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1. 发明专利

JP2014086664A Wiring board, electronic apparatus, and manufacturing method for wiring board 审中-公开
标题翻译：接线板，电子设备及制造方法
公开(公告)号：JP2014086664A
公开(公告)日：2014-05-12
申请号：JP2012236638
申请日：2012-10-26
申请人： Nec Corp , 日本電気株式会社
发明人： KUBO MASAHIRO , OTSUKA TAKASHI , SHIBUYA AKINOBU , KOKATSU TOSHINOBU
IPC分类号： H05K1/09 , H05K3/24
摘要： PROBLEM TO BE SOLVED: To provide a wiring board in which the conductivity of interconnections can be maintained even if expansion is repeated.SOLUTION: A wiring board 10 on which a plurality of interconnections are arranged while separated from each other includes a substrate 1 expandable in the arrangement direction of the plurality of interconnections, a liquid metal 18 for connecting the plurality of interconnections electrically, and an insulation member 13 expandable in the arrangement direction along with the substrate 1 while sealing the liquid metal 18. The liquid metal 18 has a wiring connection 18a in contact with the plurality of interconnections, and a crest part 18b formed on the side of the wiring connection 18a opposite from the interconnections, and being crushed by expansion of the insulation member 13 and deformed to spread in the arrangement direction.
摘要翻译：要解决的问题：提供即使重复扩展也可以保持互连电导率的布线板。解决方案：在彼此分离布置有多个互连件的布线板10包括可扩展到多个互连的布置方向，用于电连接多个互连的液态金属18，以及在密封液态金属18的同时沿着排列方向与基板1一起膨胀的绝缘构件13.液体金属18具有布线与多个互连件接触的连接部18a以及形成在与连接部相反的配线连接部18a侧的峰部18b，并且由于绝缘部件13的膨胀而被破坏而变形，从而沿排列方向扩展。

