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1. 发明专利

JP2009263677A Ultraviolet curing type epoxy resin composition 有权
标题翻译： ULTRAVIOLET固化型环氧树脂组合物
公开(公告)号：JP2009263677A
公开(公告)日：2009-11-12
申请号：JP2009153594
申请日：2009-06-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： USUI HIDEYUKI , FUKUSHIMA TAKASHI
IPC分类号： C08G59/68 , C09J4/00 , C09J11/06 , C09J163/00
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet curing type epoxy resin composition which extremely slightly generates vaporized gas and has transparency for optical signals.
SOLUTION: The ultraviolet curing type epoxy resin composition comprises the following (A) and (B). (A) is an epoxy resin containing at least one of a straight-chain type aliphatic epoxy resin and a straight-chain type fluorinated epoxy resin, and an alicyclic epoxy resin, the content of at least one of the straight-chain type aliphatic epoxy resin and the straight-chain type fluorinated epoxy resin being set at 40-90 wt.% based on the whole of (A), wherein an allyl epoxy resin and a naphthalene epoxy resin of a specific structure are excluded from (A). (B) is an aromatic sulfonium salt.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种紫外线固化型环氧树脂组合物，该组合物极微地产生气化气体并具有光信号的透明性。解决方案：紫外线固化型环氧树脂组合物包含以下（A）和（B）。（A）是包含直链型脂肪族环氧树脂和直链型氟化环氧树脂中的至少一种和脂环式环氧树脂中的至少一种的环氧树脂，至少一种直链型脂族环氧树脂树脂和直链型氟代环氧树脂相对于全部（A）设定为40〜90重量％，其中，（A）中不包括特定结构的烯丙基环氧树脂和萘环氧树脂。（B）是芳族锍盐。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2007108228A Photoelectric consolidated substrate and its manufacturing method 审中-公开
标题翻译：光电综合基板及其制造方法
公开(公告)号：JP2007108228A
公开(公告)日：2007-04-26
申请号：JP2005296571
申请日：2005-10-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： USUI HIDEYUKI
IPC分类号： G02B6/122 , H05K1/02 , H05K3/06
摘要： PROBLEM TO BE SOLVED: To provide a photoelectric consolidated substrate capable of sufficiently shortening a distance between a core layer of an optical waveguide and a metallic wiring pattern surface and also sufficiently improving the propagation efficiency of an optical signal, and to provide its manufacturing method. SOLUTION: The method of manufacturing the photoelectric consolidated substrate comprises: a process for forming a 1st cladding layer 2a on a metallic thin film surface of a metallic thin film transfer sheet which is a release base material formed with a metallic thin film thereon; a process for releasing the release base material; a process for forming a predetermined wiring pattern 11 by etching the metallic thin film; a process for forming the core layer 2b on the surface of the 1st cladding layer 2a; a process for forming a 2nd cladding layer 2c to cover the surface of this core layer 2b; and a process for forming a predetermined position of this core layer 2b into an optical path conversion mirror 21. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够充分缩短光波导的芯层与金属布线图案表面之间的距离的光电固化基板，并且还充分提高光信号的传播效率，并提供其制造方法。解决方案：制造光电固化衬底的方法包括：在金属薄膜转印片的金属薄膜表面上形成第一包层2a的工艺，金属薄膜转印片是其上形成有金属薄膜的剥离基材 ; 释放基材的方法; 通过蚀刻金属薄膜来形成预定布线图案11的工艺; 在第一包层2a的表面上形成芯层2b的工艺; 形成覆盖该芯层2b的表面的第二包覆层2c的工序; 以及用于将该芯层2b的预定位置形成为光路转换反射镜21的工序。（C）2007，JPO＆INPIT

