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1. 发明专利

JP2013243398A Laminate for circuit board, metallic base circuit board, and method for manufacturing them 有权
标题翻译：电路板层压板，金属基板电路板及其制造方法
公开(公告)号：JP2013243398A
公开(公告)日：2013-12-05
申请号：JP2013162732
申请日：2013-08-05
申请人： Nhk Spring Co Ltd , 日本発條株式会社 , Sumitomo Chemical Co Ltd , 住友化学株式会社
发明人： KUSAKAWA KOICHI , KOYAMA NOBUAKI , IWASA TAKETOSHI , MIYAKOSHI RYO , KONDO GOJI
IPC分类号： H05K1/05 , H05K3/44
摘要： PROBLEM TO BE SOLVED: To simultaneously attain high withstand voltage and high peel strength.SOLUTION: A method for manufacturing a laminate for a circuit board comprises the steps of: transferring an insulation layer 3' which is formed on a support 5, contains electrical insulating resin 3a' and an electrical insulating inorganic filler 3b and arbitrarily contains solvent from the support 5 to metal foil; and sticking the metal foil and a metal substrate together by sandwiching the insulation layer 3' between them.
摘要翻译：要解决的问题：同时获得高耐受电压和高剥离强度。解决方案：一种用于电路板的层压体的制造方法，包括以下步骤：转移形成在支撑体5上的绝缘层3'，其包含电绝缘树脂3a'和电绝缘无机填充剂3b，并且任意地将来自载体5的溶剂包含在金属箔中; 并且通过将绝缘层3'夹在它们之间，将金属箔和金属基板粘合在一起。

2. 发明专利

JP2012197325A Liquid composition and metal-base circuit board 审中-公开
标题翻译：液体组合物和金属基板电路板
公开(公告)号：JP2012197325A
公开(公告)日：2012-10-18
申请号：JP2011060447
申请日：2011-03-18
申请人： Sumitomo Chemical Co Ltd , Nhk Spring Co Ltd , 住友化学株式会社 , 日本発條株式会社
发明人： MIYAKOSHI RYO , KONDO GOJI , MIZUNO KATSUMI , KOYAMA NOBUAKI
IPC分类号： C08L67/04 , C08K3/00 , C08K3/38 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a liquid composition serving as a material for an insulating film excellent in thermal conductivity and electrical insulating properties, and a metal-base circuit board exhibiting excellent heat releasing properties and reliability.SOLUTION: The liquid composition includes liquid crystalline polyester, a solvent, and boron nitride. In the boron nitride: a boron quantity eluted after one hour when 5 mass% of slurry prepared by adding boron nitride to a solution wherein water:ethanol=8:2 (in a capacity ratio) is maintained at 50°C is 300 ppm or less. Since the boron nitride with a few impurities is combined with the liquid crystalline polyester as a thermal conductive filler, the liquid composition can be used as a material for the insulating film 3 excellent in thermal conductivity and reliability. The insulating film 3 is formed by removing the solvent from a flow cast product of the liquid composition, and the metal-base circuit board 1 is constructed by laminating a metal substrate 2 with a copper foil 4 via the insulating film 3. In this way, heat releasing properties and reliability of the metal-base circuit board 1 are enhanced.
摘要翻译：要解决的问题：提供一种用作导热性和电绝缘性优异的绝缘膜的材料的液体组合物和显示出优异的散热性和可靠性的金属基电路板。液体组合物包括液晶聚酯，溶剂和氮化硼。在氮化硼中：1小时后洗脱的硼量为5质量％，通过将氮化硼添加到水：乙醇= 8:2（以容量比）维持在50℃的溶液中制备的浆料为300ppm或减。由于具有少量杂质的氮化硼与作为导热填料的液晶聚酯组合，液体组合物可以用作导热性和可靠性优异的绝缘膜3的材料。通过从液体组合物的流延产物中除去溶剂而形成绝缘膜3，并且金属基电路板1通过经由绝缘膜3与金属基板2与铜箔4层压而构成。以这种方式，提高了金属基电路板1的散热特性和可靠性。版权所有（C）2013，JPO＆INPIT