2. 发明专利

JP2008294318A Semiconductor device, and manufacturing method thereof 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2008294318A
公开(公告)日：2008-12-04
申请号：JP2007139939
申请日：2007-05-28
申请人： Nec Corp , 日本電気株式会社
发明人： ABE KATSUMI , OSHIMA YOICHI , FUJII KENICHIRO , KOKATSU TOSHINOBU
IPC分类号： H01L25/065 , H01L25/07 , H01L25/18
CPC分类号： H01L24/73 , H01L2224/16145 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/10253 , H01L2924/15311 , H01L2924/00012 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To suppress the quality deterioration of high-frequency signals without using complicated steps in a semiconductor device that is formed by stacking a plurality of semiconductor chips. SOLUTION: Semiconductor chips 1 and 2 are cut out from a semiconductor wafer in such a state that both of the chips are connected to a connection wiring 10 between the chips. Conductor bumps 12 are formed on the wiring layer at the uppermost layer. A thermosetting resin is coated on the semiconductor chip 1 [Fig.(a)], and the semiconductor chip 2 is folded and bonded onto the semiconductor chip 1 [Fig.(b)]. The semiconductor chip is bonded onto a substrate 3 by an adhesive 4 [Fig(c)]. After the semiconductor chip 1 and the substrate 3 are connected by a bonding wire 6 and sealed by a sealing resin 7, an external terminal 9 is formed on the back face of the substrate 3 [Fig.(d)]. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：在通过堆叠多个半导体芯片形成的半导体器件中不使用复杂的步骤来抑制高频信号的质量劣化。解决方案：半导体芯片1和2在两个芯片都连接到芯片之间的连接布线10的状态下从半导体晶片切出。导体凸块12形成在最上层的布线层上。在半导体芯片1上涂布热固性树脂（图（a）]，将半导体芯片2折叠并结合到半导体芯片1上（图（b）]。半导体芯片通过粘合剂4（图（c）]结合到基板3上。在半导体芯片1和基板3通过接合线6连接并被密封树脂7密封之后，在基板3的背面上形成外部端子9（图d）。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2004152917A Wafer supporting device 有权
公开(公告)号：JP2004152917A
公开(公告)日：2004-05-27
申请号：JP2002315097
申请日：2002-10-29
申请人： Nec Corp , 日本電気株式会社
发明人： KOKATSU TOSHINOBU
IPC分类号： H01L21/66 , B23Q1/48 , B23Q16/02 , B23Q17/00 , H01L21/00
CPC分类号： F16F15/0275
摘要： PROBLEM TO BE SOLVED: To provide a wafer supporting device effective in correct detection of contacting positions at respective points of a large diameter wafer and capable of protecting a probe needle upon over-load without damaging the same. SOLUTION: In the wafer supporting device, a movable trestle 4 is guided in the up-and-down direction with respect to a fixed trestle 6 by a cross roller guide 5 and a pusher member 7 for pushing the movable trestle 4 is arranged on the fixed trestle 6, while a contact bar 25 is fixed to the movable trestle 4 and a θ-stage 3 is arranged on the movable trestle 4. An attracting stage 1 is fixed to the θ-stage 3 and an inspection objective work, such as a wafer 2, an individual piece chip or the like, is installed on the attracting stage 1 while the driving member of a sensor housing 20 or a linear motor 16 is arranged on the fixed trestle 6, and a load sensor 21 and a high accuracy displacement sensor 22 are provided on the sensor housing 20. The pusher member 7 is supported by a Z unit 24 and the contact bar 25 is arranged so as to be contacted with the load sensor 21. COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2014197900A 携帯機器の筐体有权
标题翻译：便携式设备的住宅
公开(公告)号：JP2014197900A
公开(公告)日：2014-10-16
申请号：JP2014139535
申请日：2014-07-07
申请人：日本電気株式会社 , Nec Corp
发明人： KOKATSU TOSHINOBU
IPC分类号： H04M1/02 , H05K5/02 , H05K9/00
CPC分类号： H04M1/026 , B29C45/14311 , B29C45/14336 , B29L2031/445 , G06F1/1616 , G06F1/1656 , G06F1/1662 , H04M1/0249 , H04M1/23
摘要：【課題】携帯機器のスイッチ部筺体構造を改良し、薄型化及び小型化に適した構造の携帯機器の筐体を提供する。【解決手段】箱型の金属構造体をプレス加工等によって成形し、この金属構造体100の周辺部分に樹脂を射出成形することにより樹脂外装体200を一体成形している。この金属構造体100のスイッチ受け面101にキースイッチとしてのフレキシブル基板300が配置される。樹脂外装体200と箱型金属構造体100は、接着等はされないが、金属構造体100の連結孔に樹脂が回りこむことで、成形後に両者が分離することはない。これにより、薄型化及び小型化に適した構造の携帯機器の筐体が得られる。【選択図】図6
摘要翻译：要解决的问题：通过改进便携式设备的开关部件壳体结构来提供适合于减小厚度和尺寸的便携式设备的外壳。解决方案：通过冲压加工等模制盒形金属结构，并且通过在金属结构体100周围注塑成型树脂与树脂外部主体200一体形成。用作键开关的柔性基板300设置在金属结构体100的开关接收表面101上。树脂外部本体200未接合到盒状金属结构体100.然而，树脂填充金属结构体100的连接孔，因此树脂外部本体200在成形后不与盒状金属结构体100分离。因此，可以获得适合于减小厚度和尺寸的便携式装置的外壳。

