专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2004152931A Flexible circuit board 有权
公开(公告)号：JP2004152931A
公开(公告)日：2004-05-27
申请号：JP2002315470
申请日：2002-10-30
申请人： Nippon Mektron Ltd , 日本メクトロン株式会社
发明人： SAITO TSUTOMU , KOSAKA SHINJIRO , UCHIDA HITOSHI , MAITA NAOYUKI
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a flexible circuit board having a structure suitable for the disconnection prevention of a circuit wiring pattern inside a bend at the meandering section of the flexible circuit board meandering in an S shape.
SOLUTION: In the flexible circuit board, the circuit wiring pattern 20 is provided on the board 10 that has a meandering plane shape and is made of resin, the circuit wiring pattern 20 is provided at the bending section of electronic equipment, and wiring is made via the bending section. A clearance between the side edge of the board and the outermost one of the circuit wiring pattern is set larger than other portions inside the bend at the meandering section of the circuit wiring pattern.
COPYRIGHT: (C)2004,JPO

2. 发明专利

JP2004079731A Flexible circuit board 审中-公开
公开(公告)号：JP2004079731A
公开(公告)日：2004-03-11
申请号：JP2002236969
申请日：2002-08-15
申请人： Nippon Mektron Ltd , 日本メクトロン株式会社
发明人： SAITO TSUTOMU , KOSAKA SHINJIRO
IPC分类号： H05K3/28 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a both-sided flexible circuit board that is used while the board is repetitively bent in one direction and can prevent the disconnection of a circuit wiring pattern caused by compressive strains resulting from the bending.
SOLUTION: This flexible circuit board has a first circuit wiring pattern 12 on the first surface of a flexible insulating base material and a second circuit wiring pattern 13 on the second surface of the base material and is provided with surface protective layers 16 and 19, each composed of a flexible resin film and an adhesive layer, on the the first and second circuit wiring patterns. The first circuit wiring pattern 12 is positioned so that the pattern 12 may come to the outside in the bending direction when the circuit board is bent with respect to the center line of the board in the thickness direction and the second circuit wiring pattern 13 is positioned so that the the pattern 13 may come to the inside in the bending direction. At the same time, the circuit wiring patterns 12 and 13 and surface protective layers 16 and 19 are constituted so that the position of the inside side face of the second circuit wiring pattern 13 in the bending direction may approach the center of the circuit board in the thickness direction.
COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2006278747A Flexible printed circuit board and its manufacturing method 有权
标题翻译：柔性印刷电路板及其制造方法
公开(公告)号：JP2006278747A
公开(公告)日：2006-10-12
申请号：JP2005095944
申请日：2005-03-29
申请人： Nippon Mektron Ltd , 日本メクトロン株式会社
发明人： HORIKIRI KAORU , SAITO TSUTOMU , KUBOTA YASUHIRO
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a flexible printed circuit board with a reinforcing plate of which warpage due to thermal effects is reduced as much as possible, and a method of manufacturing this flexible printed circuit board.
SOLUTION: In the flexible printed circuit board (a) partially backed up by a reinforcing plate (b), the reinforcing plate (b) is made of a resin laminated plate reinforced by a glass fiber (d) of 15 mm or less in length. In the method of manufacturing this flexible printed circuit board partially backed up by the reinforcing plate made of the resin laminated plate reinforced by the glass fiber, a drilling process is performed on this reinforcing plate, (b) at a certain location excepting the place in the vicinity of the component mounting terminals, so that the glass fiber may be 15 mm or less in length, and this reinforcing plate is laminated on a certain portion of the flexible printed circuit board.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种柔性印刷电路板，其具有尽可能减小由于热效应而翘曲的加强板的柔性印刷电路板，以及制造该柔性印刷电路板的方法。解决方案：在由加强板（b）部分支撑的柔性印刷电路板（a）中，加强板（b）由由15mm的玻璃纤维（d）增强的树脂层压板制成，或长度较短。在由由玻璃纤维增强的树脂层压板制成的加强板部分地支撑的柔性印刷电路板的制造方法中，在该加强板上进行钻孔加工，（b）在除了附近的部件安装端子，使得玻璃纤维的长度可以为15mm以下，并且该加强板层压在柔性印刷电路板的某一部分上。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2005019719A Flexible circuit board 审中-公开
标题翻译：柔性电路板
公开(公告)号：JP2005019719A
公开(公告)日：2005-01-20
申请号：JP2003183013
申请日：2003-06-26
申请人： Nippon Mektron Ltd , 日本メクトロン株式会社
发明人： KOSAKA SHINJIRO , SAITO TSUTOMU , AKATSUKA TAKATOSHI , MAITA NAOYUKI
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a structure suitable for preventing disconnection while focusing attention on an insulation covering material of a flexible circuit board provided with a meandering cable.
