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1. 发明专利

JP2007225532A Infrared sensor and manufacturing method therefor 有权
标题翻译：红外传感器及其制造方法
公开(公告)号：JP2007225532A
公开(公告)日：2007-09-06
申请号：JP2006049492
申请日：2006-02-27
申请人： National Institute Of Advanced Industrial & Technology , Nec Corp , 日本電気株式会社 , 独立行政法人産業技術総合研究所
发明人： TSUCHIYA TETSUO , MIZUTA SUSUMU , KUMAGAI TOSHIYA , SASAKI NARIHITO , KURASHINA HARUJI
IPC分类号： G01J1/02 , H01L37/00
CPC分类号： G01J5/20
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method suitable for mass production and having the effects of improving TCR in an infrared sensor, using vanadium oxide as a resistor for bolometer.
SOLUTION: The method of manufacturing an infrared sensor includes a process for forming a bridge structure 2 by an insulation material on an Si substrate 1; a process for forming a vanadium oxide thin film by a dry film forming method on the bridge structure; a process for changing the material, characteristics by irradiating the formed vanadium oxide thin film with a laser beam; a process for forming the vanadium oxide thin film 4 changing the material characteristics as the resistor 4' for the bolometer of a prescribed pattern; and a process for forming the resistor for the bolometer formed on the prescribed pattern and a protective layer 6 by the insulation material so as to cover the bridge structure.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供适合于批量生产并且具有改善红外传感器中的TCR的效果的制造方法，使用氧化钒作为测辐射热计的电阻器。解决方案：制造红外线传感器的方法包括通过Si衬底1上的绝缘材料形成桥结构2的工艺; 通过干式成膜法在桥结构上形成氧化钒薄膜的方法; 通过用激光束照射所形成的氧化钒薄膜来改变材料的特性的方法; 形成氧化钒薄膜4的方法，该方法改变作为规定图案的辐射热计的电阻器4'的材料特性; 以及通过绝缘材料形成用于形成在规定图案上的测辐射热板的电阻器和保护层6以覆盖桥结构的工艺。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2013222735A Infrared ray sensor package, infrared ray sensor module, and electronic apparatus 有权
标题翻译：红外线传感器包，红外线传感器模块和电子设备
公开(公告)号：JP2013222735A
公开(公告)日：2013-10-28
申请号：JP2012091535
申请日：2012-04-13
申请人： Nec Corp , 日本電気株式会社
发明人： YAMAZAKI TAKAO , KURASHINA HARUJI
IPC分类号： H01L23/26
CPC分类号： G01J5/045 , G01J5/048 , G01J5/061 , H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an infrared ray sensor package capable of keeping the gas adsorption performance of a getter while suppressing the performance deterioration of an infrared ray sensor element; an infrared ray sensor module; and an electronic apparatus.SOLUTION: An infrared ray sensor package 17 at least includes: an infrared ray sensor element 1; a base substrate portion 2; a housing portion 3; an infrared ray transmission window 5; and a getter 6a. The infrared ray sensor element 1 is vacuum-sealed in a space surrounded by the base substrate portion 2, the housing portion 3, and the infrared ray transmission window 5. The getter 6a is disposed in a cavity 9 between the infrared ray sensor element 1 and the base substrate portion 2 which is formed by disposing a spacer 8 between the infrared ray sensor element 1 and the base substrate portion 2. A shielding member 12 is disposed between the infrared ray sensor element 1 and the getter 6a, and the shielding member 12 is a heater for heating the infrared ray sensor element 1, or an element at least made from an alloy including Ni or heat-resistant glass.
摘要翻译：要解决的问题：提供能够在抑制红外线传感器元件的性能劣化的同时保持吸气剂的气体吸附性能的红外线传感器封装; 红外线传感器模块; 和电子设备。解决方案：红外线传感器封装17至少包括：红外线传感器元件1; 基底部2; 壳体部3; 红外线透射窗5; 和吸气剂6a。红外线传感器元件1被由基底部分2，壳体部分3和红外线透射窗5包围的空间中真空密封。吸气剂6a设置在红外线传感器元件1 以及通过在红外线传感器元件1和基底部分2之间设置间隔件8而形成的基底部分2.屏蔽构件12设置在红外线传感器元件1和吸气剂6a之间，屏蔽构件 12是用于加热红外线传感器元件1的加热器或至少由包括Ni或耐热玻璃的合金制成的元件。

