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1. 发明专利

JP2011119068A Electrode for dye-sensitized solar cell and dye-sensitized solar cell 审中-公开
标题翻译：用于透明的太阳能电池和透明的太阳能电池的电极
公开(公告)号：JP2011119068A
公开(公告)日：2011-06-16
申请号：JP2009273694
申请日：2009-12-01
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： INOUE SHINICHI , HANAZONO HIROYUKI
IPC分类号： H01M14/00 , H01L31/04
CPC分类号： H01G9/2095 , Y02E10/542
摘要： PROBLEM TO BE SOLVED: To provide an electrode for dye-sensitized solar cell, the electrode preventing penetration of an electrolyte to prevent reduction of power generation efficiency while achieving productivity and cost saving by assuring flexibility and lightweight properties, and to provide the dye-sensitized solar cell. SOLUTION: The electrode for dye-sensitized solar cell includes a substrate made of a polyimide film obtained by reacting biphenyl tetracarboxylic dianhydrides with paraphenylenediamines. In the dye-sensitized solar cell 1 including a working electrode 2, a counter electrode 3 disposed opposite to the working electrode 2 with a space between them, and an iodine-containing electrolyte 4 filled in the space between the working electrode 2 and the counter electrode 3, the electrode for dye-sensitized solar cell is used as the counter electrode 3 and/or the working electrode 2. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供用于染料敏化太阳能电池的电极，所述电极防止电解质的渗透以防止发电效率降低，同时通过确保柔性和轻质性而实现生产率和成本节省，并且提供染料敏化太阳能电池。解决方案：用于染料敏化太阳能电池的电极包括由联苯四羧酸二酐与对二苯胺二胺反应获得的由聚酰亚胺膜制成的基材。在包括工作电极2的染料敏化太阳能电池1中，与工作电极2相对设置的对置电极3与它们之间具有空间，并且填充在工作电极2和计数器之间的空间中的含碘电解质4 电极3，染料敏化太阳能电池用电极用作对电极3和/或工作电极2.版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2014203971A アンダーフィルフィルム、封止シート、半導体装置の製造方法及び半導体装置审中-公开
标题翻译：底片，密封片，制造半导体器件的方法和半导体器件
公开(公告)号：JP2014203971A
公开(公告)日：2014-10-27
申请号：JP2013078907
申请日：2013-04-04
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： MORITA KOSUKE , TAKAMOTO HISAHIDE , HANAZONO HIROYUKI , FUKUI AKIHIRO
IPC分类号： H01L23/29 , H01L21/60 , H01L23/31
CPC分类号： H01L23/3157 , C09J7/0207 , C09J7/38 , C09J2201/606 , H01L21/563 , H01L21/6836 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L2221/68327 , H01L2221/68336 , H01L2221/6834 , H01L2221/68377 , H01L2221/68381 , H01L2221/68386 , H01L2224/11002 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/14181 , H01L2224/16238 , H01L2224/16268 , H01L2224/27003 , H01L2224/27436 , H01L2224/2929 , H01L2224/29298 , H01L2224/29386 , H01L2224/32225 , H01L2224/32245 , H01L2224/73104 , H01L2224/73204 , H01L2224/75753 , H01L2224/8113 , H01L2224/81193 , H01L2224/81203 , H01L2224/83191 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2224/11 , H01L2224/27 , H01L2924/0103 , H01L2924/01083 , H01L2924/01047 , H01L2924/01029 , H01L2924/01082 , H01L2924/05432 , H01L2924/207 , H01L2224/81 , H01L2224/83
摘要：【課題】熱伝導性に優れるとともに、半導体素子と基板との間の空間を良好に充填できるアンダーフィルフィルム及び封止シートを提供する。【解決手段】樹脂及び熱伝導性フィラーを含み、前記熱伝導性フィラーの含有量が50体積%以上であり、アンダーフィルフィルムの厚みに対して、前記熱伝導性フィラーの平均粒径が30%以下の値であり、前記アンダーフィルフィルムの厚みに対して、前記熱伝導性フィラーの最大粒径が80%以下の値であるアンダーフィルフィルムに関する。【選択図】図1
摘要翻译：要解决的问题：提供一种导热性优良的底部填充膜和密封片，并且能够使半导体器件与衬底之间的空间充分充分。解决方案：底部填充膜包括：树脂和导热性填料。导热性填料的含量为50体积％以上。导热填料的平均粒径相对于底部填充膜的厚度为30％以下。导热性填料的最大粒径相对于底部填充膜的厚度为80％以下。

