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1. 发明专利

JP2014000685A Production method of resin film conjugate 有权
标题翻译：树脂膜的生产方法
公开(公告)号：JP2014000685A
公开(公告)日：2014-01-09
申请号：JP2012135750
申请日：2012-06-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MATSUO NAOYUKI
IPC分类号： B29C65/16
CPC分类号： B29C66/7338 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1654 , B29C65/1683 , B29C65/4815 , B29C65/5021 , B29C65/5042 , B29C66/1122 , B29C66/1142 , B29C66/344 , B29C66/43 , B29C66/71 , B29C66/723 , B29C66/73921 , B29C66/8122 , B29C66/81267 , B29C66/8322 , B29K2909/08 , B29K2029/04
摘要： PROBLEM TO BE SOLVED: To provide a production method of a resin film conjugate that can produce the resin film conjugate excellent in bond strength.SOLUTION: A production method of a resin film conjugate comprises as follows. Edge faces of resin film members in each of which a substrate layer formed by a thermoplastic resin material, a PVA resin layer disposed on one surface of the substrate layer, and a surface treatment layer disposed on the other surface are laminated are abutted, the layers of the same sides of both sides are eliminated, the substrate layers are each exposed, and a junction material formed by a thermoplastic resin material of the same kind of the thermoplastic resin material is superposed to mount over both sides of the exposed substrate layers to be joined by thermofusion.
摘要翻译：要解决的问题：提供可以制造粘合强度优异的树脂膜的树脂膜共轭物的制造方法。解决方案：树脂膜共轭物的制造方法如下。将由热塑性树脂材料形成的基材层，设置在基材层的一个表面上的PVA树脂层和设置在另一个表面上的表面处理层层叠的树脂膜构件的边缘面邻接，消除两侧的相同侧面，将基板层分别露出，并且将由相同种类的热塑性树脂材料的热塑性树脂材料形成的接合材料叠置在安装在暴露的基底层的两侧上通过热熔融加入。

2. 发明专利

JP2013078803A Laser machining method and laser-machined product 审中-公开
标题翻译：激光加工方法和激光加工产品
公开(公告)号：JP2013078803A
公开(公告)日：2013-05-02
申请号：JP2012269616
申请日：2012-12-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NISHIDA MIKIJI , MATSUO NAOYUKI , HINO ATSUSHI
IPC分类号： B23K26/04 , B23K26/00 , B23K26/38
摘要： PROBLEM TO BE SOLVED: To provide a laser machining method which can suppress generation of a cut-out foreign matter and reduce contamination of a surface of a workpiece when a workpiece formed of a polymer material is subjected to machining using a laser beam, and to provide a laser-machined product.SOLUTION: The laser machining method uses the laser beam to machine the workpiece formed of the polymer material. The laser machining method irradiates the workpiece with the laser beam while an optical axis of the laser beam is inclined in a proceeding direction of the machining at a predetermined angle relative to a direction perpendicular to the workpiece.
摘要翻译：要解决的问题：提供一种激光加工方法，当使用激光束对由聚合物材料形成的工件进行加工时，能够抑制切出异物的产生并减少工件表面的污染，并提供激光加工产品。
解决方案：激光加工方法使用激光束加工由聚合物材料形成的工件。激光加工方法在激光的光轴相对于垂直于工件的方向以预定角度沿着加工的前进方向倾斜的同时用激光束照射工件。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2012168294A Manufacturing method of optical connector 审中-公开
标题翻译：光连接器的制造方法
公开(公告)号：JP2012168294A
公开(公告)日：2012-09-06
申请号：JP2011027911
申请日：2011-02-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAGAFUJI AKIKO , MATSUO NAOYUKI , SHIMODA MAYU
IPC分类号： G02B6/40 , G02B6/30
CPC分类号： G02B6/3855 , G02B6/3885 , G02B6/4214 , G02B6/4246 , G02B6/4249 , G02B6/4292
摘要： PROBLEM TO BE SOLVED: To provide a low cost manufacturing method of an optical connector capable of fixing an optical waveguide to a ferrule easily and in a short time.SOLUTION: The manufacturing method of an optical connector of the present invention comprises: a step of fitting an end part 10a of a transparent optical waveguide 10 into a fitting groove 1a for an optical waveguide, of a ferrule (1) for an optical connection made of resin; and a step of irradiating the transparent optical waveguide 10 with laser light L of a predetermined wavelength downward from above the fitting groove 1a, making the laser light reach a bottom surface of the fitting groove 1a, and fusion-fixing the end part 10a of the optical waveguide 10 to the ferrule (1).
