2, 4-diethyl glutaric acid. The solder paste contains the soldering flux and solder powder. The solder paste contains lead-free solder alloy powder. The solder paste contains Sn-Zn solder alloy. In the soldering method using the lead-free solder alloy, the above soldering flux is used. In the soldering method, the above solder paste is used for the soldering.
COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2003292580A Epoxy resin composition for sealing semiconductor 审中-公开
标题翻译：用于密封半导体的环氧树脂组合物
公开(公告)号：JP2003292580A
公开(公告)日：2003-10-15
申请号：JP2002097484
申请日：2002-03-29
申请人： Nof Corp , 日本油脂株式会社
发明人： KATO YUKIHIRO , NAKADA ISAO , NAKAZATO KATSUMI , SAITO TAKASHI
IPC分类号： C08G59/62
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor having a low viscosity at low temperatures, i.e., increasing the filling ratio of a filler, having excellent storage stability and affording a cured product thereof having good physical properties. SOLUTION: The phenol resin composition consists essentially of (A) a phenol resin derivative prepared by modifying hydroxy groups of a phenol resin into functional groups represented by formula (1) (wherein, R 1 , R 2 and R 3 are each a hydrogen atom or a 1-18C organic group, R 3 and R 4 may mutually be bonded; Y, together with a heteroatom, may form a heterocyclic ring; and Y is an oxygen atom or a sulfur atom), (B) an epoxy resin, (C) a curing accelerator and (D) an inorganic filler. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种用于密封低温粘度低的半导体的环氧树脂组合物，即增加填料的填充率，具有优良的储存稳定性并提供具有良好物理性能的固化产物。解决方案：酚醛树脂组合物基本上由（A）通过将酚醛树脂的羟基改性为由式（1）表示的官能团制备的酚醛树脂衍生物（其中，R 1， R 2 和R 3 分别为氢原子或1-18C有机基团，R 3 和R 4

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