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1. 发明专利

JP2012052037A Viscoelastic body and method for producing the same 有权
标题翻译：粘弹体及其制造方法
公开(公告)号：JP2012052037A
公开(公告)日：2012-03-15
申请号：JP2010196250
申请日：2010-09-01
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , ASAI FUMITERU , TAKAHASHI TOMOKAZU , IMOTO EIICHI , SHIMAZAKI YUTA
IPC分类号： C08F290/06 , H01L21/304
CPC分类号： C08F299/065 , C08G18/672 , C08G18/753 , C08G2170/40 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , C08G18/48
摘要： PROBLEM TO BE SOLVED: To provide a resin material usable for a pressure-sensitive adhesive sheet for semiconductor wafer protection which, even when a semiconductor wafer is ground to an ultrathin thickness or a large diameter wafer is ground, does not cause bending (warpage) to the semiconductor wafer, has excellent followability to a pattern, avoids lifting from the pattern with time, ensures good stress dispersibility in grinding, suppresses wafer cracking and wafer edge chipping, avoids delamination in peeling, and leaves no adhesive residue on a wafer surface.SOLUTION: A viscoelastic body is provided containing a urethane polymer/acrylic polymer copolymer obtained through a monomer having in one molecule a functional group formable of a urethane bond with a urethane polymer and an activated carbon-carbon double bond copolymerizzble with a (meth)acryloyl group.
摘要翻译：要解决的问题：为了提供可用于半导体晶片保护用粘合片的树脂材料，即使将半导体晶片研磨成超薄厚度或大直径晶片，也不会引起弯曲（翘曲）到半导体晶片，具有优异的图案追随性，避免随着时间的推移而从图案中脱离，确保研磨中的良好的应力分散性，抑制晶片裂纹和晶片边缘碎裂，避免剥离时的剥离，并且不会在晶圆表面。解决方案：提供一种粘弹性体，其含有通过具有一分子的单体获得的氨基甲酸酯聚合物/丙烯酸类聚合物共聚物，其具有与氨基甲酸酯聚合物形成的氨基甲酸酯键的官能团和与（氨基甲酸酯聚合物）的活性炭 - 碳双键共聚，甲基）丙烯酰基。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2012052036A Temporary fixing sheet 审中-公开
标题翻译：临时固定片
公开(公告)号：JP2012052036A
公开(公告)日：2012-03-15
申请号：JP2010196249
申请日：2010-09-01
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIMAZAKI YUTA , IMOTO EIICHI , SHIMOKAWA DAISUKE , NAGASAKI KUNIO
IPC分类号： C09J7/02 , C09J133/00 , C09J175/04 , C09J175/14 , H01G4/12 , H01G4/30
CPC分类号： H01L21/6836 , C08F283/008 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , C08G18/48
摘要： PROBLEM TO BE SOLVED: To provide a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, gives a high degree of freedom to designing, and has adequate handleability.SOLUTION: The temporary fixing sheet has a resin layer which contains a urethane polymer component and a vinyl polymer, develops tack strength at a particular temperature equal to or higher than 40°C, and loses the tack strength at the particular temperature or lower.