3. 发明专利

JP2010192586A Optical semiconductor sealing sheet 有权
标题翻译：光学半导体密封片
公开(公告)号：JP2010192586A
公开(公告)日：2010-09-02
申请号：JP2009033886
申请日：2009-02-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUEHIRO ICHIRO , FUJIOKA KAZUYA , MATSUDA HIROKAZU , AKAZAWA MITSUHARU , KIMURA RYUICHI , USUI HIDEYUKI
IPC分类号： H01L33/54 , H01L23/28 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/1815
摘要： PROBLEM TO BE SOLVED: To provide an optical semiconductor sealing sheet excellent in light extraction efficiency and an optical semiconductor device sealed by the sheet. SOLUTION: The optical semiconductor sealing sheet is the one in which a sealing resin layer is laminated on a release sheet, wherein the release sheet includes a concave forming layer with a concave shape or a convex forming layer with a convex shape in an interface with the sealing resin layer, and the sealing resin layer has such a convex shape as fits into the concave shape of the release sheet or has such a concave shape as fits into the convex shape of the release sheet. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供光提取效率优异的光半导体密封片和由片密封的光半导体器件。解决方案：光学半导体密封片是其中密封树脂层层压在剥离片上的剥离片，其中剥离片包括具有凹形的凹形成层或具有凸形形状的凸形成层与密封树脂层接触，并且密封树脂层具有适合于脱模片的凹形的凸形，或者具有适合于剥离片的凸形的凹形。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2010134043A Microlens array 有权
标题翻译：微阵列
公开(公告)号：JP2010134043A
公开(公告)日：2010-06-17
申请号：JP2008307712
申请日：2008-12-02
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUEHIRO ICHIRO , KATAYAMA HIROYUKI , AKAZAWA MITSUHARU , USUI HIDEYUKI
IPC分类号： G02B3/00 , G02B1/04 , H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide a microlens array having improved heat-resistance and light-resistance against a high-powered LED and a blue short wavelength of the LED, to provide an optical electronic device equipped with the microlens array, and to provide an LED array. SOLUTION: The microlens array is obtained by molding modified polyaluminosiloxane obtained by reacting a silane coupling agent shown by formula(1) (wherein, R 1 , R 2 and R 3 each independently denote an alkyl group or an alkoxy group, X denotes a methacryloxy group, a glycidoxy group, an amino group, a vinyl group or a sulfhydryl group, at least two of R 1 , R 2 and R 3 are alkoxy groups) with polyaluminosiloxane. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有针对LED的大功率LED和蓝色短波长的改进的耐热性和耐光性的微透镜阵列，以提供配备有微透镜阵列的光学电子器件，以及提供LED阵列。解决方案：通过将通式（1）所示的硅烷偶联剂（其中R 1，R 2，R 2，R 2和R 2）与通式（1）所示的硅烷偶联剂反应获得的改性聚铝硅氧烷， R 3 各自独立地表示烷基或烷氧基，X表示甲基丙烯酰氧基，缩水甘油氧基，氨基，乙烯基或巯基，R 1 ，R 2 和R 3 是烷氧基）。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2010054640A Microlens array 审中-公开
标题翻译：微阵列
公开(公告)号：JP2010054640A
公开(公告)日：2010-03-11
申请号：JP2008217518
申请日：2008-08-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SUEHIRO ICHIRO , KATAYAMA HIROYUKI , AKAZAWA MITSUHARU , USUI HIDEYUKI
IPC分类号： G02B3/00 , C08G77/38 , G02B1/04
CPC分类号： B29D11/00365 , G02B1/041 , G02B3/0031 , Y10T428/31663 , C08L83/14
摘要： PROBLEM TO BE SOLVED: To provide a microlens array having excellent heat resistance and light resistance to a high-power LED and to short-wavelength blue light of the LED. SOLUTION: Microlens array is produced by molding a resin obtained by reacting a silicon compound with a boron compound or an aluminum compound, in which the silicon compound is represented by formula (I): wherein R 1 and R 2 each represent an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; X represents a hydroxyl group, an alkoxyl group, an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, or an aryl group; and n is 4 to 250. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供对大功率LED和LED的短波长蓝光具有优异的耐热性和耐光性的微透镜阵列。解决方案：微透镜阵列通过模制通过使硅化合物与硼化合物或铝化合物反应获得的树脂来制备，其中硅化合物由式（I）表示：其中R 1 和R 2各自表示烷基，环烷基，烯基，炔基或芳基; X表示羟基，烷氧基，烷基，环烷基，烯基，炔基或芳基; n为4至250。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2007246652A Epoxy resin sheet for molding optical member 审中-公开
标题翻译：用于模制光学部件的环氧树脂片
公开(公告)号：JP2007246652A
公开(公告)日：2007-09-27
申请号：JP2006070933
申请日：2006-03-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： AKAZAWA MITSUHARU , HARADA NORIAKI , USUI HIDEYUKI
IPC分类号： C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin sheet for molding an optical member holding strength even when having a sheet form with good operation efficiency and having high elongation at break and excellent curing characteristics and transmittance.
SOLUTION: The epoxy resin sheet for molding the optical member comprises an epoxy resin, a curing agent and a curing accelerator. The epoxy equivalent of the epoxy resin is 2,000-7,000.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：即使在具有良好的操作效率和高断裂伸长率以及优异的固化特性和透光率的片状的情况下，也提供了一种用于模制光学构件保持强度的环氧树脂片。解决方案：用于模制光学部件的环氧树脂片包括环氧树脂，固化剂和固化促进剂。环氧树脂的环氧当量为2,000-7,000。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2005320434A Ultraviolet-curable resin composition 有权
标题翻译：超紫外线固化树脂组合物
公开(公告)号：JP2005320434A
公开(公告)日：2005-11-17
申请号：JP2004139548
申请日：2004-05-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： USUI HIDEYUKI
IPC分类号： C08G65/18 , C08G59/02