5. 发明专利

JP2013251309A Thermoelectric conversion device 审中-公开
标题翻译：热电转换装置
公开(公告)号：JP2013251309A
公开(公告)日：2013-12-12
申请号：JP2012123097
申请日：2012-05-30
申请人： Nec Corp , 日本電気株式会社
发明人： KUBO MASAHIRO , KYO SHINHIN , SUMINO MASAYOSHI , TONOUCHI NORIYUKI , SHIBUYA AKINOBU , KOKATSU TOSHINOBU
IPC分类号： H01L35/32 , H02N11/00
摘要： PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device capable of being provided in any environment such as a moving installation surface, an uneven surface and a surface including a step.SOLUTION: The thermoelectric conversion device includes: an insulating base material 1; first and second thermoelectric conversion material layers 2 and 3; an insulating layer 4; a first electrode 6; and a second electrode 7. The thermoelectric conversion material layers 2 and 3 are arranged in a side-by-side manner on the insulating base material 1. The insulating layer 4 is formed so as to sandwich the thermoelectric conversion material layers 2 and 3 with the insulating base material 1. The first electrode 6 is formed on an end face facing the insulating base material 1 in each of the thermoelectric conversion material layers 2 and 3. The second electrode 7 is formed on an end face facing the insulating layer 4 in each of the thermoelectric conversion material layers 2 and 3. Each of the insulating base material 1 and the insulating layer 4 has a telescopic portion 10. In such an aspect that the thermoelectric conversion material layers 2 and 3 have any one semiconductor characteristics of P-type semiconductor characteristics and N-type semiconductor characteristics, the second electrode 7 of the thermoelectric conversion material layer 2 is electrically connected to the first electrode 6 of the thermoelectric conversion material layer 3.
摘要翻译：要解决的问题：提供一种能够在诸如移动安装表面，不平坦表面和包括步骤的表面的任何环境中提供的热电转换装置。解决方案：热电转换装置包括：绝缘基材1; 第一和第二热电转换材料层2和3; 绝缘层4; 第一电极6; 和第二电极7.热电转换材料层2,3并排配置在绝缘基材1上。绝缘层4形成为将热电转换材料层2和3夹在绝缘基材1.第一电极6形成在每个热电转换材料层2和3中的面对绝缘基材1的端面上。第二电极7形成在面向绝缘层4的端面上绝缘基材1和绝缘层4中的每一个都具有伸缩部分10.在这样一个方面，热电转换材料层2和3具有P- 型半导体特性和N型半导体特性，热电转换材料层2的第二电极7与第一e电连接导热片6的热电转换材料层3。