摘要翻译：要解决的问题：为了提供一种在用于陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，可以提供高切割精度，然后通过以下方式可以有效且容易地从其自身剥离芯片：冷却至规定温度以下，赋予设计自由度高，操作性好。解决方案：临时固定片具有包含聚氨酯聚合物组分和乙烯基聚合物的树脂层，在特定温度等于或高于40℃的情况下产生粘着强度，并在特定温度下失去粘着强度，或降低。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2008088408A Ultraviolet-curable adhesive composition, ultraviolet-curable adhesive sheet, and method for producing the same 有权
标题翻译：超耐热粘合剂组合物，超耐热粘合片及其制造方法
公开(公告)号：JP2008088408A
公开(公告)日：2008-04-17
申请号：JP2007203706
申请日：2007-08-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HIRAO AKIRA , NAGASAKI KUNIO , SHIMAZAKI YUTA
IPC分类号： C09J4/02 , C09J7/02 , C09J11/04 , C09J11/06 , C09J11/08
CPC分类号： C09J11/06 , C08K5/0025 , C08K5/02 , C08K7/22 , C09J4/00 , C09J7/385 , C09J2205/102 , C09J2205/11 , C09J2205/31 , Y10T428/249971 , Y10T428/2809 , C08F220/18
摘要： PROBLEM TO BE SOLVED: To provide an ultraviolet-curable adhesive composition which provides an adhesive sheet having an adhesive layer with improved holding power and excellent adhesiveness, and to provide an ultraviolet-curable adhesive sheet using the ultraviolet-curable adhesive composition and a method for producing the ultraviolet-curable adhesive sheet. SOLUTION: Disclosed is an ultraviolet-curable adhesive composition which contains 0.01-0.1 part by mole of (b) at least one polyfunctional (meth)acrylate having 4 or more (meth)acryloyl groups in a molecule and an acrylic equivalent weight of not more than 150 per 100 parts by mole of (a) a monomer component containing 70-99% by weight of an alkyl (meth)acrylate wherein an alkyl group has 1-20 carbon atoms and 1-30% by weight of a vinyl monomer having a polar group, and (c) a photopolymerization initiator. Also disclosed are an ultraviolet-curable adhesive sheet using such an ultraviolet-curable adhesive composition and a method for producing such an ultraviolet-curable adhesive sheet. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供一种紫外线固化型粘合剂组合物，其提供具有改善的保持力和优异的粘附性的粘合剂层的粘合片，并且提供使用紫外线固化型粘合剂组合物的紫外线固化型粘合片，以及紫外线固化型粘合片的制造方法。解决方案：公开了一种紫外线固化型粘合剂组合物，其含有0.01-0.1摩尔份的（b）至少一种分子中具有4个以上（甲基）丙烯酰基的多官能（甲基）丙烯酸酯和丙烯酸当量（a）含有70-99重量％的（甲基）丙烯酸烷基酯（其中烷基具有1-20个碳原子）和1-30重量％的（甲基）丙烯酸烷基酯的单体组分不超过150个具有极性基团的乙烯基单体，和（c）光聚合引发剂。还公开了使用这种紫外线固化型粘合剂组合物的紫外线固化型粘合片和这种紫外线固化型粘合片的制造方法。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2013060546A Method for manufacturing composite film, and composite film 审中-公开
标题翻译：制备复合膜的方法和复合膜
公开(公告)号：JP2013060546A
公开(公告)日：2013-04-04
申请号：JP2011200799
申请日：2011-09-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IMOTO EIICHI , SHIMAZAKI YUTA , KITAHARA TATSUYA , NAGASAKI KUNIO
IPC分类号： C08J5/18 , C08F2/44 , C08F290/06
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a composite film, which exhibits little variation in fracture strength when the composite film is elongated, and can decrease the stress generated in 20%-elongation.SOLUTION: The method for manufacturing a composite film includes a step of preparing a reference mixture containing a urethane polymer and at least one acrylic monomer, a step of adding ≥0.01 pts.wt. and ≤5 pts.wt. of a chain transfer agent based on 100 pts.wt. of the reference mixture to prepare an added mixture, and a step of curing the added mixture to form the composite film, wherein the elongation fracture strength S2 of the composite film P2 obtained by curing the added mixture is ≥85% and ≤115% of the elongation fracture strength S1 of a composite film P1 obtained by curing the reference mixture; and the stress M2 when the composite film P2 is elongated by 20% is ≤90% of the stress M1 when the composite film P1 is elongated by 20%.
