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1. 发明专利

JP2008258541A Semiconductor device and its manufacturing method 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2008258541A
公开(公告)日：2008-10-23
申请号：JP2007101799
申请日：2007-04-09
申请人： Nec Electronics Corp , Necエレクトロニクス株式会社
发明人： KANEDA YOSHIHARU , SHIMIZU KISHIYO
IPC分类号： H01L23/50
CPC分类号： H01L23/49503 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/27013 , H01L2224/32057 , H01L2224/32245 , H01L2224/32257 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/48699 , H01L2224/73265 , H01L2224/78703 , H01L2224/83051 , H01L2224/83385 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2224/78 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To enhance the adhesion with a resin on the margin, and to prevent crack of the resin. SOLUTION: The device comprises a semiconductor chip 15, a die pad 2 for mounting the semiconductor chip 15, an adhesive 19 for attaching the semiconductor chip 15 to the die pad 2, a plurality of inner leads 3 prepared at the outer periphery of the die pad 2, an outer lead 5 extended from the inner lead 3, a bonding wire 16 which connects the semiconductor chip 15 mounted on the die pad 2 with the inner lead 3, and a resin 17 for sealing an assembly portion consisting of the inner lead 3, the die pad 2, the semiconductor chip 15, the adhesive 19, and the bonding wire 16. The adhesive 19 is arranged on the margin other than the semiconductor chip 15 mounting portion on the die pad 2, and a plurality of dimples 19a are formed on the surface of the adhesive 19. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提高与边缘上的树脂的粘合性，并防止树脂的裂纹。解决方案：该器件包括半导体芯片15，用于安装半导体芯片15的管芯焊盘2，用于将半导体芯片15附接到管芯焊盘2的粘合剂19，在外部周边准备的多个内部引线3 管芯焊盘2的外引线5，从内引线3延伸的外引线5，将安装在管芯焊盘2上的半导体芯片15与内引线3连接的接合线16，以及用于密封由内引线3，芯片焊盘2，半导体芯片15，粘合剂19和接合线16.粘合剂19配置在芯片垫2上的半导体芯片15安装部以外的边缘上，多个凹痕19a形成在粘合剂19的表面上。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008270515A Semiconductor device 审中-公开
标题翻译：半导体器件
公开(公告)号：JP2008270515A
公开(公告)日：2008-11-06
申请号：JP2007111321
申请日：2007-04-20
申请人： Nec Electronics Corp , Necエレクトロニクス株式会社
发明人： SHIMIZU KISHIYO
IPC分类号： H01L23/48 , H01L23/28
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/1305 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent variations in product characteristics caused by inverted mounting of a semiconductor device and can be made excellent in handleability. SOLUTION: A semiconductor device 1 comprises a semiconductor element 11, a resin 12 for sealing the semiconductor element 11, first, second and third leads 13, 14, 15 respectively connected to any of gate, source and drain electrodes of the semiconductor element 11 to be exposed from the back surface side of the resin 12. The first, second, and third leads 13, 14, 15 have extensions 132A, 142A, 152A extended from the back surface side of the resin 12 along the side surface of the resin 12 respectively. The extension 132A of the first lead 13 intersects the extension 142A of the second lead 14 at the side surface of the resin. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以防止由于半导体器件的反向安装引起的产品特性的变化的半导体器件，并且可以使处理性更好。解决方案：半导体器件1包括半导体元件11，用于密封半导体元件11的树脂12，分别连接到半导体的栅极，源极和漏极中的任何一个的第一，第二和第三引线13,14,15 元件11从树脂12的背面侧露出。第一，第二和第三引线13,14,15具有从树脂12的背面侧延伸的延伸部132A，142A，152A，沿着树脂12的侧表面树脂12。第一引线13的延伸部132A在树脂的侧面与第二引线14的延伸部142A相交。版权所有（C）2009，JPO＆INPIT

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