3. 发明专利

JP2012033751A Wiring circuit board and method of manufacturing the same 有权
标题翻译：接线电路板及其制造方法
公开(公告)号：JP2012033751A
公开(公告)日：2012-02-16
申请号：JP2010172616
申请日：2010-07-30
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： INOUE SHINICHI , HANAZONO HIROYUKI , HASEGAWA MINEYOSHI
IPC分类号： H05K1/03 , H01B5/14 , H01B13/00 , H01L33/60 , H05K1/02
CPC分类号： H05K3/108 , H05K1/0274 , H05K1/0393 , H05K3/28 , H05K2201/0116 , H05K2201/2054
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board, which improves the efficiency of a device which receives or emits light, and to provide a method of manufacturing the wiring circuit board.SOLUTION: A wiring circuit board 10 includes: a base dielectric layer 1 composed of a porous material film; a conductor pattern 2 formed on the base dielectric layer 1 composed of the porous material film; and a cover dielectric layer 3 formed on the base dielectric layer 1 to cover the conductor pattern 2. The porous material film used as the base dielectric layer 1 has a reflectance of 50% or larger for light of at least part of wavelength within a wavelength region of 400-800 nm.
摘要翻译：要解决的问题：提供一种提高接收或发光的装置的效率的布线电路板，并提供制造布线电路板的方法。解决方案：布线电路板10包括：由多孔材料膜构成的基底电介质层1; 形成在由多孔材料膜构成的基底电介质层1上的导体图案2; 以及形成在基底电介质层1上以覆盖导体图案2的覆盖电介质层3.作为基底电介质层1使用的多孔质膜对波长内的波长的至少一部分的光具有50％以上的反射率 400-800nm的区域。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2012004098A Wiring circuit board, fuel battery, and method for manufacturing wiring circuit board 审中-公开
标题翻译：接线电路板，燃料电池及制造电路板的方法
公开(公告)号：JP2012004098A
公开(公告)日：2012-01-05
申请号：JP2010252124
申请日：2010-11-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HANAZONO HIROYUKI , INOUE SHINICHI , HASEGAWA MINEYOSHI , OKUMURA KEISUKE , EBE HIROSHI
IPC分类号： H01M8/02 , H01M8/10
CPC分类号： H01M8/0269 , H01M8/1011 , H01M8/2465 , Y02E60/523 , Y02P70/56 , Y10T29/49155
摘要： PROBLEM TO BE SOLVED: To provide a wiring circuit board, a fuel battery, and a method for manufacturing a wiring circuit board which can simplify the structure of the fuel battery.SOLUTION: An FPC substrate 1, an electrode film 35, and a fuel storage chamber 50 are stored in a casing 40. At the FPC substrate 1, a plurality of power collection portions 3e and 3j are conjoined over a base insulating layer 2 through an adhesive pattern 7. The base insulating layer 2 is made of porous ePTFE and has air permeability. Holes H11 and H12 are formed in the power collection portions 3e and 3j. The adhesive pattern 7 has the same shape as the plurality of power collection portions 3e and 3j. The FPC substrate 1 is sandwiched between an upper surface part 41 and a lower surface part 42 of the casing 40 with the FPC substrate 1 being bent along a bent part B1. The electrode film 35 is provided between the plurality of power collection portions 3e and 3j of the FPC substrate 1. The fuel storage chamber 50 is provided between the FPC substrate 1 and the lower surface part 42 so as to be in contact with the base insulating layer 2. Liquid fuel is supplied to the fuel storage chamber 50.
摘要翻译：要解决的问题：提供一种可以简化燃料电池的结构的布线电路板，燃料电池和制造布线电路板的方法。解决方案：FPC基板1，电极膜35和燃料储存室50存储在壳体40中。在FPC基板1上，多个集电部分3e和3j结合在基底绝缘层基底绝缘层2由多孔ePTFE制成，具有透气性。在电力收集部分3e和3j中形成有孔H11和H12。粘合剂图案7具有与多个集电部3e和3j相同的形状。 FPC基板1被夹在壳体40的上表面部分41和下表面部分42之间，FPC基板1沿弯曲部分B1弯曲。电极膜35设置在FPC基板1的多个集电部3e和3j之间。燃料存储室50设置在FPC基板1和下表面部42之间，以与基板绝缘液体燃料供应到燃料储存室50.版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2011108374A Electrode for dye-sensitized solar cell, and dye-sensitized solar cell 审中-公开
标题翻译：用于透明的太阳能电池的电极和透明的太阳能电池
公开(公告)号：JP2011108374A
公开(公告)日：2011-06-02
申请号：JP2009259131
申请日：2009-11-12
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HANAZONO HIROYUKI , INOUE SHINICHI , YAMANA KUMIE
IPC分类号： H01M14/00 , H01L31/04
CPC分类号： H01G9/2077 , H01G9/2031 , H01G9/2059 , H01L51/445 , Y02E10/542 , Y02P70/521
摘要： PROBLEM TO BE SOLVED: To provide an electrode for a dye-sensitized solar cell and the dye-sensitized solar cell, capable of preventing degradation of power generation efficiency and contamination of the surroundings. SOLUTION: The electrode for the dye-sensitized solar cell, provided with a cathode-side substrate 8, a cathode-side conductive layer 9 formed on a surface of the cathode-side substrate 8 and surrounded by a sealing layer 11 for sealing electrolyte 4, a cathode-side collector layer 14 formed on a rear face of the cathode-side substrate 8, and a cathode-side conductive part 17 for electrically conducting the cathode-side conductive layer 9 and the cathode-side collector layer 14 in a thickness direction of the cathode-side substrate 8, is used as a counter electrode 3 for the dye-sensitized solar cell 1. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种能够防止发电效率降低和环境污染的染料敏化太阳能电池和染料敏化太阳能电池用电极。解决方案：用于染料敏化太阳能电池的电极设置有阴极侧基板8，阴极侧导电层9，阴极侧导电层9形成在阴极侧基板8的表面上，被密封层11包围，密封电解质4，形成在阴极侧基板8的背面上的阴极侧集电体层14和用于导电阴极侧导电层9和阴极侧集电极层14的阴极侧导电部17 在阴极侧基板8的厚度方向上，用作染料敏化太阳能电池1的对电极3.版权所有（C）2011，JPO＆INPIT