摘要翻译：要解决的问题：提供一种能够容易地并且在短时间内将光波导固定到套圈的光连接器的低成本制造方法。解决方案：本发明的光连接器的制造方法包括：将透明光波导10的端部10a装配到用于光波导的配合槽1a中的步骤，用于树脂光连接; 以及从配合槽1a的上方朝向透明光波导10照射预定波长的激光L的步骤，使激光到达装配槽1a的底面，并且将光波导10到套圈（1）。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012143814A Laser machining method, and product machined by laser beam 有权
标题翻译：激光加工方法和激光束加工的产品
公开(公告)号：JP2012143814A
公开(公告)日：2012-08-02
申请号：JP2012073899
申请日：2012-03-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MATSUO NAOYUKI , NISHIDA MIKIJI , HINO ATSUSHI
IPC分类号： B23K26/14
摘要： PROBLEM TO BE SOLVED: To provide a laser machining method capable of easily performing laser machining with high productive efficiency by effectively reducing contamination due to decomposed matters on a surface of an object to be machined when machining the object to be machined by a laser beam.SOLUTION: The laser machining method, in which the laser beam is irradiated to the object to be machined to carry out machining, includes performing the laser machining while sucking and removing, near the irradiated part, the decomposed matters generated upon irradiating the laser beam.
摘要翻译：解决的问题：提供一种激光加工方法，其能够以高生产效率容易地进行激光加工，通过有效地减少由待加工物体的表面上的分解物质的污染，当加工对象物被加工时激光束。解决方案：激光加工方法，其中激光束照射到被加工物体进行加工，包括在照射部分附近进行激光加工，同时吸附和去除在照射部分时产生的分解物质激光束。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2012062187A Method of manufacturing sheet joining body and device of manufacturing sheet joining body 有权
标题翻译：制造板接合体的方法和制造板接合体的装置
公开(公告)号：JP2012062187A
公开(公告)日：2012-03-29
申请号：JP2010209801
申请日：2010-09-17
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MATSUO NAOYUKI , YAMAGUCHI YASUO
IPC分类号： B65H19/18 , B29C65/16 , G02B5/30
CPC分类号： B29C66/81267 , B29C65/1616 , B29C65/1619 , B29C65/1635 , B29C65/1654 , B29C65/1667 , B29C65/1683 , B29C65/1687 , B29C65/7847 , B29C65/7891 , B29C66/1122 , B29C66/43 , B29C66/71 , B29C66/73921 , B29C66/83221 , B29C66/855 , B29C2793/0081 , B29L2011/00 , B29K2029/04 , B29K2079/085 , B29K2077/00 , B29K2075/00 , B29K2071/00 , B29K2069/00 , B29K2067/006 , B29K2067/003 , B29K2059/00 , B29K2027/06 , B29K2025/06 , B29K2023/38 , B29K2023/18 , B29K2023/12 , B29K2023/083 , B29K2023/06 , B29K2001/08
摘要： PROBLEM TO BE SOLVED: To provide a device of manufacturing a sheet joining body capable of joining a resin sheet member without stopping the carrying of the resin sheet member to a processing area in joining.SOLUTION: This method of manufacturing the sheet joining body manufactures the sheet joining body by joining a first resin sheet member 1a carried to the processing area in preceding and the next second resin sheet member 1b. The method of manufacturing the sheet joining body includes a first process of holding a tip of the second resin sheet member, a second process of applying a light absorbent to the tip held in the first process, a third process of holding the first resin sheet member, a fourth process of cutting so that a held part constitutes an end, a fifth process of superposing the tip and the end by sandwiching the light absorbent, a sixth process of joining by performing laser welding, and a seventh process of carrying the second resin sheet member to the processing area in succession to the first resin sheet member.