3. 发明专利

JP2011205072A Method of manufacturing electronic circuit board 审中-公开
标题翻译：制造电子电路板的方法
公开(公告)号：JP2011205072A
公开(公告)日：2011-10-13
申请号：JP2011024639
申请日：2011-02-08
申请人： Nhk Spring Co Ltd , Sumitomo Chemical Co Ltd , 住友化学株式会社 , 日本発條株式会社
发明人： KONDO GOJI , MIYAKOSHI RYO , MOTOI KAZUHIKO , MIZUNO KATSUMI
IPC分类号： H05K3/38 , H05K3/44
摘要： PROBLEM TO BE SOLVED: To provide a technology to form a liquid crystal polyester film with superior thermal conductivity and adhesivenes, concerning a process for manufacturing of an electronic circuit board.SOLUTION: In manufacturing the electronic circuit board 100 having a substrate for discharge 101, an insulation film 102, and a conductive foil 103, the insulation film 102 is formed by the following procedure. First, a liquid crystal polyester composition containing at least a solvent, liquid crystal polyester, and a thermal conduction filler and having a viscosity of ≥3,000 cP at a predetermined temperature or below is cast on the conductive foil 103 at a predetermined temperature or below. Thereafter, the liquid crystal polyester composition is dried until a remaining amount of the solvent becomes ≤30 mass% at a predetermined temperature or below. Thereby, sedimentation of the thermal conduction filler is suppressed, and therefore the thermal conductivity and adhesiveness of the liquid crystal polyester film is improved.
摘要翻译：要解决的问题：提供一种形成具有优异的导热性和粘附性的液晶聚酯膜的技术，涉及电子电路板的制造工艺。解决方案：在制造具有放电用基板101的电子电路板100时，绝缘膜102和导电箔103，通过以下步骤形成绝缘膜102。首先，在规定的温度以下，在规定的温度以下，至少含有溶剂，液晶聚酯，导热性填充剂，粘度≥3000cP的液晶聚酯组合物，此后，将液晶聚酯组合物干燥直到在预定温度或更低温度下溶剂的剩余量变为≤30质量％。由此，能够抑制热传导性填料的沉降，提高液晶聚酯膜的导热性和粘接性。

4. 发明专利

JP2013091179A Laminate for circuit board and metal base circuit board 审中-公开
标题翻译：电路板和金属基板电路板层压板
公开(公告)号：JP2013091179A
公开(公告)日：2013-05-16
申请号：JP2011233141
申请日：2011-10-24
申请人： Sumitomo Chemical Co Ltd , 住友化学株式会社 , Nhk Spring Co Ltd , 日本発條株式会社
发明人： KONDO GOJI , MIYAKOSHI RYO , NATSUME YUTAKA , MIZUNO KATSUMI
IPC分类号： B32B15/09 , B32B15/08 , C08G69/44 , C08K3/22 , C08K3/38 , C08L77/12
CPC分类号： C08G69/44 , B32B15/09 , B32B27/20 , B32B2264/102 , B32B2264/104 , B32B2307/206 , B32B2307/704 , B32B2457/08 , C09D177/12 , H05K1/056 , H05K2201/0141 , H05K2201/0209
摘要： PROBLEM TO BE SOLVED: To provide a technique useful for making a metal base circuit board excellent in heat radiation, voltage resistance, insulation, and peel strength.SOLUTION: A laminate board 1 for circuit boards comprises a metal substrate 2; an insulation layer 3 provided on the metal substrate 2, and containing a liquid crystal polyester and not less than 50 vol.% and less than 65 vol.% of an inorganic filler; and metal foil 4 provided on the insulation layer 3. The inorganic filler is composed of aluminum oxide and boron nitride. The boron nitride accounts for not less than 10 vol.% and less than 35 vol.% of the inorganic filler. The metal base circuit board is obtained by patterning the metal foil 4 on the laminate board 1 for circuit boards.
摘要翻译：要解决的问题：提供一种用于制造散热性，耐电压性，绝缘性和剥离强度优异的金属基电路板的技术。电路板用层合板1包括金属基板2，绝缘层3，其设置在金属基板2上，并含有不少于50vol。％且小于65vol％的无机填料的液晶聚酯; 和设置在绝缘层3上的金属箔4.无机填料由氧化铝和氮化硼构成。氮化硼占无机填料的10体积％以上且小于35体积％。金属基底电路板是通过在用于电路板的层合板1上的金属箔4图案化而获得的。版权所有（C）2013，JPO＆INPIT