6. 发明专利

JP2011091030A Printed circuit board, and fuel cell 审中-公开
标题翻译：印刷电路板和燃料电池
公开(公告)号：JP2011091030A
公开(公告)日：2011-05-06
申请号：JP2010202565
申请日：2010-09-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： HANAZONO HIROYUKI , INOUE SHINICHI
IPC分类号： H01M8/02 , C08G63/06 , C08G63/60 , H01B5/14 , H05K1/02 , H05K1/03 , H05K3/28
CPC分类号： H05K1/0326 , H01M8/006 , H01M8/0269 , H01M8/1011 , H01M8/1097 , H05K1/0393 , H05K2201/0141 , Y02E60/523
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board capable of preventing a defect wherein a liquid is absorbed by a base insulating layer, and to provide a fuel cell having the printed circuit board.
SOLUTION: The FPC board 1 has a base insulating layer 2 consisting of a first insulating section 2a, and a second insulating section 2b. A folding section B1 is arranged on the first insulating section 2a. A conductor layer 3 is formed on one surface of the base insulating layer 2. The conductor layer 3 consists of collector sections 3a, 3b, and lead-out conductor sections 4a, 4b. Coating layers 6a, 6b are formed to cover the conductor layer 3. Liquid crystal polymer is used as a material of the base insulating layer 2.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够防止液体被基底绝缘层吸收的缺陷的印刷电路板，并且提供具有印刷电路板的燃料电池。解决方案：FPC基板1具有由第一绝缘部分2a和第二绝缘部分2b组成的基底绝缘层2。折叠部B1布置在第一绝缘部分2a上。导体层3形成在基极绝缘层2的一个表面上。导体层3由集电体部分3a，3b和引出导体部分4a，4b组成。涂层6a，6b形成为覆盖导体层3.液晶聚合物用作基底绝缘层2的材料。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2014236152A シート状樹脂組成物、裏面研削用テープ一体型シート状樹脂組成物、ダイシングテープ一体型シート状樹脂組成物、半導体装置の製造方法、及び、半導体装置有权
标题翻译：片状树脂组合物，背面研磨胶带类型片状树脂组合物，带状粘合型板状树脂组合物，制造半导体器件的方法和半导体器件
公开(公告)号：JP2014236152A
公开(公告)日：2014-12-15
申请号：JP2013118009
申请日：2013-06-04
申请人：日東電工株式会社 , Nitto Denko Corp
发明人： HANAZONO HIROYUKI , TAKAMOTO HISAHIDE , MORITA KOSUKE , FUKUI AKIHIRO
IPC分类号： H01L23/29 , H01L21/301 , H01L21/304 , H01L21/60 , H01L23/31
CPC分类号： H01L21/6836 , C09J7/10 , C09J7/22 , C09J7/35 , C09J7/38 , C09J2201/36 , C09J2201/622 , C09J2203/326 , C09J2463/00 , C09J2479/08 , H01L21/563 , H01L23/293 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2221/68381 , H01L2221/68386 , H01L2224/13147 , H01L2224/14181 , H01L2224/16227 , H01L2224/27003 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/83191 , H01L2224/83193 , H01L2224/83862 , H01L2224/9211 , H01L2224/94 , H01L2924/00014 , H01L2224/27 , H01L2224/11 , H01L2924/0665 , H01L2224/81 , H01L2224/83
摘要：【課題】高温での耐久性に優れ、且つ、アンダーフィル用のシートとして好適に使用できるシート状樹脂組成物を提供すること。【解決手段】被着体と被着体上にフリップチップ接続された半導体素子との界面封止に用いられるシート状樹脂組成物であって、昇温速度10℃/minにて、25℃から300℃まで昇温した際の重量減少率が2%以下であり、カールフィッシャー法による吸湿率が1%以下であり、酸解離定数が3.0以上5.0以下の範囲内にある有機酸をシート状樹脂組成物全体に対して1重量%以上10重量%以下の範囲内で含有するシート状樹脂組成物。【選択図】図1
摘要翻译：要解决的问题：提供一种在高温下耐久性优异的片状树脂组合物，其可以优选用作底部填充片。溶解性：使用片状树脂组合物来密封安装目标和在安装目标上的倒装芯片连接的半导体器件。片状树脂组合物包含对整个片状树脂组合物的有机酸在1-10重量％的范围内。对于有机酸，以10℃/分钟的升温速度将温度从25℃升温至300℃时的重量减少率为2％以下; 根据卡尔费休法的吸水率为1％以下; 酸解离常数在3.0-5.0的范围内。