摘要翻译：要解决的问题：提供一种复合膜的制造方法，当复合膜伸长时，其复合膜的断裂强度几乎不变化，并且可以降低20％的应力。解决方案：复合膜的制造方法包括制备含有氨基甲酸酯聚合物和至少一种丙烯酸类单体的参考混合物的步骤，添加≥0.01重量份的步骤和≤5pts.wt 的链转移剂基于100重量份的参考混合物以制备添加的混合物，以及固化添加的混合物以形成复合膜的步骤，其中通过固化添加的混合物获得的复合膜P2的伸长断裂强度S2为≥85％且≤115％通过固化参考混合物获得的复合膜P1的伸长断裂强度S1; 当复合膜P1伸长20％时，应力M2为应力M1的90％。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2012054431A Pressure-sensitive adhesive sheet for semiconductor wafer protection 审中-公开
标题翻译：用于半导体波形保护的压敏粘合片
公开(公告)号：JP2012054431A
公开(公告)日：2012-03-15
申请号：JP2010196252
申请日：2010-09-01
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HABU TSUYOSHI , ASAI FUMITERU , TAKAHASHI TOMOKAZU , IMOTO EIICHI , SHIMAZAKI YUTA
IPC分类号： H01L21/304 , C09J7/00 , C09J175/16
CPC分类号： H01L21/67132 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J7/10 , C09J175/16 , C09J2203/326 , C09J2475/00 , C08G18/48
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for semiconductor wafer protection which achieves no curvature (warpage) of the semiconductor wafer, excellent followability to a pattern, no lifting from a pattern with age, improved stress dispersion during grinding, less wafer cracks of wafer edge chips, no delamination in removal and no residue of a sticker even when the semiconductor wafer is ground to create an ultra-thin wafer or a large-diameter wafer is ground.SOLUTION: The semiconductor wafer protection sheet bonded to a surface of the semiconductor wafer for protection is one layer protection sheet having one adhesive surface and no boundary face between a base material and a sticker. The protection sheet has a stress relaxation ratio of 40% and over at 10% elongation, a tape lifting width after 24 hours increased by 40% and under in comparison with the beginning when bonded to a stepped portion by 30 μm, a thickness of the pressure-sensitive adhesive sheet of 5 μm-1000 μm and adhesion forces on both faces different from each other.
摘要翻译：要解决的问题：为了提供半导体晶片保护用压敏粘合片，其不影响半导体晶片的曲率（翘曲），对图案的追随性优异，不随着时间的推移而改变图案的应力分散磨削，晶片边缘碎片的晶片裂纹减少，即使当研磨半导体晶片以形成超薄晶片或大直径晶片时，不会剥离分层，也不会残留贴纸。解决方案：与保护用半导体晶片的表面接合的半导体晶片保护片是具有一个粘合表面并且在基材和贴纸之间没有边界面的单层保护片。保护片在10％伸长率下的应力松弛率为40％以上，24小时后的带提升宽度比起与阶梯部30μm接合时的开始时相比增加了40％以下，压敏粘合片为5μm〜1000μm，两面粘接力彼此不同。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2012052038A Temporary fixing sheet for manufacturing process of electronic part 审中-公开
标题翻译：电子零件制造工艺的临时固定表
公开(公告)号：JP2012052038A
公开(公告)日：2012-03-15
申请号：JP2010196251
申请日：2010-09-01
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIMOKAWA DAISUKE , SHIMAZAKI YUTA , NAGASAKI KUNIO , IMOTO EIICHI
IPC分类号： C09J7/02 , C09J133/00 , C09J175/04 , C09J175/14 , H01G4/12 , H01G4/30 , H01G13/00
CPC分类号： H01L21/6836 , C08F290/067 , C08G18/4854 , C08G18/672 , C08G18/757 , C08G2170/40 , C09J5/06 , C09J7/35 , C09J175/16 , C09J2201/61 , C09J2203/326 , C09J2205/114 , C09J2205/302 , C09J2205/31 , C09J2433/00 , C09J2467/006 , C09J2475/00 , H01G4/30 , H01G13/00 , H01L2221/68336 , Y10T428/2878 , C08G18/48
摘要： PROBLEM TO BE SOLVED: To provide a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, also can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability.SOLUTION: The temporary fixing sheet comprises a supporting substrate 1 and a temporary fixing layer 2 provided on at least one surface of the supporting substrate 1, wherein the temporary fixing layer 2 contains a urethane polymer and a vinyl polymer.
