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    • 1. 发明专利
    • Sample introduction device and sample introduction method
    • 样品介绍设备和样品介绍方法
    • JP2007163188A
    • 2007-06-28
    • JP2005356964
    • 2005-12-09
    • National Institute Of Advanced Industrial & TechnologyScivax KkScivax株式会社独立行政法人産業技術総合研究所
    • NAGAI SHUSUKEMATSUBARA MASAYUKITANAKA YOSHIHIDEWAKITA SHINICHIFUJII MITSURU
    • G01N27/447G01N1/00G01N37/00
    • PROBLEM TO BE SOLVED: To provide a sample introduction device and a sample introduction method capable of introducing an optional amount of sample without being restricted by the length of an offset of a double-T type microchip. SOLUTION: In this sample introduction method for introducing a prescribed amount of sample 50 from a sample supply part into an analysis part by using the double-T type microchip 1 having a main passage 11 for sending either of electrolyte solution supplied from an electrolyte solution supply part and the sample 50 to be electrophoresed supplied from the sample supply part to the analysis part side for analyzing the sample 50, a sample supply passage 12 for supplying the sample 50 from the sample supply part to the main passage 11, and a sample discharge passage 13 for discharging the sample 50 from the main passage 11, a prescribed electric field is applied to the main passage 11, the sample supply passage 12 and the sample discharge passage 13 as long as a prescribed time, to thereby move the sample 50 in the sample discharge passage 13 to the analysis part side of the main passage 11. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种能够引入可选量的样品而不受双T型微芯片的偏移长度的限制的样品引入装置和样品引入方法。 解决方案:在该样品引入方法中,通过使用具有主通道11的双T型微芯片1将样品供应部分的规定量的样品50引入分析部件,用于将从 电解液供给部以及从样品供给部供给到分析部分侧的电泳样品50,以分析样品50;样品供应通道12,用于从样品供应部分向主通道11供应样品50;以及 用于将样品50从主通道11排出的样品排出通道13,只要规定的时间,将规定的电场施加到主通道11,样品供给通道12和样品排出通道13,从而使 样品排出通道13中的样品50到主通道11的分析部分侧。版权所有(C)2007,JPO&INPIT
    • 2. 发明专利
    • Processing device capable of controlling relative displacement between mold and workpiece or the like
    • 能够控制模具和工件之间的相对位移或类似的处理装置
    • JP2006289505A
    • 2006-10-26
    • JP2005109078
    • 2005-04-05
    • Scivax KkScivax株式会社
    • KUSUURA TAKAHISAFUJII MITSURU
    • B81C99/00H01L21/027
    • PROBLEM TO BE SOLVED: To provide a processing device capable of controlling a mold releasing which can control the position between the pattern surface of the mold and the surface to be processed of a workpiece, and the displacement speed changing the position between the pattern surface and the surface to be processed at micrometer level or nanometer level. SOLUTION: The processing device presses the mold 100 having a predetermined pattern and the workpiece 200 to copy the pattern of the mold to the workpiece 200. The processing device is equipped with a displacement means 5 capable of controlling the relative position between the mold 100 and the workpiece 200 and the displacement speed changing the position, an excitation means 6 applying the vibration to at least either the mold 100 or the workpiece 200, a position detection means 7 detecting the relative position between the mold 100 and the workpiece 200, a pressure detection means 8 detecting the pressure between the mold 100 and the workpiece 200, and a control means 300 controlling the operation of the displacement means 5 and the excitation means 6 based on the detection information of the position detection means 7 and the pressure detection means 8. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供一种能够控制可以控制模具的图案表面与待加工的表面之间的位置的脱模的处理装置,并且所述位移速度改变在所述模具的位置之间的位置 图案表面和要在微米级或纳米级处理的表面。 解决方案:处理装置按压具有预定图案的模具100和工件200以将模具的图案复制到工件200.处理装置配备有位移装置5,其能够控制模具100之间的相对位置 模具100和工件200,位移速度改变位置;激励装置6,将振动施加到模具100或工件200中的至少一个;位置检测装置7,检测模具100和工件200之间的相对位置 ,检测模具100和工件200之间的压力的压力检测装置8,以及基于位置检测装置7的检测信息和压力控制位移装置5和激励装置6的操作的控制装置300 检测手段8.版权所有(C)2007,JPO&INPIT
    • 3. 发明专利
    • Mold for microfabrication
    • 用于微生物的模具
    • JP2006327007A
    • 2006-12-07
    • JP2005153403
    • 2005-05-26
    • Scivax KkScivax株式会社
    • KUSUURA TAKAHISAFUJII MITSURU
    • B29C59/02H01L21/027
    • PROBLEM TO BE SOLVED: To provide a mold having high durability, a small flatness value and good mold releasability, and its production method. SOLUTION: The mold 100 is pressed against the molding face of the workpiece 200 to transfer a pattern. It has the mold main part 1 that is formed of a first material and has the flat surface 11 of a predetermined flatness or below and the pattern part 2 that is formed on the flat surface 11 with a second material higher in durability than the first material and is used for transferring the pattern to the workpiece. COPYRIGHT: (C)2007,JPO&INPIT
    • 要解决的问题:提供具有高耐久性,小平整度值和良好脱模性的模具及其制造方法。 解决方案:将模具100压靠在工件200的模制面上以转移图案。 其具有由第一材料形成并具有预定平坦度或更小的平坦表面11的模具主体部分1和形成在平坦表面11上的图案部分2,其中第二材料的耐久性比第一材料高 并用于将图案转印到工件上。 版权所有(C)2007,JPO&INPIT
    • 4. 发明专利
    • Method of microfabrication under controlled pressure, and microfabrication apparatus
    • 控制压力下微生物的方法和微生物装置
    • JP2008294009A
    • 2008-12-04
    • JP2005256479
    • 2005-09-05
    • Scivax KkScivax株式会社
    • KUSUURA TAKAHISAFUJII MITSURU
    • H01L21/027B29C59/02B81C99/00B82B3/00
    • B29C59/022B29C2059/023
    • PROBLEM TO BE SOLVED: To provide a method of microfabrication by which the adhesion of a die with a processing object (resin or the like) is inhibited, and shape loss of the pattern transferred to the processing object is prevented, and to provide a microfabrication apparatus. SOLUTION: A method for microfabrication in which pressure is applied to a die 100 with a given pattern and a processing object 200 to transfer a pattern onto a surface to be shaped of the processing object 200, includes a heating step of heating the die 100 and the processing object 200 at respective given temperatures, and a pressure application step of pressing the die 100 and the processing object 200 at a pressure of 1 MPa or below after the heating step. Furthermore, there is provided the microfabrication apparatus 1 for realizing the microfabrication method. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种微加工方法,通过该方法可以抑制模具与加工对象(树脂等)的粘附,并且防止转印到加工对象物上的图案的形状损失,并且 提供微细加工装置。 解决方案:一种微型加工方法,其中以给定图案向模具100施加压力,并将加工对象200加工成待处理对象200成型表面上的图案,包括加热步骤 模具100和处理对象200;以及压力施加步骤,在加热步骤之后,在1MPa以下的压力下对模具100和加工对象200进行加压。 此外,提供了用于实现微细加工方法的微细加工装置1。 版权所有(C)2009,JPO&INPIT