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1. 发明专利

JPH05102276A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05102276A
公开(公告)日：1993-04-23
申请号：JP26065091
申请日：1991-10-08
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L21/60 , H01L21/66
摘要： PURPOSE:To enable an assembly failure caused by the positional deviation of a bonding metal wire to be electrically and instantaneously detected by a method wherein a check operation to find that a short circuit occurs between inner leads 18 and 19 and a grounding inner lead 17 or not is carried out at the same time when the characteristics of a semiconductor device is executed. CONSTITUTION:A pattern 15 is provided optionally surrounding bonding pads 13 and 14 provided onto a semiconductor chip 11 and distant from them as prescribed, the pattern 15 is connected to a grounding pad 12 through its peripheral part, the bonding pads 12, 13, and 14 are connected to inner leads 17, 18, and 19 through bonding metal wires 20, 21, and 22, and the assembly concerned is sealed up with sealing resin 23.

2. 发明专利

JPH02238655A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH02238655A
公开(公告)日：1990-09-20
申请号：JP5901889
申请日：1989-03-10
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L23/50
摘要： PURPOSE:To constitute a semiconductor package in which a passive element has been formed collectively and to make a mounting operation easy by a method wherein a capacitor is constituted of the following: an inner lead part of a lead part at a lead frame; an insulator; the lead part. CONSTITUTION:A semiconductor element 5 is mounted, by using a brazing material 4, on a die pad 2 at a lead frame 1 composed of a conductive material; an inner lead part 3a is formed separately at a lead part 3 and is connected collectively to a tip part of the lead part 3 via an insulator 8. Accordingly, it is possible to constitute a capacitor where the insulator 8 is used as a dielectric by means of the lead part 3 and the inner lead part 3a is used as an electrode on the other side; when the capacitor must be connected, a metal wire 6 for bonding use is connected to the inner lead part 3a and this whole assembly is sealed with a sealing resin 7. Thereby, when a semiconductor package is mounted, it is not required to prepare a capacitor as a component to be externally mounted; a mounting operation is made easy; a mounting space can be reduced.

3. 发明专利

JPS63122134A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPS63122134A
公开(公告)日：1988-05-26
申请号：JP26821586
申请日：1986-11-10
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L21/60
摘要： PURPOSE:To avoid electric characteristic defect due to the suspension of metal wirings for bonding and the flow of brazing material for mounting by coating the periphery, the side of a semiconductor element placing part in a lead frame and the ends of external leads, and the side with an electric insulator. CONSTITUTION:A semiconductor element 3 is placed on a lead frame in which the periphery, the side of a semiconductor element placing part 1 in a lead frame, the end and sides of external leads 2 are coated with electric insulator 4, and electrodes on the element 3 and external leads 2 are connected by bonding metal wirings 5. Even if the wirings 5 are suspended as designated by a dotted line 6 at the manufacturing and using stages, electric characteristics are not damaged since the periphery and the sides are coated with the insulator 4.

4. 发明专利

JPS6145613A Integrated circuit 失效
标题翻译：集成电路
公开(公告)号：JPS6145613A
公开(公告)日：1986-03-05
申请号：JP16747484
申请日：1984-08-10
申请人： Nec Corp
发明人： MIYAZAKI SHINICHI , SHIRATORI KEI
IPC分类号： H03F3/45
CPC分类号： H03F3/45197 , H03F3/45098 , H03F2203/45458 , H03F2203/45464
摘要： PURPOSE:To improve a high frequency characteristic by connecting a transistor (TR) between emitters of a couple of TRs forming a differential pair. CONSTITUTION:The collector and base of a TR8 are connected to one of emitter of the TRs forming a differential pair and the emitter of the TR8 is connected to the other. A junction capacitance between the base and emitter of the TR8 acts like a peaking capacitor so as to improve the high frequency characteristic. Since the TR8 is utilized as the peaking capacitor, this circuit is suited to circuit integration.
摘要翻译：目的：通过连接形成差分对的一对TR的发射极之间的晶体管（TR）来提高高频特性。构成：TR8的集电极和基极连接到形成差分对的TR的发射极之一，TR8的发射极连接到另一个。 TR8的基极和发射极之间的结电容像峰值电容一样起作用，以提高高频特性。由于TR8被用作峰值电容器，所以该电路适用于电路集成。

5. 发明专利

JPH04360550A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04360550A
公开(公告)日：1992-12-14
申请号：JP13642991
申请日：1991-06-07
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L21/60 , H01L21/66 , H01L29/41
摘要： PURPOSE:To improve the accuracy of characteristic tests performed on a semiconductor device. CONSTITUTION:Electrodes 3-10 for bonding are provided around a semiconductor element on a semiconductor chip 1 and electrodes 11-14 for tests to be connected to an arbitrary wiring electrode on the chip 1 are provided on a dicing line 2. Since corresponding needle-like electrodes 15-26 are respectively connected to the electrodes 3-10 and 11-14 at the time of performing characteristic tests on the chip 1 while the chip 1 is maintained in the sate of a wafer, the content of the test items can be increased and the propriety of the chip 1 can be discriminated more accurately.