摘要翻译：解决的问题：提供一种制造能够将树脂片构件接合的片接合体的装置，而不停止将树脂片构件运送到接合处理区域。解决方案：这种制造片材接合体的方法通过将承载在前一个和下一个第二树脂片部件1b中的处理区域的第一树脂片部件1a接合而制造片材接合体。制造片材接合体的方法包括：保持第二树脂片部件的末端的第一工序;向第一工序保持的刀片施加吸光剂的第二工序;保持第一树脂片部件，第四切割工序，使保持部件构成一端;第五工序，通过夹着吸光材料来叠置前端和端部;第六工序;进行激光焊接;第七工序;承载第二树脂; 片状部件依次连接到处理区域。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2010137368A Laminated sheet and method of manufacturing laminated sheet 审中-公开
标题翻译：层压板及其制造方法
公开(公告)号：JP2010137368A
公开(公告)日：2010-06-24
申请号：JP2008313175
申请日：2008-12-09
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MATSUO NAOYUKI , HATANAKA TOSHIHIRO
IPC分类号： B32B5/18 , B29C65/16
CPC分类号： B29C66/1122 , B29C65/1616 , B29C65/1635 , B29C65/1658 , B29C65/8223 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/727 , B29C66/73117 , B29C66/7392 , B29C66/7394 , B29C66/8122 , B29C66/81267 , B29C66/83415 , B29K2023/12 , B29K2023/06 , B29K2909/08 , B29K2067/003 , B29K2025/06 , B29K2079/08 , B29K2075/00
摘要： PROBLEM TO BE SOLVED: To provide a laminated sheet manufactured easily while forming a cellular layer and a film layer by bonding a cellular sheet formed of a polymer composition and a polymer film, and a method of manufacturing easily the laminated sheet. SOLUTION: This laminated sheet is the laminated sheet of forming the cellular layer and the film layer by bonding the cellular sheet formed of the polymer composition and the polymer film. An interface between the cellular layer and the film layer is heated by irradiating at least one backface side of the cellular layer and the film layer with a laser beam, under the condition where the cellular layer is layered on the film layer, and the cellular layer and the film layer are thereby fused each other to be bonded. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过粘合由聚合物组合物和聚合物膜形成的细胞片材，提供容易形成多孔层和膜层的层叠片材，以及容易地制造层压片材的方法。解决方案：该层叠片是通过粘合由聚合物组合物形成的细胞片和聚合物膜而形成多孔层和膜层的层压片。在细胞层层叠在膜层上的条件下，通过用激光束照射细胞层和膜层的至少一个背面侧来加热细胞层和膜层之间的界面，并且细胞层由此使薄膜层彼此熔合以进行结合。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2010129722A Device and method for forming hole 审中-公开
标题翻译：用于形成孔的装置和方法
公开(公告)号：JP2010129722A
公开(公告)日：2010-06-10
申请号：JP2008301951
申请日：2008-11-27
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MATSUO NAOYUKI , HINO ATSUSHI
IPC分类号： H05K3/00 , B23K26/00 , B23K26/38 , B23K101/42
摘要： PROBLEM TO BE SOLVED: To provide a hole forming device capable of obtaining a good accuracy for irradiation of laser beams. SOLUTION: The hole forming device is configured to form holes at least on insulating layers by irradiating laser beams to a lamination composed of conducting layers and insulating layers piled; which is characterized by being provided with a radiation thermometer that detects radiation energy from an irradiation portion that irradiates laser beams, and by the fact that the device is configured so as to control the irradiation of laser beams, based on the detection results. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够获得激光束照射的良好精度的孔形成装置。解决方案：孔形成装置被配置为通过将激光束照射到由导电层和堆叠的绝缘层构成的层叠件中至少在绝缘层上形成孔; 其特征在于，设置有辐射温度计，该辐射温度计检测来自照射激光的照射部分的辐射能量，以及根据检测结果，该装置被配置为控制激光束的照射的事实。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2010125653A Method of manufacturing sheet joint body 有权
标题翻译：制造板材接合体的方法
公开(公告)号：JP2010125653A
公开(公告)日：2010-06-10
申请号：JP2008301133
申请日：2008-11-26
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MATSUO NAOYUKI , SHIMODA MAYU
IPC分类号： B29C65/16 , B29K79/00 , B29L9/00
CPC分类号： B29C66/1122 , B29C65/1612 , B29C65/1635 , B29C65/1658 , B29C65/1677 , B29C65/1683 , B29C66/41 , B29C66/71 , B29C66/73117 , B29C66/73921 , B29C66/73941 , B29C66/8122 , B29C66/81267 , B29C66/83435 , B29K2909/08 , B29K2079/085 , B29K2079/08