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet-curable resin composition excellent in heat resistance and humidity resistance and also in transparency.
SOLUTION: The ultraviolet-curable resin composition comprises (A) an oxetane compound comprising at least one of (a1) and (a2) below, (B) a liquid epoxy resin represented by general formula (3), and (C) a photopolymerization initiator: (a1) di[1-ethyl(3-oxetanyl)]methyl ether represented by structural formula (1) ; and (a2) 3-ethyl-3-(phenoxymethyl)oxetane represented by structural formula (2).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供耐热性和耐湿性以及透明性优异的紫外线固化树脂组合物。＆lt; P＆gt;解决方案：紫外线固化型树脂组合物包含（A）包含下述（a1）和（a2）中的至少一种的氧杂环丁烷化合物，（B）由通式（3）表示的液体环氧树脂和（C ）光聚合引发剂：（a1）由结构式（1）表示的二[1-乙基（3-氧杂环丁烷基）]甲基醚; 和（a2）由结构式（2）表示的3-乙基-3-（苯氧基甲基）氧杂环丁烷。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2011135069A Substrate for led mounting 有权
标题翻译： LED安装基板
公开(公告)号：JP2011135069A
公开(公告)日：2011-07-07
申请号：JP2010263957
申请日：2010-11-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： KITAGAWA DAISUKE , TAKAYAMA YOSHINARI , SUEHIRO ICHIRO , USUI HIDEYUKI , ODA TAKASHI
IPC分类号： H01L33/64 , C08K3/38 , C08L27/18 , H01L33/60
CPC分类号： H05K1/0373 , C08L27/18 , H01L23/3735 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2924/181 , H01L2924/3025 , H05K1/0204 , H05K3/0061 , H05K2201/015 , H05K2201/0209 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a novel substrate suitable for LED mounting. SOLUTION: The substrate for LED mounting includes a heat conductive layer (a heat conductive sheet 10) that is formed from a composition containing a boron nitride powder and a fluorine resin. The fluorine resin contains polytetrafluoroethylene. The heat conductive layer has a heat conductivity of not less than 2 W/(m.K). The heat conductive layer has a reflectance of not less than 0.80 at wavelengths of 380 nm, 470 nm and 650 nm. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供适合于LED安装的新型基板。＆lt; P＆gt;解决方案：用于LED安装的基板包括由含有氮化硼粉末和氟树脂的组合物形成的导热层（导热片10）。氟树脂含有聚四氟乙烯。导热层的导热率不低于2W /（m.K）。导热层在380nm，470nm和650nm的波长下具有不小于0.80的反射率。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2005165133A Method for manufacturing optical waveguide 审中-公开
标题翻译：制造光波导的方法
公开(公告)号：JP2005165133A
公开(公告)日：2005-06-23
申请号：JP2003406217
申请日：2003-12-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKADA MIE , USUI HIDEYUKI
IPC分类号： G02B6/13 , C08G59/30 , G02B6/12
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing optical waveguide capable of efficiently manufacturing a highly reliable optical waveguide without causing a damage such as crack on a core layer. SOLUTION: The optical waveguide is manufactured as follow. A mold made by forming grooves 8 on the surface of mold substrate 6 and a substrate 1 with an underclad layer 2 are prepared. After an ultraviolet curing resin composition 10 is filled into the grooves 8, the substrate 1 with the underclad layer 2 is laminated on the mold so that the underclad layer 2 stands opposite to the groove 8 forming surface, thereafter, ultraviolet rays are applied from the substrate 1 side and the core layer 3 is formed. Only the mold substrate 6 is peeled off from the substrate 1 with the underclad layer 2 on which the core layer 3 is formed, an adhesion part 9 comprising the core layer 3 and organic solvent soluble material is exposed, thereafter, only the adhesion part 9 is dissolved and removed by using an organic solvent, thereby, the underclad layer 2 is laminated on the substrate 1, the core layer 3 of a prescribed pattern is formed on the underclad layer 2 and an overclad layer 4 is formed so as to contain the core layer 3. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造光波导的方法，其能够高效地制造高可靠性的光波导，而不引起核心层上的裂纹等损坏。解决方案：光波导制造如下。制备通过在模具基板6的表面上形成凹槽8和具有底层2的基板1制成的模具。将紫外线固化树脂组合物10填充到槽8中后，将具有下层2的基板1层叠在模具上，使得下包层2与槽8形成面相对立，然后从形成基板1侧和芯层3。只有模具基板6与形成有芯层3的下层2一起从基板1剥离，包含芯层3的粘合部9和有机溶剂可溶材料暴露，此后只有粘合部9 通过使用有机溶剂溶解除去，将底层2层压在基板1上，在下层2上形成规定图案的芯层3，形成外包层4，核心层3.版权所有（C）2005，JPO＆NCIPI

10. 发明专利

JP2005132984A Ultraviolet ray-curing epoxy resin composition 有权
标题翻译：超紫外线固化环氧树脂组合物
公开(公告)号：JP2005132984A
公开(公告)日：2005-05-26
申请号：JP2003371566
申请日：2003-10-31
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： USUI HIDEYUKI , FUKUSHIMA TAKASHI
IPC分类号： C08G59/24
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet ray-curing epoxy resin composition which is low in stress, does not need treatment at a high temperature so that it can be suitably used for an optical part material such as an optical waveguide and a lens or for an optical part-fixing, ultraviolet ray-curing adhesive, and is transparent for a light signal.
SOLUTION: The ultraviolet ray-curing epoxy resin composition comprises (A) an epoxy resin and (B) a photopolymerization initiator, wherein the epoxy resin comprises at least one of (a1) an epoxy resin represented by formulae (1) and (a2) an epoxy resin represented by formula (2).
COPYRIGHT: (C)2005,JPO&NCIPI

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