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1. 发明专利

JP2008280551A Electroless nickel-plating solution and electroless nickel-plating method using the same 有权
标题翻译：电镀镍镀层溶液和使用其的电镀镍镀层方法
公开(公告)号：JP2008280551A
公开(公告)日：2008-11-20
申请号：JP2007123233
申请日：2007-05-08
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： WATANABE SUMITAKA
IPC分类号： C23C18/36
摘要： PROBLEM TO BE SOLVED: To provide an electroless nickel-plating solution which does not contain a heavy metal except nickel, has superior stability, and can impart an adequate appearance and superior corrosion resistance to a plated film.
SOLUTION: The electroless nickel-plating solution contains nickel ions, a complexing agent and a reducing agent, and is added with at least one isocyanide-based substance which is expressed by the general formula R-NC or CN-R-NC, wherein R is an alkyl group, an alkenyl group, an aryl group or a heterocyclic group, which may have a substituent group and further have an ether bond.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供不含镍以外的重金属的无电镀镍溶液，具有优异的稳定性，并且能赋予镀膜适当的外观和优异的耐腐蚀性。解决方案：化学镀镍溶液含有镍离子，络合剂和还原剂，并加入至少一种由通式R-NC或CN-R-NC表示的异氰化物基物质其中R是可以具有取代基并且还具有醚键的烷基，烯基，芳基或杂环基。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2007162069A Electroless-plated nickel film, machine component having the film, and electroless plating bath 有权
标题翻译：电镀镍膜，电机组件和电镀镀膜
公开(公告)号：JP2007162069A
公开(公告)日：2007-06-28
申请号：JP2005359762
申请日：2005-12-14
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： WATANABE SUMITAKA
IPC分类号： C23C18/36
摘要： PROBLEM TO BE SOLVED: To provide a plating film which has high hardness in a wide temperature range between room temperature and a high-temperature region, is superior in slidability and toughness and can be formed at a high speed, and to provide a machine component of which the sliding part is coated with the plating film, has the high hardness in the wide temperature range and is superior in the slidability.
SOLUTION: The electroless-plated nickel film includes 1-50 mass% Co, 1-20 mass% W and 1-5 mass% P. The machine component has a sliding part. At least, the sliding part is coated with the film. The electroless plating bath includes Ni ions of 0.03 to 0.1 mol/L, Co ions of 0.01 to 0.05 mol/L, WO
4 ions of 0.01 to 0.05 mol/L and a phosphorus compound of 0.15 to 0.30 mol/L.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供在室温和高温区域之间的宽温度范围内具有高硬度的电镀膜，其滑动性和韧性优异并且可以高速形成，并且提供滑动部分涂覆有镀膜的机器部件在宽温度范围内具有高硬度，并且滑动性优异。解决方案：化学镀镍膜包括1-50质量％Co，1-20质量％W和1-5质量％P.该机器部件具有滑动部件。至少滑动部分涂有薄膜。化学镀浴包含0.03〜0.1mol / L的Ni离子，0.01〜0.05mol / L的Co离子，0.01〜0.05mol / L的WO SB / S 4 Sb，0.15〜0.30的磷化合物摩尔/ L。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2012241258A Electroless iridium plating liquid and electroless plating method using the same 审中-公开
标题翻译：电解镀锌液和电镀法使用该方法
公开(公告)号：JP2012241258A
公开(公告)日：2012-12-10
申请号：JP2011114768
申请日：2011-05-23
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： WATANABE SUMITAKA
IPC分类号： C23C18/44
摘要： PROBLEM TO BE SOLVED: To provide an electroless iridium plating liquid and an electroless plating method using the same, capable of forming an iridium plating film with high industrialization applicability and excellent quality directly on a copper material.SOLUTION: The electroless iridium plating liquid contains at least one of a trivalent iridium ion and a tetravalent iridium ion, and a trivalent titanium ion. Examples of a compound that serves as an iridium ion supply source include iridium hexachloride trisodium, and examples of a compound that serves as a titanium ion supply source include titanium trichloride. Use of the electroless iridium plating liquid allows iridium plating to be carried out on a copper material, which has been impossible by conventional technologies.
摘要翻译：要解决的问题：提供一种使用该化学镀的无电镀铱电镀液和无电镀方法，能够直接在铜材上形成具有高工业化适用性和优异品质的铱镀膜。解决方案：无电铱电镀液含有三价铱离子和四价铱离子中的至少一种以及三价钛离子。作为铱离子供给源的化合物的实例包括六氯化铱三钠，作为钛离子供应源的化合物的实例包括三氯化钛。无电镀铱电镀液的使用允许铱电镀在铜材上进行，这通过常规技术是不可能的。版权所有（C）2013，JPO＆INPIT