摘要翻译：要解决的问题：为了提供一种在用于陶瓷片等的切割步骤中牢固地保持陶瓷片的临时固定片，还可以提供高切割精度，然后可以有效且容易地从其自身上剥离芯片通过冷却至规定温度以下，设计自由度高，操作性好。解决方案：临时固定片包括支撑基板1和设置在支撑基板1的至少一个表面上的临时固定层2，其中临时固定层2包含聚氨酯聚合物和乙烯基聚合物。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2014009312A Sheet-like extensible organic substrate 审中-公开
标题翻译：类似可扩展的有机基板
公开(公告)号：JP2014009312A
公开(公告)日：2014-01-20
申请号：JP2012147634
申请日：2012-06-29
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAITO TOMOYA , KITAHARA TATSUYA , IMOTO EIICHI , SHIMAZAKI YUTA , NAGASAKI KUNIO
IPC分类号： C08J5/00 , C08F2/00
摘要： PROBLEM TO BE SOLVED: To provide a sheet-like extensible organic substrate capable of easily expanding the whole substrate and also adding a shape memory function to a specified direction and region.SOLUTION: The sheet-like extensible organic substrate has a shape memory part made of a shape memory polymer, partially and integrally formed in an extensible polymer base material, and a surface shape of the shape memory part or a projection shape when setting a surface of the sheet-like extensible organic substrate as a projection plane is linear, solid or ring belt-like. The shape memory part made of the shape memory polymer may be partially and integrally formed in the extensible polymer base material in a state exposed on at least one surface of the sheet-like extensible organic substrate or a state not exposed thereon.
摘要翻译：要解决的问题：提供一种能够容易地使整个基板膨胀并且还可以向特定方向和区域添加形状记忆功能的片状可延伸有机基板。解决方案：片状可延伸有机基板具有形状记忆部分形状记忆聚合物的一部分整体形成在可延展聚合物基材中，以及形状记忆部分的表面形状或将片状可延展有机基材的表面设置为投影平面时的突起形状是线性的，固体的或环带状。由形状记忆聚合物制成的形状记忆部分可以以可暴露于片状可延伸有机基材的至少一个表面上的状态或未暴露于其中的状态而部分地和一体地形成在可延展聚合物基材中。

8. 发明专利

JP2012167178A Heat peelable adhesive sheet 审中-公开
标题翻译：热粘胶布
公开(公告)号：JP2012167178A
公开(公告)日：2012-09-06
申请号：JP2011028911
申请日：2011-02-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIMAZAKI YUTA , IMOTO EIICHI , KITAHARA TATSUYA , NAGASAKI KUNIO
IPC分类号： C09J7/02 , B32B27/00 , B32B27/30 , B32B27/40 , C09J11/06 , C09J201/00 , H01L21/301 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a heat peelable adhesive sheet which can be used under a high temperature without a heat shrinkage while having moderate drawability, and can be reworked when being put or drawn by mistake.SOLUTION: The heat peelable adhesive sheet has a heat-expandable adhesive layer having a foaming agent and formed on at least one surface of a substrate, and further the substrate contains a composite film layer of a urethane polymer and a (meth)acrylic polymer.