8. 发明专利

JP2014165206A Underfill sheet, tape-integrated underfill sheet for back grinding, dicing tape-integrated underfill sheet and method of manufacturing semiconductor device 有权
标题翻译：底板，用于背面研磨的带状集成底板，拼接组合底板和制造半导体器件的方法
公开(公告)号：JP2014165206A
公开(公告)日：2014-09-08
申请号：JP2013032386
申请日：2013-02-21
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MORITA KOSUKE , TAKAMOTO HISAHIDE , HANAZONO HIROYUKI , FUKUI AKIHIRO
IPC分类号： H01L21/60 , C09J7/02 , C09J11/04 , C09J133/00 , C09J161/10 , C09J163/00 , C09J201/00 , C09K3/10 , H01L21/301 , H01L21/304 , H01L23/29 , H01L23/31
CPC分类号： H01L21/563 , B32B27/38 , B32B2264/102 , B32B2457/14 , C08G59/621 , C08J5/18 , C08J2333/08 , C08J2333/12 , C08J2361/10 , C08J2433/08 , C08J2433/12 , C08J2433/20 , C08J2463/00 , C08L33/06 , C09J133/08 , C09J163/00 , H01L21/6836 , H01L23/293 , H01L23/3114 , H01L23/562 , H01L24/13 , H01L24/14 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/14181 , H01L2224/16225 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81193 , H01L2224/83191 , H01L2224/8385 , H01L2224/84862 , H01L2924/00011 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/00014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/0105 , H01L2924/0665 , H01L2924/066 , H01L2924/00 , H01L2224/81805
摘要： PROBLEM TO BE SOLVED: To provide an underfill sheet which can fill the protrusions and recesses in the circuit surface of a semiconductor element well, can connect the terminals of the semiconductor element and an attached body well, and can reduce outgassing.SOLUTION: An underfill sheet has a viscosity of 1000-10000 Pa s at 150°C, 0.05-0.20 rev/min, and a lowest viscosity of 100 Pa s or more at 100-200°C, 0.3-0.7 rev/min.
摘要翻译：要解决的问题：为了提供能够将半导体元件的电路表面中的突起和凹部填充的底部填充片能够良好地连接半导体元件的端子和附接体，并且可以减少排气。解决方案：底部填充片材在150℃，粘度为1000-10000Pa·s，0.05-0.20转/分钟，100-200℃下的最低粘度为100Pa·s以上，0.3-0.7转/分钟。

