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1. 发明专利

JP2006160560A Spherical sintered ferrite particle and resin composition for semiconductor sealing using the same, and semiconductor unit obtained by using the resin composition 有权
标题翻译：用于使用其的半导体密封的球形烧结颗粒和树脂组合物以及使用树脂组合物获得的半导体单元
公开(公告)号：JP2006160560A
公开(公告)日：2006-06-22
申请号：JP2004353990
申请日：2004-12-07
申请人： Nitto Denko Corp , Sony Corp , ソニー株式会社 , 日東電工株式会社
发明人： YAMAMOTO KAZUMI , ABE MASAHARU , YAMAMOTO SHIGEHISA , NISHIMOTO KAZUSHI , TSUCHIDE TOMOHIRO , IGARASHI KAZUMASA , IKEMURA KAZUHIRO , ETO TAKUYA , TADA MASATAKA , OKAYAMA KATSUMI , KOBAYASHI KAORU
IPC分类号： C01G49/00 , C01G53/00 , C08K3/22 , C08K3/36 , C08L61/00 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L23/295 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing whose cured material has an effective electromagnetic wave shielding function and shows good moldability.
SOLUTION: This resin composition for semiconductor sealing contains a spherical sintered ferrite particle having the following characteristics (a)-(c); it contains not greater than 5 ppm soluble ions (a), its particle diameter is in the range of 10-50 μm (b), and its crystal structure by X-ray diffraction shows a spinel structure (c).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于半导体密封的树脂组合物，其固化材料具有有效的电磁波屏蔽功能并且显示出良好的成型性。解决方案：该半导体密封用树脂组合物含有具有以下特征（a） - （c）的球状烧结铁氧体颗粒。它含有不大于5ppm的可溶性离子（a），其粒径在10-50μm（b）的范围内，其X射线衍射的晶体结构显示尖晶石结构（c）。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2009270000A Semiconductor-sealing epoxy resin composition and semiconductor device using it 有权
标题翻译：半导体密封环氧树脂组合物和使用它的半导体器件
公开(公告)号：JP2009270000A
公开(公告)日：2009-11-19
申请号：JP2008121554
申请日：2008-05-07
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ETO TAKUYA , FUSUMADA MITSUAKI , SUZUKI TOSHIMICHI
IPC分类号： C08G59/62 , C08K3/22 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： C08G59/621 , C08K3/22 , C08L63/00 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition excellent in adhesion, moisture resistance, insulation reliability and fluidity in addition to flame resistance, and a semiconductor device using it. SOLUTION: The semiconductor-sealing epoxy resin composition contains aluminum hydroxide having a cumulative median particle diameter D 50 of 1.5 to 5 μm, a BET specific surface area S of 3.3/D 50 ≤S≤4.2/D 50 and a ratio D 50 /D 10 of D 50 and a cumulative 10% particle diameter D 10 of 1.5 to 4. A semiconductor element is sealed by using the composition to obtain the semiconductor device. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供除了阻燃性以外的粘合性，耐湿性，绝缘可靠性和流动性优异的半导体密封型环氧树脂组合物以及使用它的半导体器件。解决方案：半导体密封环氧树脂组合物含有累积中值粒径D 50 的1.5〜5μm的氢氧化铝，BET比表面积S为3.3 / D 50 ≤S≤4.2/ D 50 和D 50 的比率D 50 / 并且累积的10％粒径D 10 为1.5至4.通过使用该组合物密封半导体元件以获得半导体器件。版权所有（C）2010，JPO＆INPIT

