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    • 1. 发明专利
    • Lamination components and packaging structure thereof
    • 层压组件及其包装结构
    • JP2006134920A
    • 2006-05-25
    • JP2004319042
    • 2004-11-02
    • Neomax Co Ltd株式会社Neomax
    • UMENO TORUTACHIBANA TAKESHIKATAYAMA YASUHISATADA TOMOYUKI
    • H05K1/18
    • PROBLEM TO BE SOLVED: To provide lamination components which can reduce the packaging height from the lower surface of a printed circuit board to the height of the lamination components and the packaging structure of the lamination components, even when insulation is required on the lower surface of the printed circuit substrate.
      SOLUTION: The project 1a of the center part of the lamination 1 of the lamination component 10 is dropped into the hole 5 of the printed circuit board 4, the electrode 2 formed in both the ends of the lamination 1 and on its front surface is laid in the printed circuit board 4, and the electrode 2 and the printed circuit board 4 are connected electrically and mechanically by a solder 6. Since the project 1a of the lamination 1 is dropped into the hole 5 of the printed circuit board 4, the packaging height from the lower surfaced 4 of the printed circuit board becomes 1 mm in thickness of the lamination components 10 (lamination 1), and the flat structure can be achieved. Since the electrode is not exposed from the lower surface of the printed circuit board 4, the insulation of the lower surface of the printed circuit board 4 can be assured.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:为了提供能够将包装高度从印刷电路板的下表面降低到层压部件的高度和层压部件的包装结构的层压部件,即使在需要绝缘的情况下 印刷电路基板的下表面。 解决方案:层压部件10的层压体1的中心部分的突出部1a落入印刷电路板4的孔5中,形成在层压体1的两端的电极2和其前面 表面被放置在印刷电路板4中,并且电极2和印刷电路板4通过焊料6电连接和机械连接。由于层压体1的突出部1a落入印刷电路板4的孔5中 ,印刷电路板的下表面4的封装高度变为层叠部件10(层叠体1)的1mm厚,能够实现平坦的结构。 由于电极不从印刷电路板4的下表面露出,所以可以确保印刷电路板4的下表面的绝缘。 版权所有(C)2006,JPO&NCIPI
    • 5. 发明专利
    • Laminated substrate and manufacturing method thereof
    • 层压基板及其制造方法
    • JP2006128224A
    • 2006-05-18
    • JP2004311488
    • 2004-10-26
    • Neomax Co Ltd株式会社Neomax
    • TACHIBANA TAKESHIUMENO TORUKATAYAMA YASUHISATADA TOMOYUKI
    • H05K3/46H01F17/00H01L23/12H05K1/16H05K3/20
    • H01L24/97H01L2224/48091H01L2224/48227H01L2924/14H01L2924/15192H01L2924/15787H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated substrate capable of simplifying a process and obtaining the high degree of freedom in electrode design without being affected by the thickness of an electrode, and enabled in flattening a surface. SOLUTION: A desired wiring pattern 11 of silver paste is formed on a green sheet 12 by screen printing (e). Here, a pattern to be an electrode is also printed in addition to a pattern to be a coil. A plurality of green sheets 12 are sequentially subjected to lamination press working to form a laminate 32 (f). The laminate 32 is divided in elements (g), and then baked (h). At this time, on a laminated substrate 1, a surface electrode 2, a bottom electrode 3, and a side electrode 4 are already formed with surfaces flush with all the electrodes. The electrodes 2, 3, and 4 are plated (i). The laminated substrate 1 thus manufactured is mounted with electronic components and resin-molded, to manufacture a composite circuit element. COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种制造能够简化工艺并且获得电极设计中的高自由度而不受电极厚度影响并且能够使表面变平的层叠基板的制造方法。 解决方案:通过丝网印刷(e)在生片12上形成期望的银膏布线图案11。 此外,除了作为线圈的图案之外,还印刷了作为电极的图案。 多个生片12依次进行层压加压加工,形成层叠体32(f)。 将层压体32分成元件(g),然后烘烤(h)。 此时,在层叠基板1上,表面电极2,底部电极3和侧面电极4已经形成有与所有电极齐平的表面。 对电极2,3和4进行电镀(i)。 由此制造的层叠基板1安装有电子部件并进行树脂模制,以制造复合电路元件。 版权所有(C)2006,JPO&NCIPI
    • 6. 发明专利
    • Multilayer inductor and circuit board
    • 多层电感器和电路板
    • JP2006339532A
    • 2006-12-14
    • JP2005164684
    • 2005-06-03
    • Neomax Co Ltd株式会社Neomax
    • KATAYAMA YASUHISAUMENO TORU
    • H01F37/00H01F27/24H01F27/28
    • PROBLEM TO BE SOLVED: To provide a multilayer inductor in which the problem of fringing can be solved, eddy current loss is not increased and a stable magnetic property is acquired, and a circuit board having the multilayer inductor built-in.