3. 发明专利

JP2012002603A Bolometer type terahertz wave detector 有权
标题翻译： BOLOMETER TYPE TERAHERTZ波检测器
公开(公告)号：JP2012002603A
公开(公告)日：2012-01-05
申请号：JP2010136499
申请日：2010-06-15
申请人： Nec Corp , 日本電気株式会社
发明人： KURASHINA HARUJI , ODA NAOKI
IPC分类号： G01J1/02
CPC分类号： G01J5/20 , G01J5/02 , G01J5/023 , G01J5/024 , G01J5/08 , G01J5/0853 , H01L27/14669 , H01L31/085
摘要： PROBLEM TO BE SOLVED: To provide a high-sensitivity bolometer type THz wave detector.SOLUTION: The bolometer type THz wave detector has a thermal isolation structure in which a support part including electric wiring connected to a readout circuit formed on a substrate supports a temperature detection part including a bolometer thin film connected to the electric wiring and eaves formed extending inward and outward from a peripheral edge of the temperature detection part such that they float over the substrate. A reflection film is formed which has one or a plurality of holes in parts of the eaves formed extending inward from the peripheral edge of the temperature detection part among the eaves, and reflects a THz wave to a position on the substrate opposed to the temperature detection part, and an absorption film which absorbs the THz wave is formed on the eaves, the reflection film and absorption film forming an optical resonance structure.
摘要翻译：要解决的问题：提供一种高灵敏度测辐射热谱仪型号太赫兹波检测器。解决方案：测辐射热表型太赫兹波检测器具有热隔离结构，其中包括连接到形成在基板上的读出电路的电线的支撑部分支持温度检测部分，该温度检测部分包括连接到电线和檐口的测辐射热计薄膜其形成为从温度检测部的周缘向内侧和外侧延伸，从而使其浮在基板上。形成反射膜，其在从屋檐中的温度检测部的周缘向内侧形成的檐部的一部分中具有一个或多个孔，并将THz波反射到与温度检测相对的基板上的位置部分，并且在屋檐上形成吸收太赫兹波的吸收膜，反射膜和吸收膜形成光学共振结构。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2014160877A Vacuum sealed package, printed circuit board with vacuum sealed package, electronic apparatus and manufacturing method of vacuum sealed package 审中-公开
标题翻译：真空密封包装，真空密封包装印刷电路板，真空密封包装的电子设备和制造方法
公开(公告)号：JP2014160877A
公开(公告)日：2014-09-04
申请号：JP2014112708
申请日：2014-05-30
申请人： Nec Corp , 日本電気株式会社
发明人： YAMAZAKI TAKAO , SANO MASAHIKO , KURASHINA HARUJI
IPC分类号： H01L23/26 , G01J1/02 , G01J5/04
CPC分类号： H05K5/066 , G01J5/029 , G01J5/045 , H01L23/057 , H01L23/10 , H01L23/26 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15192 , H01L2924/16151 , H01L2924/16152 , H01L2924/19107 , H01L2924/3025 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To perform vacuum sealing of a package main body according to a simple system without using any expensive vacuum device.SOLUTION: A vacuum sealed package comprises: a package main body 4 in which a first main body part 1 and a second main body part 2 are joined via a hollow part 3; a getter material G provided within the hollow part 3 of the package main body 4; and an electronic device E. The vacuum sealed package seals the package main body 4 in the state where the hollow part 3 is vacuumed via a through hole 5 communicating the inside of the hollow part 3 and the outside of the package main body 4. In the vicinity of the through hole 5, a low fusing point portion 31 is provided which is partially heated and fused to close the through hole 5 under vacuum. In the vicinity of the through hole 5, the getter material G is mounted or deposited on a surface of the package main body 4 within the hollow part, and a distance between the getter material G and the through hole 5 is set in such a manner that the low fusing point portion 31 can be fused by waste heat.
摘要翻译：要解决的问题：根据简单的系统进行包装主体的真空密封，而不使用任何昂贵的真空装置。解决方案：真空密封包装包括：包装主体4，其中第一主体部分1和第二主体部分1 主体部分2通过中空部分3连接; 设置在包装主体4的中空部3内的吸气材料G; 和电子装置E.真空密封包装件通过连通中空部分3的内部和包装主体4的外部的通孔5将中空部分3抽真空的状态密封包装主体4.在设置通孔5附近，设置低熔点部分31，其被部分加热和熔化，以在真空下关闭通孔5。在通孔5的附近，吸气材料G被安装或沉积在中空部分内的包装主体4的表面上，并且吸气材料G和通孔5之间的距离被设定为低熔点部分31可以通过废热熔化。