6. 发明专利

JPH02238639A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH02238639A
公开(公告)日：1990-09-20
申请号：JP5901789
申请日：1989-03-10
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L23/12 , H01L21/52
摘要： PURPOSE:To prevent the surface of a semiconductor element from being contaminated by a method wherein a hollow part is formed in an a die pad of a lead frame, one end part of an element-fixing sheet composed of an electrically insulating material is inserted and the semiconductor element is held and supported by the other end part of the element-fixing sheet. CONSTITUTION:In a die pad 2 of a lead frame 1 composed of a conductive material, hollow parts 2a toward the center direction are formed on side faces on both of its sides; one-side ends of nearly U-shaped element fixing sheets composed of an electrically insulating material are inserted into them. A semiconductor element 5 is mounted on the die pad 2; both of its side parts are held by the other-side ends of the element-fixing sheets 4; the element is fixed to the element-mounting part 2. Accordingly, since the semiconductor element 5 is fixed to the die pad 2 by using only the element-fixing sheets 4, a brazing material for mounting use is not required. Thereby, it is possible to prevent the surface of the semiconductor element 5 from being contaminated when the brazing material springs up; it is possible to enhance a manufacturing yield of a semiconductor device and to improve its reliability.

7. 发明专利

JPS63275125A LEAD FRAME 失效
公开(公告)号：JPS63275125A
公开(公告)日：1988-11-11
申请号：JP11180687
申请日：1987-05-07
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L21/52 , H01L23/50
摘要： PURPOSE:To prevent the short-circuit of external leads and the bonding defect of ground metal wires caused by the flowing of solder material, by providing a groove surrounding partially or totally the periphery of a semiconductor element mounting part. CONSTITUTION:A groove 4 formed by extrusion molding from a mounting surface for semiconductor elements is arranged so as to surround partially or totally the pripheral part of a region for mounting a semiconductor elements. A semiconductor element 5 is mounted with a soldering material 6 for mounting. Electrodes on the semiconductor element 5, and external leads 2 and a mounting part 1 for semiconductor element are connected with a metal wire 7 and a ground metal wire 8. By the effect of the groove 4, the soldering material 6 for mounting can be prevented from flowing out at the time of mounting work, so that the generation of short-circuit between the semiconductor mounting part 1 and an external lead part 2, and the bonding defect of the ground metal wire 8 can be prevented.

8. 发明专利

JPS62285457A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62285457A
公开(公告)日：1987-12-11
申请号：JP12957586
申请日：1986-06-03
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L23/50 , H01L21/60 , H01L23/495
摘要： PURPOSE:To free the direction of connections by surrounding the periphery of a pellet loading section partially or collectively by a unified frame consisting of the same quality of materials as a lead. CONSTITUTION:Frames 5, 9 surrounding the periphery of a pellet loading section 1 in a lead frame partially or collectively are unified and formed by the same quality of materials as leads, thus freeing the directions of joining of metallic small-gage wires. When the leads 5, 9 are used for grounding, inductance can be reduced when metallic wires are connected to the unified frame from the upper section of an electrode for a pellet, and high-frequency characteristics are improved.

9. 发明专利

JPS6230356A SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPS6230356A
公开(公告)日：1987-02-09
申请号：JP16886685
申请日：1985-07-31
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L23/50 , H01L21/60 , H01L23/48
摘要： PURPOSE:To improve high frequency characteristic by forming the mount into a circular shape, and radially leading leads from the center of the circular- shaped mount. CONSTITUTION:The mount 1 for mounting a semiconductor element has a circular shape, leads 2-9 are radially led from the center of the mount 1, the distances from the center of the mount 1 to the leads 2-9 are minimized to reduce the lead inductances. Since the mount 1 is circular, the lead inductances from the center of the mount 1 to the leads 2-9 are symmetrical. Thus, the distances from the center of the mount to the leads are minimized to reduce the lead inductances to improve the high frequency characteristics and to improve the symmetry of the lead inductances.

10. 发明专利

JPH05335383A 失效
公开(公告)号：JPH05335383A
公开(公告)日：1993-12-17
申请号：JP16177292
申请日：1992-05-29
申请人： NEC CORP
发明人： SHIRATORI KEI
IPC分类号： H01L21/66
摘要： PURPOSE:To provide a pellet structure wherein the characteristic of a semiconductor wafer-shaped pellet can be inspected and, at the same time, the characteristic rank of the pellet which has been judged to be a good product can be judged. CONSTITUTION:The following are connected in the order of elements 12 (fuse elements) 12, for masking use, capable of being blown, electrode pads 13 for external extraction use and elements (fuse elements) 14, for marking use, capable of being blown: pad parts 3, 5, 7, 9, for bonding use, which are situated at four corners of a pellet 1 in the state of a semiconductor wafer; and pad parts 11, for bonding use, which are situated at four corners of other pellets 2 situated so as to be opposite to the pellet. An electric current is applied to the electrode pads for external extraction use at the pad parts for bonding use; the fuses 12 are blown selectively according to a characteristic rank obtained by a characteristic inspection. Thereby, when the four fuses are combined so as to be blown and so as not to be blown, the characteristic rank can be judged.

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