3. 发明专利

JP2006036974A Epoxy resin composition for sealing semiconductor and semiconductor device by using the same 审中-公开
标题翻译：用于密封半导体器件和半导体器件的环氧树脂组合物
公开(公告)号：JP2006036974A
公开(公告)日：2006-02-09
申请号：JP2004220498
申请日：2004-07-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： UCHIDA TAKAHIRO , ETO TAKUYA , TOYODA KEI
IPC分类号： C08L63/00 , C08G59/42 , C08K5/09 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor, improved in an adhesive force between a metal frame part and a heat radiation plate, and capable of suppressing the occurrence of peeling between the metal frame part and the heat radiation plate on molding. SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a phenol resin, (C) an adhesion-imparting agent consisting of at least one of a trimellitic anhydride expressed by formula (1) and a trimellitic anhydride expressed by formula (2), and (D) an inorganic filler. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了获得用于密封半导体的环氧树脂组合物，改善了金属框架部分和散热板之间的粘合力，并且能够抑制金属框架部分和散热板之间的剥离的发生热辐射板成型。环氧树脂组合物含有（A）环氧树脂，（B）酚醛树脂，（C）由式（1）表示的偏苯三酸酐和偏苯三酸酯中的至少一种组成的粘合赋予剂由式（2）表示的酸酐和（D）无机填料。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2006249377A Resin composition for sealing semiconductor and semiconductor device using the same 有权
标题翻译：用于密封半导体和使用该半导体器件的半导体器件的树脂组合物
公开(公告)号：JP2006249377A
公开(公告)日：2006-09-21
申请号：JP2005071484
申请日：2005-03-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： OKADA TAKESHI , IKEMURA KAZUHIRO , ETO TAKUYA , UCHIDA TAKAHIRO
IPC分类号： C08L63/00 , C08K3/00 , C08K5/098 , C08K5/10 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a resin composition for sealing semiconductor excellent not only in safety, but also in moisture resistant reliability, flame retardancy, moldability, and mold releasability. SOLUTION: The resin composition for sealing semiconductor containing the following components (A) to (E), wherein the content of the component (B) is in the range of 5-30 wt% of the whole resin composition, and the total content of the component (B) and the component (C) is in a range of 60-90 wt% of the whole resin composition. (A) is a thermosetting resin composition. (B) is a metal compound which releases water or carbon dioxide in a 200-400°C range. (C) is an inorganic filler excluding the metal compound which belongs to the component (B). (D) is a mold release agent having an acid value of 1 to below 10. (E) is a mold release agent having an acid value of 10-20 and an average number of acidic groups in a molecule of in a range of 0.1-0.3. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封半导体的树脂组合物，不仅在安全性方面优异，而且具有防潮可靠性，阻燃性，成型性和脱模性优异。解决方案：包含以下组分（A）至（E）的半导体密封用树脂组合物，其中组分（B）的含量在整个树脂组合物的5-30重量％的范围内，并且组分（B）和组分（C）的总含量在整个树脂组合物的60-90重量％的范围内。（A）是热固性树脂组合物。（B）是在200-400℃范围内释放水或二氧化碳的金属化合物。（C）是除了属于（B）成分的金属化合物以外的无机填料。（D）为酸值为1〜10的脱模剂。（E）为脱模剂，酸值为10〜20，分子中酸性基团的平均数为0.1 -0.3。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006241411A Epoxy resin composition for sealing semiconductor and its manufacturing method, and semiconductor using the same 审中-公开
标题翻译：用于密封半导体的环氧树脂组合物及其制造方法和使用其的半导体
公开(公告)号：JP2006241411A
公开(公告)日：2006-09-14
申请号：JP2005062612
申请日：2005-03-07
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： OKADA TAKESHI , IKEMURA KAZUHIRO , ETO TAKUYA , UCHIDA TAKAHIRO
IPC分类号： C08G59/40 , C08K3/00 , C08K3/22 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor which is excellent not only in safety, but also in curability and dispersibility, and also excellent in flame retardancy and moisture-proof reliability.
SOLUTION: The epoxy resin composition for sealing a semiconductor comprises following components (A)-(D): (A) an epoxy resin, (B) a curing agent, (C) a basic curing accelerator having ≥pKa7, and (D) a mixture of a metal hydroxide and an inorganic filler other than the metal hydroxide.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种密封半导体的环氧树脂组合物，其不仅在安全性以及固化性和分散性方面都优异，并且还具有优异的阻燃性和防潮可靠性。解决方案：用于密封半导体的环氧树脂组合物包括以下组分（A） - （D）：（A）环氧树脂，（B）固化剂，（C）具有≥pKa7的碱性固化促进剂和（D）金属氢氧化物与金属氢氧化物以外的无机填料的混合物。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005162942A Method for producing epoxy resin composition for semiconductor encapsulation, and epoxy resin composition for semiconductor encapsulation and semiconductor device produced thereby 有权
标题翻译：用于生产半导体封装用环氧树脂组合物的方法和用于半导体封装的环氧树脂组合物及其制造的半导体器件
公开(公告)号：JP2005162942A
公开(公告)日：2005-06-23
申请号：JP2003406213
申请日：2003-12-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TOYODA HIDESHI , OKADA TAKESHI , YOSHIKAWA KEISUKE , ETO TAKUYA , IKEMURA KAZUHIRO , AKIZUKI SHINYA , ISHIZAKA TAKESHI , UCHIDA TAKAHIRO , TOYODA KEI
IPC分类号： C08G59/00 , C08G59/18 , C08G59/62 , C08G59/68 , C08L61/04 , C08L61/06 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： C08L61/06 , C08G59/621 , C08G59/688 , C08L61/04 , C08L63/00 , H01L23/293 , H01L2224/45144 , H01L2224/48091 , C08L2666/22 , C08L2666/16 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin composition for semiconductor encapsulation free from the formation of void, etc., and having high reliability.
SOLUTION: The epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a phenolic resin and (C) a cure accelerator is produced by preparatorily mixing a part or all of the compounding components except for the component (A) under a reduced pressure of 1.333-66.65 kPa at 100-230°C and adding and mixing the component (A) and the remaining components to the preparatorily mixed product.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制备半导体封装的环氧树脂组合物的方法，该方法不会形成空隙等并具有高可靠性。解决方案：将（A）环氧树脂，（B）酚醛树脂和（C）固化促进剂用于半导体封装的环氧树脂组合物通过将部分或全部配混组分除了组分（A）在100-230℃的1.333-66.65kPa的减压下，将组分（A）和其余组分加入并混合到预混合产物中。版权所有（C）2005，JPO＆NCIPI