5. 发明专利

JP2005116856A Thermal infrared solid-state imaging device and its manufacturing method 有权
标题翻译：热红外固态成像装置及其制造方法
公开(公告)号：JP2005116856A
公开(公告)日：2005-04-28
申请号：JP2003350430
申请日：2003-10-09
申请人： Nec Corp , Nippon Denki Shinku Glass Kk , 日本電気株式会社 , 日本電気真空硝子株式会社
发明人： TOYAMA SHIGERU , KURASHINA HARUJI
IPC分类号： H01L27/14 , G01J5/20 , H01L37/00
CPC分类号： G01J5/20
摘要： PROBLEM TO BE SOLVED: To provide a thermal infrared solid-state imaging device and its manufacturing method in which the deterioration of a thermal response characteristic can be suppressed by surely removing eaves forming members deposited on an infrared light receiving part (diaphragm) without increasing a manufacturing process and a construction period.
SOLUTION: In the thermal infrared solid-state imaging device, a diaphragm 5 is held in hollow by a supporting part 6, and eaves 10 are provided to cover the supporting part 6 while connecting their one-side ends to the outer periphery of the diaphragm 5 when forming the eaves 10. A second sacrifice layer 7 for forming a space between the supporting part 6 and the eaves 10 is formed like an island not only in the supporting part 6 but also in the center of the diaphragm 5. The island-like second sacrifice layer 7 separates the diaphragm 5 and an eaves forming insulating film 8, thereby surely removing the eaves forming insulating film 8 in the center of the diaphragm 5 without damaging the diaphragm 5. Furthermore, an increase in thermal capacitance caused by the residual unnecessary eaves forming insulating film 8 is suppressed and the deterioration of the thermal response characteristic is suppressed.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种热红外固体摄像器件及其制造方法，其中可以通过确保去除沉积在红外光接收部分（隔膜）上的檐形成部件来抑制热响应特性的劣化，而不增加制造过程和施工期。解决方案：在热红外固体摄像器件中，隔膜5由支撑部分6保持在中空中，并且设置檐10以覆盖支撑部6，同时将其一侧端连接到外周在形成屋檐10时，形成隔膜5。在支撑部6和檐10之间形成空间的第二牺牲层7不仅形成在支撑部6中，而且在隔膜5的中心形成为岛状。岛状的第二牺牲层7分隔隔膜5和形成屋檐的绝缘膜8，从而可靠地移除在隔膜5的中心形成绝缘膜8而不破坏隔膜5.此外，导致热容的增加通过残留的不必要的檐形成绝缘膜8被抑制，并且热响应特性的劣化被抑制。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2012194080A Bolometer type thz wave detector 审中-公开
标题翻译： BOLOMETER型THZ波检测器
公开(公告)号：JP2012194080A
公开(公告)日：2012-10-11
申请号：JP2011058693
申请日：2011-03-17
申请人： Nec Corp , 日本電気株式会社
发明人： KURASHINA HARUJI , MIYOSHI MASARU
IPC分类号： G01J1/02
CPC分类号： G01J5/045 , G01J5/0215 , G01J5/0225 , G01J5/024 , G01J5/06 , G01J5/0853 , G01J5/20
摘要： PROBLEM TO BE SOLVED: To provide a high-sensitivity bolometer type THz wave detector which can be manufactured with a high manufacturing yield ratio.SOLUTION: A bolometer type THz wave detector has a thermal isolation structure in which a supporting unit including electrical wiring connected to a readout circuit formed in a substrate supports a temperature detecting unit including a bolometer thin film connected to the electrode wiring with a gap from the substrate. A reflective film reflecting THz waves is formed in a position on the substrate facing the temperature detecting unit, and an absorbing film absorbing the THz waves is formed on the front face, rear face of or inside the temperature detecting unit. The reflective film and the absorbing film form an optical resonant structure, and a dielectric body transparent to the THz waves is formed on the reflective film. The film thickness of the dielectric body is set such that the interval (air gap) between the upper surface of the dielectric body and the lower surface of the temperature detecting unit is less than 8 μm.
摘要翻译：要解决的问题：提供可以以高制造成品率制造的高灵敏度测辐射热谱仪型的太赫兹波检测器。解决方案：测辐射热计型太赫兹波检测器具有热隔离结构，其中包括连接到形成在基板中的读出电路的电线的支撑单元支撑温度检测单元，该温度检测单元包括连接到电极布线的测辐射热计薄膜，与基板间隙。在面向温度检测单元的基板上形成反射太赫兹波的反射膜，并且在温度检测单元的正面，背面或内部形成吸收太赫兹波的吸收膜。反射膜和吸收膜形成光学谐振结构，并且在反射膜上形成对THz波透明的电介质体。电介质体的膜厚设定为使得电介质体的上表面与温度检测单元的下表面之间的间隔（气隙）小于8μm。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2010210293A Thermal infrared sensor, and method for manufacturing the same 有权