      SOLUTION: A coil pattern 2 comprising Ag and a nonmagnetic substance 3 comprising ZrO
      2 for forming a magnetic gap exist between magnetic substances 1 comprising NiCuZn ferrite. The width of the coil pattern 2 in a magnetic gap layer 11 having the coil pattern 2 and the nonmagnetic substance 3 is narrower than that of the coil pattern 2 in a magnetic substance 12 having only the coil pattern 2. Since the width of the coil pattern 2 in the magnetic gap layer 11 is made narrower and the width of the nonmagnetic substance 3 is made wider in this structure, even when a magnetic flux is leaked from a center leg, the leakage magnetic flux does not interlink with the coil pattern 2 (arrow), so that generation of the eddy current loss is prevented.
      COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:为了提供可以解决边缘问题的多层电感器,不会增加涡流损耗并且获得稳定的磁性,并且内置多层电感器的电路板。 解决方案:包含Ag的线圈图案2和包含用于形成磁隙的ZrO 2 SBS的非磁性物质3存在于包含NiCuZn铁氧体的磁性物质1之间。 具有线圈图案2和非磁性物质3的磁隙层11中的线圈图案2的宽度比仅具有线圈图案2的磁性体12中的线圈图案2的宽度窄。由于线圈的宽度 在这种结构中,磁隙层11中的图案2变窄并且使非磁性物质3的宽度变宽,即使当磁通量从中心腿泄漏时,漏磁通也不与线圈图案2相互连接 (箭头),从而防止产生涡流损耗。 版权所有(C)2007,JPO&INPIT
    • 7. 发明专利
    • Stacked inductor and stacked substrate
    • 堆叠电感器和堆叠基板
    • JP2006216916A
    • 2006-08-17
    • JP2005031041
    • 2005-02-07
    • Neomax Co Ltd株式会社Neomax
    • UMENO TORUTACHIBANA TAKESHIKATAYAMA YASUHISA
    • H01F17/04H01F27/24H01F27/255
    • PROBLEM TO BE SOLVED: To provide a stacked inductor that reduces the influence of stress given from a nonmagnetic body as a magnetic gap, and improves DC superposition characteristics, while suppressing deterioration of a magnetic property of a magnetic body, and a stacked substrate incorporating the stacked inductor.
      SOLUTION: There are coil patterns 2 made of Ag and nonmagnetic bodies 3 comprising a material, obtained by adding glass into stabilized ZrO
      2 for forming a magnetic gap, which are sandwiched by a magnetic body 1 containing a Li-Cu-Zn based ferrite. Since Li-based ferrite has high stress resistance, as compared with conventional Ni-based ferrites, the magnetic properties of the magnetic body 1 are less likely to be affected by stresses from the nonmagnetic body 3 produced during the sintering.
      COPYRIGHT: (C)2006,JPO&NCIPI
    • 要解决的问题:提供一种降低由非磁性体产生的应力作为磁隙的影响的叠层电感器,并且在抑制磁性体的磁特性劣化的同时提高直流叠加特性,并且堆叠 结合堆叠电感器的衬底。 解决方案:存在由Ag制成的线圈图案2和包括通过将玻璃添加到用于形成磁隙的稳定的ZrO 2 SBB中获得的材料的非磁性体3,其被磁体1夹持 含有Li-Cu-Zn基铁素体。 由于Li系铁氧体具有高的应力阻力,与以往的Ni系铁氧体相比,磁体1的磁特性不太可能受到烧结时产生的非磁性体3的应力的影响。 版权所有(C)2006,JPO&NCIPI