SOLUTION: The flexible circuit board is provided with a circuit wiring pattern on both surfaces of a board made of resin of which plane shape is meandering, and it is arranged in a bending part of an electronic apparatus, forming wiring over the bending part. In such the flexible circuit board, a Σ parameter defined by the following formula in an insulation film forming an insulation cover layer is -1.30 to -1.15 or -0.15 to 1.14. Σ parameter = log ((Elastic modulus × shearing strength)/(Film thickness)
3 ), where units of each item in the formula are as follows:Elastic modulus is GPa; sharing strength is MPa; and film thickness is μm.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种适合于防止断开的结构，同时将注意力集中在设置有蜿蜒电缆的柔性电路板的绝缘覆盖材料上。解决方案：柔性电路板在由平面形状曲折的树脂制成的板的两个表面上设置有电路布线图案，并且布置在电子设备的弯曲部分中，在弯曲部分上形成布线部分。在这种柔性电路板中，形成绝缘覆盖层的绝缘膜中由下式定义的Σ参数为-1.30〜-1.15或-0.15〜1.14。 Σ参数= log（（弹性模量×剪切强度）/（膜厚） 3 ），式中的各项的单位如下：弹性模量为GPa; 共享强度为MPa; 膜厚为μm。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004079730A Flexible circuit board 审中-公开
公开(公告)号：JP2004079730A
公开(公告)日：2004-03-11
申请号：JP2002236967
申请日：2002-08-15
申请人： Nippon Mektron Ltd , 日本メクトロン株式会社
发明人： SAITO TSUTOMU
IPC分类号： H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a flexible circuit board in which compressive strains caused by bending hardly occur in the inside cable section of overlapping cable sections.
SOLUTION: On the flexible circuit board on which component mounting sections 11 and 12 are connected to each other through the cable sections 21 and 22, notches 21A are provided along the side edges of the cable sections 21 and 22 in the root portions of the sections 21 and 22.
COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2003273483A Flexible circuit board and manufacturing method thereof 有权
标题翻译：柔性电路板及其制造方法
公开(公告)号：JP2003273483A
公开(公告)日：2003-09-26
申请号：JP2002074578
申请日：2002-03-18
申请人： Nippon Mektron Ltd , 日本メクトロン株式会社
发明人： MORIMOTO SHINPEI , SAITO TSUTOMU
IPC分类号： H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a flexible circuit board that has superb workability and additionally prevent rubbish from being generated when packaging the flexible circuit board to electronic equipment, and a manufacturing method for the flexible circuit board.
SOLUTION: In the flexible circuit board and the manufacturing method for the flexible circuit board, the flexible circuit board 1 has and adhesive or a layer of an adhesive, an adhesive mass and the like at least on one surface, and the flexible circuit board 1 is mounted on a release sheet 11 that interposes a layer 12 of the adhesive or adhesive mass and has dimensions large than those of the flexible circuit board.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种具有极好的可加工性的柔性电路板，并且另外防止在将柔性电路板封装到电子设备时产生垃圾，以及柔性电路板的制造方法。解决方案：在柔性电路板和柔性电路板的制造方法中，柔性电路板1至少在一个表面上具有粘合剂或粘合剂层，粘合剂块等，并且柔性电路板1的柔性电路板电路板1安装在剥离片11上，该剥离片11插入粘合剂或粘合剂块的层12，其尺寸大于柔性电路板的尺寸。版权所有（C）2003，JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式