标题翻译：热红外传感器及其制造方法
公开(公告)号：JP2010210293A
公开(公告)日：2010-09-24
申请号：JP2009054227
申请日：2009-03-06
申请人： Nec Corp , 日本電気株式会社
发明人： SHIMOMURA TOMOKO , MIYOSHI MASARU , KURASHINA HARUJI
IPC分类号： G01J1/02 , G01J5/48 , H01L27/14 , H01L37/02
摘要： PROBLEM TO BE SOLVED: To improve detection sensitivity of a thermal infrared sensor by increasing an infrared absorption rate of an infrared-absorbing layer.
SOLUTION: This thermal infrared sensor includes: an infrared-receiving section 11; and an infrared-absorbing film held through a hollow section on a circuit board 1 for transmitting heat acquired by thermally converting incident infrared rays to the infrared-receiving section 11. A projecting section or a recessed section having a width which is larger than the film thickness of the infrared-absorbing film, and less than ten times the film thickness is formed on an infrared-incident surface of the infrared-absorbing film and on a transmission surface on the hollow section side which is the rear surface of the incident surface.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过增加红外线吸收层的红外吸收率来提高热红外传感器的检测灵敏度。解决方案：该热红外传感器包括：红外线接收部分11; 以及红外线吸收膜，其通过电路板1上的中空部保持，用于将通过将入射的红外线热转换为红外线接收部11而获得的热量。具有大于该膜的宽度的突出部或凹部在红外线吸收膜的红外线入射面和作为入射面的背面的中空部侧的透射面上形成红外线吸收膜的厚度，薄膜厚度的10倍以下。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009135296A Vacuum package and manufacturing method thereof 有权
标题翻译：真空包装及其制造方法
公开(公告)号：JP2009135296A
公开(公告)日：2009-06-18
申请号：JP2007310694
申请日：2007-11-30
申请人： Nec Corp , 日本電気株式会社
发明人： SOKAWA SADAMICHI , YAMAZAKI TAKAO , SANO MASAHIKO , KURASHINA HARUJI , AKIMOTO YUJI
IPC分类号： H01L23/02 , G01J1/02
CPC分类号： H01L23/057 , B81C1/00285 , B81C2203/0145 , H01L23/047 , H01L24/45 , H01L24/48 , H01L27/14618 , H01L31/0203 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/16151 , H01L2924/16195 , H01L2924/00 , H01L2924/20753 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a vacuum package which achieves a high vacuum without being made large and without causing a sealing defect and a functional defect, and to provide a manufacturing method thereof.
SOLUTION: The vacuum package 100 includes an infrared photodetector 1 vacuum-sealed in a chamber 6, an infrared transmissive window 12 forming the chamber 6, a spacer 9, and a photodetector substrate 3. The infrared transmissive window 12 has a through-hole 13 for degassing the inside of the chamber 6, and the through-hole 13 is sealed with a sealing material 15. A corner portion of the infrared transmissive window 12 forming the through-hole 13 has an obtuse angle. An inner wall of the through-hole 13 has a first tapered surface decreasing the aperture area of the through-hole from an external surface side to an internal surface side of the chamber 6 and a second tapered surface decreasing the aperture area of the through-hole 13 from the internal surface side to the external surface side of the chamber 6, and the first tapered surface is formed closer to the external surface side of the chamber 6 than the second tapered surface. Further, a pad 14 for the sealing material 15 is formed only on the first tapered surface of the internal wall of the through-hole 13.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种真空包装，其能够实现高真空而不会变大并且不会引起密封缺陷和功能缺陷，并提供其制造方法。解决方案：真空封装100包括真空密封在室6中的红外光电检测器1，形成室6的红外透射窗12，间隔件9和光电检测器基板3.红外透射窗12具有通孔用于对腔室6内部进行脱气的孔13，并且用密封材料15密封通孔13.构成通孔13的红外透射窗12的角部具有钝角。通孔13的内壁具有使从通孔的开口面积减小到室6的外表面侧到内表面侧的第一锥面，以及减小贯通孔13的开口面积的第二锥面，孔13从室6的内表面侧到外表面侧，并且第一锥形表面形成为比第二锥形表面更靠近室6的外表面侧。此外，用于密封材料15的焊盘14仅形成在通孔13的内壁的第一锥形表面上。（C）2009，JPO＆INPIT