5. 发明专利

JP2011219749A Liquid composition and metal-based circuit board 审中-公开
标题翻译：液体组合物和金属电路板
公开(公告)号：JP2011219749A
公开(公告)日：2011-11-04
申请号：JP2011065641
申请日：2011-03-24
申请人： Nhk Spring Co Ltd , Sumitomo Chemical Co Ltd , 住友化学株式会社 , 日本発條株式会社
发明人： MIYAKOSHI RYO , KONDO GOJI , KOYAMA NOBUAKI , MOTOI KAZUHIKO
IPC分类号： C08L67/00 , C08G63/685 , C08K3/28 , H05K1/05
CPC分类号： H05K1/056 , H05K2201/0141 , H05K2203/0759
摘要： PROBLEM TO BE SOLVED: To improve thermal conductivity and adhesion of an insulating film in a metal-based circuit board comprising a metal substrate, an insulating film and a conductive foil.SOLUTION: There is provided the liquid composition containing a liquid crystal polyester, solvent, and a thermally conductive filler wherein the thermally conductive filler is boron nitride having a volume average particle size of at least 10 μm. The insulating film 3 is formed by removing the solvent from the cast liquid composition. The metal-based circuit board 1 having three layered structure, is formed by laminating the insulating film 3 on a surface of a metal substrate 2, and laminating the conductive foil 5 on the surface of the insulating film 3. The method enhances the thermal conductivity and adhesion of the insulating film 3 even in the case of highly filling the thermally conductive filler in the liquid crystal polyester film.
摘要翻译：要解决的问题：提高包含金属基板，绝缘膜和导电箔的金属基电路板中的绝缘膜的导热性和粘附性。解决方案：提供含有液晶聚酯，溶剂和导热填料的液体组合物，其中导热填料是体积平均粒径至少为10μm的氮化硼。通过从流延液体组合物中除去溶剂而形成绝缘膜3。具有三层结构的金属基电路板1通过在金属基板2的表面上层叠绝缘膜3并将导电箔5层压在绝缘膜3的表面上而形成。该方法提高了导热性并且即使在高度填充液晶聚酯膜中的导热填料的情况下，绝缘膜3也具有粘附性。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2011181833A Metal base circuit board and power module 审中-公开
标题翻译：金属基板电路板和电源模块
公开(公告)号：JP2011181833A
公开(公告)日：2011-09-15
申请号：JP2010046877
申请日：2010-03-03
申请人： Nhk Spring Co Ltd , Sumitomo Chemical Co Ltd , 住友化学株式会社 , 日本発條株式会社
发明人： MIYAKOSHI RYO , KONDO GOJI , KOYAMA NOBUAKI , NATSUME YUTAKA
IPC分类号： H01L23/36 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To greatly improve heat dissipation of a metal base circuit board for a power module including a metal substrate, an insulating layer and a conductive foil.
SOLUTION: The insulating layer 3 interposed between the metal substrate 2 and conductive foil 5 is formed of solvent-soluble liquid crystal polyester. The insulating layer 3 includes an inorganic filler of ≥30 W/(m K) in thermal conductivity. Consequently, the heat dissipation of the metal base circuit 4 is greatly improved to stabilize operation of a heat generating element 6 on the metal base circuit board 4.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了大大改善用于包括金属基板，绝缘层和导电箔的功率模块的金属基底电路板的散热。插入在金属基板2和导电箔5之间的绝缘层3由溶剂可溶的液晶聚酯形成。绝缘层3包括热导率≥30W/（m K）的无机填料。因此，金属基底电路4的散热大大提高，以稳定金属基底电路板4上的发热元件6的运行。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2011201971A Liquid composition and liquid crystal polyester film 审中-公开
标题翻译：液体组合物和液晶聚酯薄膜
公开(公告)号：JP2011201971A
公开(公告)日：2011-10-13
申请号：JP2010068779
申请日：2010-03-24
申请人： Nhk Spring Co Ltd , Sumitomo Chemical Co Ltd , 住友化学株式会社 , 日本発條株式会社
发明人： KONDO GOJI , MIYAKOSHI RYO , KUSAKAWA KOICHI , MIZUNO KATSUMI
IPC分类号： C08L77/12 , C08G69/44 , C08J5/18 , C08K3/36
摘要： PROBLEM TO BE SOLVED: To improve the storage stability of a liquid composition containing a liquid crystal polyester, a solvent and a filler.SOLUTION: The solvent in the liquid composition contains N-methylpyrrolidone in an amount of 50-100 mass% relative to the whole solvent. Silica having an average particle size of ≤100 nm is added to the liquid composition in a ratio of 1-5 mass% to the filler. The ratio of the mass of the liquid crystal polyester to the total mass of the liquid crystal polyester and the solvent is 15-45 mass%. The ratio of the mass of the filler to the total mass of the liquid crystal polyester, the solvent and the filler is 10-75 mass%. Herewith, gelling of the liquid composition and settling of the filler are inhibited and the storage stability of the liquid composition can be improved.
摘要翻译：要解决的问题：提高含有液晶聚酯，溶剂和填料的液体组合物的储存稳定性。溶液：液体组合物中的溶剂含有相对于该液体聚合物为50-100质量％的N-甲基吡咯烷酮全溶剂。与液体组合物的平均粒径≤100nm的二氧化硅以1-5质量％的比例与填料相加。液晶聚酯的质量与液晶聚酯和溶剂的总质量之比为15-45质量％。填料的质量与液晶聚酯，溶剂和填料的总质量的比率为10-75质量％。因此，液体组合物的凝胶化和填料的沉降被抑制，并且可以提高液体组合物的储存稳定性。