9. 发明专利

JP2013235104A Optoelectric hybrid board and manufacturing method thereof 有权
标题翻译：光电混合板及其制造方法
公开(公告)号：JP2013235104A
公开(公告)日：2013-11-21
申请号：JP2012106834
申请日：2012-05-08
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TSUJITA YUICHI , ISHIMARU YASUTO , HANAZONO HIROYUKI , TANAKA NAOYUKI , YAMAMOTO YASUFUMI , MASUDA SHOTARO , TAKASE MAYU
IPC分类号： G02B6/122 , G02B6/42 , H05K1/02
CPC分类号： G02B6/122 , G02B6/136 , G02B6/138 , G02B6/43
摘要： PROBLEM TO BE SOLVED: To provide an optoelectric hybrid board capable of suppressing increase of an optical propagation loss, while having excellent flexibility, and to provide a manufacturing method thereof.SOLUTION: An optoelectric hybrid board includes: an electric circuit board E obtained through forming electrical wiring 2 on a surface of an insulator layer 1; and an optical waveguide W formed on a rear face of the insulator layer 1 of the electric circuit board E through a metal layer M. At least part of the metal layer M is in a pattern formation state of (A) or (B) below. A first clad layer (under clad layer) 6 of the optical waveguide W enters and fills in removal traces of the metal layer M removed by the pattern formation. (A) The metal layer M is formed in a pattern in which a plurality of dot-like projections Ma are distributed. (B) A pattern in which a plurality of dot-like recesses are distributed is formed on the metal layer M.
摘要翻译：要解决的问题：提供一种能够抑制光传播损耗增加，同时具有优异柔性的光电混合板，并提供其制造方法。解决方案：一种光电混合基板包括：通过成形获得的电路板E 绝缘体层1表面上的电线2; 以及通过金属层M形成在电路板E的绝缘体层1的背面上的光波导W.金属层M的至少一部分处于下面的（A）或（B）的图案形成状态。光波导W的第一包层（下包层）6进入并填充通过图案形成去除的金属层M的去除痕迹。（A）金属层M形成为分布有多个点状突起Ma的图案。（B）在金属层M上形成分布有多个点状凹部的图案。

10. 发明专利

JP2012082383A Paste composition and wiring circuit board 有权
标题翻译：涂料组合物和接线电路板
公开(公告)号：JP2012082383A
公开(公告)日：2012-04-26
申请号：JP2011009258
申请日：2011-01-19
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： INOUE SHINICHI , HANAZONO HIROYUKI , EBE HIROSHI
IPC分类号： C08L101/12 , C08K3/02 , C08K5/3472 , C08L61/06 , C08L63/00 , C08L67/06 , H01B1/20 , H05K1/09 , H05K3/28
CPC分类号： C08K5/3472 , C08G18/4219 , C08G18/8061 , C08G59/50 , C08G59/508 , C08K3/04 , C08K3/041 , C08K3/08 , C09D17/005 , C09D163/00 , C09D175/06 , H01M8/0206 , H01M8/0213 , H01M8/0221 , H01M8/0226 , H01M8/0247 , H01M8/1011 , H01M8/2475 , Y02E60/523 , C08L63/00
摘要： PROBLEM TO BE SOLVED: To provide a paste composition which can control corrosion of a conductor layer by formic acid, and to provide a wiring circuit board using the same.SOLUTION: A conductor layer 3 is formed on one surface of a base insulating layer 2. The conductor layer 3 is composed of a pair of rectangular collector portions 3a, 3b and drawn-out conductor portions 4a, 4b extending in long-sized shapes from the collector portions 3a, 3b, respectively. Cover layers 6a, 6b are formed on the base insulating layer 2 to cover respective given portions of the conductor layer 3. A paste composition containing a compound represented by formula (1) is used as a material for the cover layer 6a, 6b. In the formula, R1 denotes a hydrogen atom, a 1-14C alkyl group, a phenyl group, an amino group, a mercapto group, an aromatic group-containing functional group, an alkoxy group, an alkylamino group or an alkoxycarbonyl group.
摘要翻译：要解决的问题：提供一种能够通过甲酸控制导体层腐蚀的糊剂组合物，并提供使用其的布线电路板。解决方案：导体层3形成在基底绝缘层2的一个表面上。导体层3由长方形的一对矩形集电部3a，3b和拉出导体部分4a，4b组成，分别来自集电体部分3a，3b的大小的形状。覆盖层6a，6b形成在基底绝缘层2上以覆盖导体层3的各个给定部分。使用含有由式（1）表示的化合物的糊剂组合物作为覆盖层6a，6b的材料。式中，R1表示氢原子，1-14C烷基，苯基，氨基，巯基，含芳香族官能团，烷氧基，烷基氨基或烷氧基羰基。版权所有（C）2012，JPO＆INPIT

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