9. 发明专利

JP2011035436A Method of manufacturing vacuum package 审中-公开
标题翻译：制造真空包装的方法
公开(公告)号：JP2011035436A
公开(公告)日：2011-02-17
申请号：JP2010263446
申请日：2010-11-26
申请人： Nec Corp , 日本電気株式会社
发明人： SOKAWA SADAMICHI , YAMAZAKI TAKAO , SANO MASAHIKO , KURASHINA HARUJI , AKIMOTO YUJI
IPC分类号： H01L23/02
CPC分类号： H01L2224/48091 , H01L2224/48227 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a vacuum package to achieve high vacuum without generating poor sealing nor malfunction.
SOLUTION: The method of manufacturing the vacuum package includes a step of setting a package with a through-hole formed thereon in a vacuum chamber with a transmitting window, a step of decompressing inside the vacuum chamber, a step of placing sealing material in the through-hole, and a step of sealing the through-hole by irradiation of a laser onto the sealing material through the transmittance window from outside the vacuum chamber.
COPYRIGHT: (C)2011,JPO&INPIT

10. 发明专利

JP2009192350A Thermal type infrared detector and manufacturing method therefor 有权
标题翻译：热式红外探测器及其制造方法
公开(公告)号：JP2009192350A
公开(公告)日：2009-08-27
申请号：JP2008032885
申请日：2008-02-14
申请人： Nec Corp , 日本電気株式会社
发明人： KURASHINA HARUJI
IPC分类号： G01J1/02 , G01J5/20 , H01L37/00
CPC分类号： G01J5/20 , G01J5/02 , G01J5/024 , G01J5/04 , G01J5/046 , G01J5/08 , G01J5/0853 , G01J5/22 , G01J2005/068
摘要： PROBLEM TO BE SOLVED: To provide a thermal infrared detector that is formed in a structure having a first element in which a temperature sensing section is held in midair in an air space and a second element in which a temperature sensing section is disposed on a remaining sacrifice layer, allows temperature of the temperature sensing section of the second element to accurately follow that of a substrate and can prevent a trouble during the removal of a sacrifice layer, and to provide a method for manufacturing the thermal infrared detector. SOLUTION: In the thermal infrared detector, the first element 1a for detecting infrared rays and the second element 1b for correcting ambient temperature are formed on a circuit substrate 2. The temperature sensing section 14 of the first element 1a is thermally isolated from the circuit substrate 2 by an air space 15. The temperature sensing section 14 of the second element 1b is formed on a first sacrifice layer 5 made of diamond like carbon remaining in the air space and is thermally coupled to the circuit substrate 2 via the first sacrifice layer 5. An output signal of the temperature sensing section 14 is transmitted to a read-out circuit 2a via an electrode wire 9 and a difference in an output signal is detected by the read-out circuit 2a. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种形成在具有第一元件的结构中的热红外检测器，其中温度感测部分保持在空气空间的空中，第二元件设置有温度感测部分在剩余的牺牲层上允许第二元件的温度感测部分的温度精确地跟随衬底的温度，并且可以防止在去除牺牲层期间的麻烦，并提供制造热红外检测器的方法。解决方案：在热红外检测器中，用于检测红外线的第一元件1a和用于校正环境温度的第二元件1b形成在电路基板2上。第一元件1a的温度检测部分14与电路基板2由空气空间15构成。第二元件1b的温度检测部分14形成在残留在空气空间中的类似碳的碳制成的第一牺牲层5上，并且经由第一元件1b热耦合到电路基板2。牺牲层5.温度检测部分14的输出信号通过电极线9传输到读出电路2a，并且读出电路2a检测输出信号的差异。版权所有（C）2009，JPO＆INPIT

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