8. 发明专利

JP2012253320A Metal base circuit board and light emitting element 有权
标题翻译：金属基板电路板和发光元件
公开(公告)号：JP2012253320A
公开(公告)日：2012-12-20
申请号：JP2012050559
申请日：2012-03-07
申请人： Sumitomo Chemical Co Ltd , 住友化学株式会社
发明人： KONDO GOJI , MIYAKOSHI RYO
IPC分类号： H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a metal base circuit board that does not require special machining to the board, has high flexibility in circuit pattern designing, and is excellent in heat radiation, insulating property, and folding processability.SOLUTION: A conductor circuit is arranged on a metal base via an insulating layer. The insulating layer contains liquid crystal polyester. The liquid crystal polyester includes repeating units represented by general formulas (1), (2), and (3). The thickness of the metal base is 20 to 1,000 μm, the thickness of the insulating layer is 20 to 90 μm, and the thickness of the conductor circuit is 9 to 140 μm. The general formulas are (1)-O-Ar-CO-, (2)-CO-Ar-CO-, and (3)-X-Ar-Y-.
摘要翻译：要解决的问题：为了提供不需要对板进行特殊加工的金属基底电路板，在电路图案设计中具有高灵活性，并且具有优异的散热性，绝缘性和折叠加工性。解决方案：导体电路通过绝缘层布置在金属基底上。绝缘层包含液晶聚酯。液晶聚酯包括由通式（1），（2）和（3）表示的重复单元。金属基体的厚度为20〜1000μm，绝缘层的厚度为20〜90μm，导体电路的厚度为9〜140μm。通式为（1）-O-Ar 1 -CO-，（2）-CO-Ar 2 - 和（3）-X-Ar 3 -Y-。版权所有（C）2013，JPO＆INPIT