7. 发明专利

JP2004168990A Semiconductor sealing epoxy resin composition and semiconductor device using the same 有权
公开(公告)号：JP2004168990A
公开(公告)日：2004-06-17
申请号：JP2002339798
申请日：2002-11-22
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： AKIZUKI SHINYA , IKEMURA KAZUHIRO , ITO HISATAKA , ETO TAKUYA , NISHIOKA TSUTOMU , SHIMADA KATSUMI
IPC分类号： C08K3/36 , C08G59/62 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L2224/13 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor sealing epoxy resin composition having high reliability because of the freeness from short circuit incidental to reduction in a pitch among the connection electrodes and conductor wires of a semiconductor device. SOLUTION: The semiconductor sealing epoxy resin composition contains components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) a silica powder in which the content of spherical fused silica powder (c) is at least 50 wt.% based on the entire silica powder. Silica powder (c) is obtained by using the combustion heat of a mixed gas comprising an oxygen gas and a combustible hydrocarbon gas and an oxygen gas as the heat source of fusing. COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2004018554A Epoxy resin composition for sealing semiconductor and semiconductor device using the same 审中-公开
公开(公告)号：JP2004018554A
公开(公告)日：2004-01-22
申请号：JP2002171491
申请日：2002-06-12
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： UCHIDA TAKAHIRO , ITO HISATAKA , IKEMURA KAZUHIRO , ETO TAKUYA , YOSHIKAWA KEISUKE
IPC分类号： C08L63/00 , C08G59/62 , C08K3/00 , C08K3/22 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor having not only high flame retardance but also excellent moisture resistance and fluidity.
SOLUTION: The epoxy resin composition for sealing the semiconductor comprises the following components (A) to (E): (A) an epoxy resin, (B) a phenol resin, (C) an inorganic filler, (D) a tetrazole compound having ≥300°C thermal decomposition temperature and (E) a metal oxide represented by general formula (1), M
1-x Q
x (OH)
2 [wherein, M is at least one kind of metal atom selected from the group consisting of Mg, Ca, Sn and Ti; Q is at least one kind of metal atom selected from the group consisting of Mn, Fe, Co, Ni, Cu and Zn; and X is a positive number of 0.01-0.5].
COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2006125937A Method of detecting metal particle 有权
标题翻译：检测金属颗粒的方法
公开(公告)号：JP2006125937A
公开(公告)日：2006-05-18
申请号：JP2004312729
申请日：2004-10-27
申请人： Marktec Corp , Nitto Denko Corp , マークテック株式会社 , 日東電工株式会社
发明人： ETO TAKUYA , IKEMURA KAZUHIRO , HIROSHIMA TATSUO
IPC分类号： G01V8/10 , G01J5/48 , G01N25/72 , G01V9/00 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a method of detecting metal particles for detecting conductive metal particles which has not been removed by a conventional method of removing the conductive metal particles using a magnet. SOLUTION: A body under inspection made of an epoxy resin composition T for semiconductor sealing is positioned in magnetic flux generated by a magnetizing coil 1. When the metal particles exist in the body, the metal particles is brought to an induction-heated state by the magnetic flux. Then, temperature distribution in the body is measured by an infrared camera 2, etc., thereby detecting the metal particles. COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2006124478A Semiconductor-sealing epoxy resin composition and semiconductor device sealed therewith 审中-公开
标题翻译：半导体密封环氧树脂组合物和半导体器件密封
公开(公告)号：JP2006124478A
公开(公告)日：2006-05-18
申请号：JP2004312730
申请日：2004-10-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ETO TAKUYA , IKEMURA KAZUHIRO , TOYODA HIDESHI , NAKABAYASHI KATSUYUKI , TSUKAHARA DAISUKE
IPC分类号： C08G59/62 , C08K3/22 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： C08G59/621 , C08L63/00 , H01L23/295 , H01L2924/0002 , Y10T428/31511 , C08L2666/16 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor-sealing epoxy resin composition free from foreign conductive metallic matter of such a size as not permitting its detection and removal by any conventional method for the removal of foreign conductive metallic matter.
SOLUTION: The semiconductor-sealing epoxy resin composition comprises the following components (A) to (D): (A) an epoxy resin, (B) a phenolic resin, (C) a cure accelerator, and (D) an inorganic filler and is substantially free from 20 μm or larger size foreign conductive metallic matter coming from constituents and a production apparatus for the epoxy resin composition.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种不含外来导电金属物质的半导体密封环氧树脂组合物，其尺寸不允许通过任何常规方法去除外来导电金属物质而进行检测和去除。解决方案：半导体密封型环氧树脂组合物包含以下组分（A）至（D）：（A）环氧树脂，（B）酚醛树脂，（C）固化促进剂和（D）无机填料，并且基本上不含来自组分的20μm或更大尺寸的异物导电金属物质和用于环氧树脂组合物的制备装置。版权所有（C）2006，JPO＆NCIPI

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