6. 发明专利

JP2009117863A Casing for portable equipment 有权
标题翻译：便携式设备
公开(公告)号：JP2009117863A
公开(公告)日：2009-05-28
申请号：JP2009020950
申请日：2009-01-30
申请人： Nec Corp , 日本電気株式会社
发明人： KOKATSU TOSHINOBU
IPC分类号： H05K5/02 , G06F1/16 , G06F3/02 , H04M1/02
CPC分类号： H04M1/026 , B29C45/14311 , B29C45/14336 , B29L2031/445 , G06F1/1616 , G06F1/1656 , G06F1/1662 , H04M1/0249 , H04M1/23
摘要： PROBLEM TO BE SOLVED: To provide a casing for portable equipment having a structure suitable for thickness reduction and size reduction by modifying the structure of a switch section in the casing of the portable equipment. SOLUTION: A box-type metal structure 100 is molded by pressing or the like and a resin is injection molded around the periphery of the metal structure 100 for integral molding of a resin armor body 200. A flexible substrate as a key switch is disposed on a switch receiving face 101 of the metal structure 100. The resin armor body 200 and the box-type metal structure 100 are not subjected to, for example, bonding to each other. Since, however, the resin is sneaked into a connection hole 107 of a metal structure 100, there is no possibility that the resin armor body 200 and the metal structure 100 are separated from each other after molding. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：通过修改便携式设备的壳体中的开关部分的结构，提供具有适于减小厚度和减小尺寸的结构的便携式设备的壳体。解决方案：通过按压等模制盒型金属结构体100，并且在金属结构体100的周围注塑树脂，用于树脂装甲体200的一体成型。作为钥匙开关的柔性基板设置在金属结构体100的开关接收面101上。树脂铠装主体200和盒式金属结构体100不经受例如彼此粘接。然而，由于将树脂潜入金属结构体100的连接孔107中，所以在成形后不会使树脂装甲本体200与金属结构体100相互分离。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2007060316A Portable equipment 有权
标题翻译：便携式设备
公开(公告)号：JP2007060316A
公开(公告)日：2007-03-08
申请号：JP2005243453
申请日：2005-08-24
申请人： Nec Corp , 日本電気株式会社
发明人： KOKATSU TOSHINOBU , YAMANAKA TOSHIKI
IPC分类号： H04M1/02 , H04B1/38
摘要： PROBLEM TO BE SOLVED: To provide portable equipment structured such that a case body made of a metal plate such as a sheet metal is not easily turned over when external force is applied, antenna characteristics are not affected either and the portable equipment can be attained in a small mounting space.
SOLUTION: First and second case bodies 1 and 3 made of the metal plate are piled up and fixed to each other by bolts 4b and an element housing space is formed. An antenna 2 is fixed to the second case body 3 by bolts 4a so as to be adjacent to the first case body 1. A hook part 11 is fixed to the first case body 1, the hook part 11 is inserted to the hole part 21 of the antenna 2, the front lower stage part in a stepped shape of the hook part 11 is locked at the peripheral edge part of the hole part 21 provided on the antenna 2, and the first case body 1 and the antenna 2 are fixed to each other.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供便携式设备，其结构使得当外力施加时，诸如金属板等金属板的壳体不容易翻转，天线特性也不受影响，便携式设备可以可以在小的安装空间中实现。解决方案：由金属板制成的第一和第二壳体1和3通过螺栓4b堆叠并彼此固定，并且形成元件容纳空间。天线2通过螺栓4a固定到第二壳体3上以与第一壳体1相邻。钩部11固定到第一壳体1上，钩部11插入孔部21 天线2的台阶状的前下侧部分被锁定在设置在天线2上的孔部21的周边部分，第一壳体1和天线2固定在彼此。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2014014181A Housing of portable device 有权
标题翻译：便携式设备的住宅
公开(公告)号：JP2014014181A
公开(公告)日：2014-01-23
申请号：JP2013204818
申请日：2013-09-30
申请人： Nec Corp , 日本電気株式会社
发明人： KOKATSU TOSHINOBU
IPC分类号： H04M1/02 , H05K5/02
CPC分类号： H04M1/026 , B29C45/14311 , B29C45/14336 , B29L2031/445 , G06F1/1616 , G06F1/1656 , G06F1/1662 , H04M1/0249 , H04M1/23
摘要： PROBLEM TO BE SOLVED: To provide a housing of a portable device which has a structure suitable for reducing thickness and size by improving a switch part housing structure of the portable device.SOLUTION: A box shaped metal structure is molded by press working or the like, and a resin external body 200 is integrally formed therewith by injection-molding resin in a peripheral portion of the metal structure 100. A flexible substrate 300, which serves as a key switch, is disposed on a switch receiving surface 101 of the metal structure 100. The resin external body 200 is not subjected to bonding or the like to the box shaped metal structure 100. However, the resin flows into connection holes of the metal structure 100, and thus the resin external body 200 is not separated from the box shaped metal structure 100 after molding. Thereby, a housing of a portable device, having a structure suitable for reducing thickness and size, is obtained.
摘要翻译：要解决的问题：提供便携式装置的壳体，其具有适于通过改进便携式装置的开关部件壳体结构来减小厚度和尺寸的结构。解决方案：通过冲压加工等模制盒形金属结构，并且树脂外壳体200通过在金属结构体100的周边部分中注射成型树脂与其一体地形成。用作键开关的柔性基板300设置在金属结构的开关接收表面101上树脂外部主体200不与盒状金属结构体100接合等等。然而，树脂流入金属结构体100的连接孔，因此树脂外部本体200不与盒体分离成型后的金属结构体100。因此，获得了具有适于减小厚度和尺寸的结构的便携式装置的外壳。