摘要翻译：要解决的问题：提供一种能够在没有热收缩的情况下在高温下使用的可热剥离的粘合片，同时具有适度的可拉伸性，并且当被错误地放置或拉出时可以重新加工。热剥离性粘合片具有发泡剂的热膨胀性粘合剂层，形成在基材的至少一个表面上，此外，基材含有聚氨酯聚合物和（甲基）丙烯酸酯系复合膜层，丙烯酸聚合物。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2010144043A Uv ray-curable viscoelastic material, uv ray-curable pressure-sensitive adhesive tape or sheet, and method for producing uv ray-curable viscoelastic material 有权
标题翻译：紫外线可固化粘弹性材料，紫外线可固化压敏粘合胶带或薄片，以及生产紫外线可固化粘弹性材料的方法
公开(公告)号：JP2010144043A
公开(公告)日：2010-07-01
申请号：JP2008322666
申请日：2008-12-18
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIMAZAKI YUTA , NAKAYAMA YUSUKE , NAGASAKI KUNIO
IPC分类号： C08F2/44 , C08F220/18 , C09J7/00 , C09J7/02 , C09J133/04
摘要： PROBLEM TO BE SOLVED: To provide a UV ray-curable viscoelastic material having a high polymerization rate and concealing property, a UV ray-curable pressure-sensitive adhesive tape or sheet, and a method of producing a UV ray-curable viscoelastic material. SOLUTION: The UV ray-curable viscoelastic material contains a thermochromic pigment that reversibly decolors and colors by temperature changes. In particular, a preferable UV ray-curable viscoelastic material is obtained by polymerizing a UV ray-polymerizable composition through irradiation with UV rays, the composition containing 70 to 99.9 parts by weight of an alkyl (meth)acrylate having an alkyl group having 2 to 20 carbon atoms, 0.1 to 30 parts by weight of a vinyl monomer, in total 100 parts by weight of the monomer component, and 0.01 to 30 parts by weight of a thermochromic pigment and 0.01 to 5.0 parts by weight of a photopolymerization initiator. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有高聚合速率和隐蔽性的紫外线可固化粘弹性材料，可UV射线固化型压敏粘合带或片材，以及制备紫外线固化型粘弹性体的方法材料。解决方案：紫外线固化型粘弹性材料含有通过温度变化可逆地脱色和着色的热变色颜料。特别地，优选的紫外线固化型粘弹性材料是通过紫外线照射使紫外线可聚合组合物聚合而获得的，该组合物含有70-99.9重量份具有烷基的（甲基）丙烯酸烷基酯具有2〜 20个碳原子，0.1〜30重量份乙烯基单体，总共100重量份的单体成分，0.01〜30重量份的热变色颜料和0.01〜5.0重量份的光聚合引发剂。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009079204A Method for producing acrylic viscoelastic layer with combination of photopolymerization reaction and redox polymerization reaction, and adhesive tape or sheet 有权
标题翻译：通过光聚合反应和氧化还原聚合反应的组合生产丙烯酸粘弹性层的方法和胶粘带或薄片
公开(公告)号：JP2009079204A
公开(公告)日：2009-04-16
申请号：JP2008124432
申请日：2008-05-12
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： SHIMAZAKI YUTA , NAGASAKI KUNIO
IPC分类号： C09J7/02 , C08F2/00 , C08F2/50 , C08F4/40 , C08F20/00 , C09J4/02 , C09J11/06
摘要： PROBLEM TO BE SOLVED: To provide a method for producing an acrylic viscoelastic layer, capable of remarkably reducing the residual quantity of an unreacted monomer without reduction in productivity while maintaining the viscoelastic property. SOLUTION: The method for producing an acrylic viscoelastic layer comprises polymerizing an acrylic monomer composition or a partially polymerized composition thereof with a combination of a photopolymerization reaction using a photopolymerization initiator which is cleaved by active energy beam with a redox polymerization reaction by effects of an oxidizing agent and a reducing agent. In the combination of the photopolymerization reaction using the photopolymerization initiator which is cleaved by active energy beam with the redox polymerization reaction by effects of the oxidizing agent and reducing agent, the photopolymerization reaction and the redox polymerization reaction may be progressed together by irradiating an acrylic monomer composition including a photopolymerization initiator cleaved by the active energy beam, the oxidizing agent and reducing agent or a partially polymerized composition thereof with the active energy beam. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：待解决的问题：提供一种制备丙烯酸粘弹性层的方法，其能够显着降低未反应单体的残留量而不降低生产率，同时保持粘弹性。解决方案：制备丙烯酸粘弹性层的方法包括将丙烯酸单体组合物或其部分聚合的组合物与光聚合反应的组合聚合，所述光聚合反应使用光聚合引发剂，其通过活性能量束用氧化还原聚合反应被效应的氧化剂和还原剂。在使用通过活性能量束与氧化还原聚合反应通过氧化剂和还原剂的作用裂解的光聚合引发剂的光聚合反应的组合，光聚合反应和氧化还原聚合反应可以通过照射丙烯酸类单体组合物，其包含由活性能量束切割的光聚合引发剂，氧化剂和还原剂或其与活性能量束的部分聚合的组合物。版权所有（C）2009，JPO＆INPIT

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