4. 发明专利

JP2013237895A Film, method for producing the same and mold 审中-公开
标题翻译：膜，其制造方法和模具
公开(公告)号：JP2013237895A
公开(公告)日：2013-11-28
申请号：JP2012111147
申请日：2012-05-15
申请人： Ricoh Co Ltd , 株式会社リコー , Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： MIYAKE KEIICHI , WATANABE SUMITAKA
IPC分类号： C23C26/00 , C23C28/00
摘要： PROBLEM TO BE SOLVED: To provide a film having reduced problems on the environment and safety hygiene and having excellent mold releasability and mold releasing durability, or the like.SOLUTION: In a film, the outer most surface includes a silicate gel-including silicate gel film, and the content of the silicate gel in the silicate gel film is 0.007 to 0.15 mol/mexpressed in terms of silicic acid. An embodiment that a silicate gel film is provided on an electroless nickel plating film, an embodiment that the silicate gel includes at least one kind selected from potassium silicate, lithium silicate, ammonium silicate and sodium silicate, and the like are preferable.
摘要翻译：要解决的问题：提供一种具有降低的环境和安全卫生问题并具有优异的脱模性和脱模耐久性等的膜。溶液：在膜中，最外表面包括含硅酸盐凝胶的硅酸盐凝胶硅酸盐凝胶膜中的硅酸盐凝胶的含量以硅酸计为0.007〜0.15摩尔/摩尔。在化学镀镍膜上设置硅酸盐凝胶膜的实施方式中，优选硅酸盐凝胶包含选自硅酸钾，硅酸锂，硅酸铵，硅酸钠等中的至少一种的实施方式。

5. 发明专利

JP2007321218A Electroless plating liquid, electroless plating method using the same and plated film obtained by the method 审中-公开
标题翻译：电镀液体，使用该方法的电镀法和方法
公开(公告)号：JP2007321218A
公开(公告)日：2007-12-13
申请号：JP2006154872
申请日：2006-06-02
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： WATANABE SUMITAKA
IPC分类号： C23C18/50
摘要： PROBLEM TO BE SOLVED: To provide an electroless plating liquid having low poisonousness, having excellent stability without being influenced by by-products such as phosphorous acid, and also capable of imparting satisfactory plated film properties.
SOLUTION: The electroless plating liquid comprises: a metavanadic acid ion (VO
3
- ), at least one metal ion selected from a nickel ion and a cobalt ion; a complexing agent for the metal ion(s); and a reducing agent for the metal ion(s). By the presence of the metavanadic acid ion, the influence of by-products such as phosphorous acid is reduced, and safety equal to or above that of a lead component-containing electroless plating liquid is secured. The electroless plating liquid comprises the metavanadic acid ion preferably by 10 to 80 mg/L.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种低毒性的化学镀液，其稳定性优异，不受副产物如亚磷酸的影响，并且还能赋予令人满意的镀膜性能。解决方案：化学镀液体包括：偏钒酸离子（VO 3 SB 3），至少一种选自镍离子和钴离子的金属离子; 用于金属离子的络合剂; 和用于金属离子的还原剂。通过偏钒酸离子的存在，可以降低副产物如亚磷酸的影响，并确保等于或高于含铅组分的化学镀液的安全性。化学镀液体中的偏钒酸离子优选为10〜80mg / L。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2007314876A Electroless nickel plating liquid 审中-公开
标题翻译：电镀镍镀液
公开(公告)号：JP2007314876A
公开(公告)日：2007-12-06
申请号：JP2007117124
申请日：2007-04-26
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： SAIKI YUKINORI , WATANABE KENJI , WATANABE SUMITAKA
IPC分类号： C23C18/34
摘要： PROBLEM TO BE SOLVED: To provide an electroless nickel plating liquid having excellent stability and also capable of imparting satisfactory film properties though the content of heavy metals causing the risk of adverse influence for the human body is extremely low.
SOLUTION: The electroless nickel plating liquid comprises: a water soluble nickel salt; a reducing agent; and a complexing agent; and further comprises a hydroxyl amine based stabilizer selected from the group consisting of hydroxyl amine derivatives and the salts thereof. The hydroxyl amine based stabilizer is comprised preferably by 1 to 1,000 mg/L in the electroless nickel plating liquid.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的稳定性并且还能够赋予令人满意的膜性能的化学镀镍液，尽管引起对人体的不利影响的重金属的含量极低。解决方案：化学镀镍液包括：水溶性镍盐; 还原剂; 和络合剂; 并且还包含选自羟基胺衍生物及其盐的羟基胺稳定剂。羟基胺类稳定剂优选在化学镀镍液中为1〜1000mg / L。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2015030885A 無電解Ｎｉ−Ｂめっき皮膜及び機械部品审中-公开
标题翻译： Ni-B电镀薄膜和机器部分
公开(公告)号：JP2015030885A
公开(公告)日：2015-02-16
申请号：JP2013161663
申请日：2013-08-02
申请人：日本カニゼン株式会社 , Nippon Kanizen Kk
发明人： WATANABE SUMITAKA
IPC分类号： C23C18/34
摘要：【課題】熱処理を施さなくても、ビッカース硬度(HV)850以上の高い硬度を有し且つクラックのない無電解ニッケルめっき皮膜を提供すること。【解決手段】ホウ素を0.25重量%〜2.0重量%を含む無電解Ni−Bめっき皮膜であって、皮膜面と入射ビームとのなす角度及び皮膜面と反射ビームとのなす角度が等しい条件で行ったディフラクトメータ法によるX線回折図形においてNiの{111}面の強度F{111}とNiの{200}面の強度F{200}との比OF=F{111}/F{200}が0.1〜20の範囲内であることを特徴とする無電解Ni−Bめっき皮膜である。【選択図】なし
摘要翻译：要解决的问题：提供具有850以上的维氏硬度（HV）的高硬度但不进行热处理的无裂纹的化学镀镍膜。解决方案：无电镀Ni-B镀膜含有硼为0.25重量％至2.0重量％，其特征在于，Ni的{111}面的强度F {111}与强度F {200的比例OF = F {111} / F {200} 在Ni的{200}面的}为0.1〜20的范围内，在X射线衍射图中，通过衍射法，在膜面和入射光束之间形成的角度和角度在膜面和反射光束之间形成的相等。