9. 发明专利

JP2011089530A Waterproof structure of electronic apparatus, and method for manufacturing the same 有权
标题翻译：电子设备的防水结构及其制造方法
公开(公告)号：JP2011089530A
公开(公告)日：2011-05-06
申请号：JP2009240962
申请日：2009-10-20
申请人： Nec Corp , 日本電気株式会社
发明人： MIKAMI KENSUKE , KOKATSU TOSHINOBU
IPC分类号： F16J15/14 , F16J15/10 , H05K5/06
摘要： PROBLEM TO BE SOLVED: To provide a waterproof structure of an electronic apparatus without hindering reduction in size and thickness, and having sufficient waterproof effect.
SOLUTION: In a casing structure of an electronic apparatus in which a projection 3 formed on an outer peripheral part of a first case member 1 is inserted in a groove 4 formed in an outer peripheral part of a second case member 2 to engage the outer peripheral parts with each other, at least one recess 6 is formed in a bottom surface of the groove 4, and a liquid resin 5 is arranged on a liquid-repellent film 7 coated on a surface of the groove 4 including the recess 6. A plurality of recesses 6 are arranged on both ends of the bottom surface of the groove 4 or over the entire area of the bottom surface, and side faces of the recess 6 are substantially parallel to side faces of the groove 4. The liquid-repellent film 7 has a liquid-repellent effect to the liquid resin 5, and the liquid resin 5 is a member having the rubber elasticity after it is hardened. In the condition in which a space is formed between the liquid resin 5 arranged on the liquid-repellent film 7 of the groove 4 and the recess 6, the projection 3 is inserted in the groove 4 to press the hardened liquid resin 5, and the liquid resin 5 is deformed to engage the first case member 1 with the second case member 2 while the space is filled by the liquid resin.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供电子设备的防水结构，而不妨碍尺寸和厚度的减小，并具有足够的防水效果。解决方案：在电子设备的壳体结构中，其中形成在第一壳体构件1的外周部分上的突起3插入形成在第二壳体构件2的外周部分中的凹槽4中以接合外周部彼此之间形成有至少一个凹部6，该凹部6形成在凹槽4的底面，液体树脂5配置在涂布在包括凹部6的凹槽4的表面上的防液膜7上多个凹槽6布置在凹槽4的底表面的两端或底表面的整个区域上，凹槽6的侧面基本上平行于凹槽4的侧面。防水膜7对液体树脂5具有疏液作用，液体树脂5是硬化后具有橡胶弹性的部件。在布置在槽4的防液膜7上的液体树脂5和凹部6之间形成空间的状态下，将突起3插入凹槽4中以挤压硬化液体树脂5，液体树脂5变形以使第一壳体构件1与第二壳体构件2接合，同时空间被液体树脂填充。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2009022049A Casing for portable device, portable device, and method of manufacturing casing for portable device 有权
标题翻译：便携式设备，便携式设备的制造以及便携式设备的制造方法
公开(公告)号：JP2009022049A
公开(公告)日：2009-01-29
申请号：JP2008265210
申请日：2008-10-14
申请人： Nec Corp , 日本電気株式会社
发明人： KOKATSU TOSHINOBU
IPC分类号： H04M1/02
CPC分类号： H04M1/026 , B29C45/14311 , B29C45/14336 , B29L2031/445 , G06F1/1616 , G06F1/1656 , G06F1/1662 , H04M1/0249 , H04M1/23
摘要： PROBLEM TO BE SOLVED: To provide a casing for a portable device having a structure suitable for reducing the thickness and size by improving the structure of a casing for switches in a portable device, to provide a portable device, and to provide a method of manufacturing the casing for a portable device. SOLUTION: A box-shaped metal structure is formed by press-working or the like, and a resin shell 200 is integrally molded to the periphery of the metal structure 100 by injection molding of a resin. A flexible board 300 for key switches is disposed on a switch-receiving surface 101 of the metal structure 100. The resin shell 200 and the box-shaped metal structure 100 are not bonded together, but the resin fills the connecting holes in the metal structure 100, whereby the shell and the metal structure are kept together after molding. A casing for a portable device having a structure suitable for reducing the thickness and size is thereby obtained. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种便携式装置的壳体，其具有适于通过改进便携式装置中的开关的壳体的结构来减小厚度和尺寸的结构，以提供便携式装置，并且提供一种制造便携式装置的外壳的方法。解决方案：通过压力加工等形成箱形金属结构体，树脂外壳200通过树脂的注塑成型到金属结构体100的周围。用于按键开关的柔性板300设置在金属结构体100的开关接收表面101上。树脂壳体200和盒形金属结构体100不结合在一起，而树脂填充金属结构体中的连接孔 100，由此壳和金属结构在模制之后保持在一起。从而获得了具有适于减小厚度和尺寸的结构的便携式装置的壳体。版权所有（C）2009，JPO＆INPIT

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