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a sheet joint body for manufacturing a sheet joint body improved in joint quality. SOLUTION: The method of manufacturing the sheet joint body for manufacturing the sheet joint body with a resin sheet and a metal film welded and joined by laminating the resin sheet on the metal film to form a laminate and irradiating the laminate with laser beams from the back face side of the resin sheet, is characterized in that a support material with elasticity to have the amount of compressive strain of 0.1-20 μm at 5 MPa pressurization is allowed to abut on the back face side of the metal film and that irradiation of the laser beams is carried out in a state of pressurizing the resin sheet toward the metal film at a pressure of 1-100 kgf/cm 2 . COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种制造接合质量提高的片状接合体的片状接合体的制造方法。解决方案：制造用于制造具有树脂片和金属膜的片状接合体的片状接合体的方法，所述接合体通过在所述金属膜上层压所述树脂片而形成层压体并且通过激光束照射所述层叠体而被焊接并接合从树脂片的背面侧起，具有在5MPa加压下具有0.1-20μm的压缩应变量的弹性的支撑材料被允许抵靠金属膜的背面侧，并且激光束的照射是在以1-100kgf / cm 2的压力向树脂片向金属膜加压的状态下进行的。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010040570A Method of manufacturing wiring circuit board 审中-公开
标题翻译：制造电路板的方法
公开(公告)号：JP2010040570A
公开(公告)日：2010-02-18
申请号：JP2008198444
申请日：2008-07-31
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NAKAMURA KEI , MORITA HITOSHI , MATSUO NAOYUKI , SHIMODA MAYU
IPC分类号： H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring circuit board, with which a support substrate is recycled while achieving precise arrangement of a conductor pattern, the wiring circuit board is easily obtained in a short period of time, and the manufacturing cost can be reduced. SOLUTION: The support substrate 2 and a base insulating layer 3 to be laminated thereupon are prepared and bonded together by using a laser beam 9, the conductor pattern 4 is formed on the base insulating layer 3, and then the support substrate 2 is removed to obtain the wiring circuit board 1. COPYRIGHT: (C)2010,JPO&INPIT

10. 发明专利

JP2008016520A Method of manufacturing through-hole and wiring circuit board 有权
标题翻译：制造通孔和接线电路板的方法
公开(公告)号：JP2008016520A
公开(公告)日：2008-01-24
申请号：JP2006183994
申请日：2006-07-04
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： NISHIDA MIKIJI , MATSUO NAOYUKI , URAIRI MASAKATSU
IPC分类号： H05K3/00 , B23K26/38 , B23K101/42 , H05K3/42
CPC分类号： H05K3/0038 , H05K3/0055 , H05K3/386 , H05K3/427 , H05K2203/107 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a through-hole by which a through-hole can be formed without scraping away the adhesive layer, and to provide a method of manufacturing a wiring circuit board in which degradation in electrical connection reliability can be prevented. SOLUTION: A first through-hole 30 is formed in a laminated body 10 by using a laser light through trepanning method. The trepanning method means that a laser light is first given to the nearly central area of the first through-hole 30 to be formed, it is successively given along a periphery corresponding to the hole diameter of the first through-hole 30 to be formed, and finally it is returned again along an orbit to the nearly central area of the first through-hole 30. Next, a laser light is given in the same manner as the first through-hole 30 so as to form a second through-hole 31 that is nearly concentric with the first through-hole 30 and is larger in diameter than the first through-hole 30. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种形成通孔的方法，通过该通孔可以形成通孔而不刮掉粘合剂层，并且提供一种制造其中电气劣化的布线电路板的方法可以防止连接可靠性。解决方案：通过使用激光通过扫描方法在层叠体10中形成第一通孔30。切割方法是指首先将激光施加到要形成的第一通孔30的近中心区域，沿着与要形成的第一通孔30的孔径对应的周边连续地给出激光，并且最终沿着轨道再次返回到第一通孔30的近中心区域。接下来，以与第一通孔30相同的方式给出激光，以形成第二通孔31 其与第一通孔30几乎同心，并且直径大于第一通孔30的直径。（C）2008年，JPO和INPIT

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