8. 发明专利

JP2014047223A Zinc ion-adsorbing resin 审中-公开
标题翻译： ZINC离子吸附树脂
公开(公告)号：JP2014047223A
公开(公告)日：2014-03-17
申请号：JP2012188548
申请日：2012-08-29
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： WATANABE SUMITAKA , KUMANO HIDEAKI
IPC分类号： C08J5/20 , B01J20/22 , C23C18/16
摘要： PROBLEM TO BE SOLVED: To provide a technique that can adsorb and remove zinc ions from an electroless nickel plating solution with high selectivity.SOLUTION: A zinc ion-adsorbing resin has an alkyl phosphonic acid having a concentration above 15 wt.% and below 30 wt.% supported on a porous resin base material including an acrylic resin, or a styrene resin with a functional group selected from the group consisting of a sulfo group and an amino group. An alkyl phosphonic acid that may be used is preferably 2-ethylhexyl phosphonic acid mono-2-ethylhexyl.
摘要翻译：要解决的问题：提供一种能够以高选择性从非电解镀镍溶液中吸附和去除锌离子的技术。溶液：锌离子吸附树脂具有浓度高于15重量％和低于30的烷基膦酸重量％负载在包括丙烯酸树脂的多孔树脂基材或具有选自磺基和氨基的官能团的苯乙烯树脂中。可以使用的烷基膦酸优选为2-乙基己基膦酸单-2-乙基己基。

9. 发明专利

JP2013014809A Electroless nickel plating film and electroless nickel plating solution 审中-公开
标题翻译：电镀镍镀层和电镀镍镀层溶液
公开(公告)号：JP2013014809A
公开(公告)日：2013-01-24
申请号：JP2011149138
申请日：2011-07-05
申请人： Nippon Kanizen Kk , 日本カニゼン株式会社
发明人： WATANABE KENJI , WATANABE SUMITAKA
IPC分类号： C23C18/36 , C23C18/50
摘要： PROBLEM TO BE SOLVED: To provide an electroless nickel plating solution which can minimize the contamination of an electroless plating film with environmentally hazardous substances other than nickel, yet has excellent stability, and can provide a plating film having excellent mechanical properties.SOLUTION: The electroless nickel plating film contains 0.5-4 wt.% phosphorus, 0.01-2 wt.% boron, and 0.1-5 wt.% tin. The electroless nickel plating film can be obtained by using the electroless nickel plating solution containing 0.04-0.2 mol/L of nickel ions, 0.09-0.5 mol/L of hypophosphite ions, 1-80 mmol/L of tetrahydro borate ions, and 50-1,000 μmol/L of divalent tin ions.
摘要翻译：要解决的问题：提供一种化学镀镍溶液，其可以使除镍以外的环境有害物质的化学镀膜的污染最小化，但是具有优异的稳定性，并且可以提供具有优异的机械性能的电镀膜。解决方案：化学镀镍膜含有0.5-4重量％的磷，0.01-2重量％的硼和0.1-5重量％的锡。可以通过使用含有0.04-0.2mol / L的镍离子，0.09〜0.5mol / L的次磷酸根离子，1-80mmol / L的四氢硼酸根离子的无电镀镍溶液和50〜 1,000μmol/ L的二价锡离子。版权所有（C）2013，JPO＆INPIT

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