9. 发明专利

JP2011124550A Electronic circuit board and manufacturing method of the same 审中-公开
标题翻译：电子电路板及其制造方法
公开(公告)号：JP2011124550A
公开(公告)日：2011-06-23
申请号：JP2010240314
申请日：2010-10-27
申请人： Sumitomo Chemical Co Ltd , 住友化学株式会社
发明人： MIYAKOSHI RYO , KONDO GOJI
IPC分类号： H05K1/05 , H05K3/44
摘要： PROBLEM TO BE SOLVED: To provide an electronic circuit board having an insulating layer excellent in both thermal conductivity and adhesiveness.
SOLUTION: The electronic circuit board 100 is constituted by laminating a metal base 101, a first resin layer 102 containing an inorganic filler, a second resin layer 103 containing no inorganic filler, and metal foil 104 for forming wiring patterns. Since the second resin layer 103 does not contain the inorganic filler, adhesiveness with the metal foil 104 can be improved. Moreover, adhesiveness between the first resin layer 102 and the second resin layer 103 can be improved by forming them with the same resins. Furthermore, a first coating film for the second resin layer 103 is formed on the metal foil 104, and a second coating film for the first resin layer 102 is formed without a solvent removing process, then, the solvent removing process is simultaneously applied to these first coating film and the second coating film. Thereby, adhesiveness between the first resin layer 102 and the second resin layer 103 can be further improved.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有导热性和粘合性优异的绝缘层的电子电路板。解决方案：电子电路板100通过层叠金属基底101，含有无机填料的第一树脂层102，不含无机填料的第二树脂层103和形成布线图案的金属箔104构成。由于第二树脂层103不含无机填料，因此可以提高与金属箔104的粘接性。此外，通过用相同的树脂形成第一树脂层102和第二树脂层103之间的粘附性可以得到改善。此外，在金属箔104上形成第一树脂层103的第一涂膜，在没有溶剂除去工序的情况下，形成第一树脂层102的第二涂膜，然后同时施加溶剂除去工序第一涂膜和第二涂膜。由此，可以进一步提高第一树脂层102和第二树脂层103之间的粘合性。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2013244716A Metal base substrate, and method of manufacturing the same 有权
标题翻译：金属基底板及其制造方法
公开(公告)号：JP2013244716A
公开(公告)日：2013-12-09
申请号：JP2012121891
申请日：2012-05-29
申请人： Sumitomo Chemical Co Ltd , 住友化学株式会社
发明人： MIYAKOSHI RYO , KONDO GOJI , SOGI HIROMITSU
IPC分类号： B29C43/20 , B29C43/34 , B29C43/58 , B32B15/09
摘要： PROBLEM TO BE SOLVED: To provide a metal base substrate which includes a metal layer, an insulation layer, and a metal foil in this order, and has high adhesion strength between the metal foil and insulation layer, and to provide a method of manufacturing the metal base substrate.SOLUTION: There is provided a metal base substrate 1 which is formed in such a way that when an intermediate structure 10 which is formed by laminating a metal layer 11, an insulation layer 12, and a metal foil 13 in this order, and wherein the insulation layer 12 includes liquid crystal polyester and a heat conductive filler is hot-pressed, while being sandwiched between a first press member 81 and a second press member 82 from a side of the metal layer 11 and a side of the metal foil 13, the intermediate structure 10 begins to be pressed under a pressure of 5 MPa or higher after a temperature of the insulation layer 12 reaches a glass transition temperature of the liquid crystal polyester or higher.
摘要翻译：要解决的问题：为了提供包括金属层，绝缘层和金属箔的金属基底，并且在金属箔和绝缘层之间具有高的粘合强度，并且提供一种制造金属基底。解决方案：提供一种金属基底基底1，其形成为当按顺序层叠金属层11，绝缘层12和金属箔13而形成的中间结构体10时，并且其中绝缘层12包括液晶聚酯，并且热压填充物，同时从金属层11的一侧夹在第一压力构件81和第二压力构件82之间，并且金属箔13，在绝缘层12的温度达到液晶聚酯的玻璃化转变温度以上之后，中间结构体10在5MPa以上的压力下开始被压制。

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