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1. 发明专利

JP2005294334A High heat dissipation led light emitting element and its manufacturing method 审中-公开
标题翻译：高散热LED发光元件及其制造方法
公开(公告)号：JP2005294334A
公开(公告)日：2005-10-20
申请号：JP2004103555
申请日：2004-03-31
申请人： Nan Ya Plast Corp , 南亜塑膠工業股▲ふん▼有限公司
发明人： SHIEH SUNG-YUEH , FUNG DEIN-RUN , CHANG CHI-MING , YANG MING-FA
IPC分类号： H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/00
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a high heat dissipation LED light emitting element in which a heat concentration at a high current lighting is improved and a light emitting efficiency is improved, and to provide a method of manufacturing the same.
SOLUTION: The high heat dissipation LED light emitting element is made of a transparent package resin and a heat dissipation package resin by forming the heat dissipation resin by mixing the heat dissipation powder and the package resin. In a layered heat dissipation package at the packaging, the upper layer light emitting region of the LED light emitting element does not affect the light emitting conditions of the LED light emitting element. The lower layer heat dissipation region performs a plurality of times of packages by the heat dissipation package resin. The heat energy generated when the LED chip is lighted is guided out of the heat dissipation package resin layer. The heat is not concentrated at the high current lighting. The light emitting efficiency is improved. The method of manufacturing is applied to the lead frame type LED light emitting element. At a mass production, it is not necessary to change the original manufacturing process and apparatus, but the heat dissipation effect of the light emitting element is improved by using the penetrating step of the heat dissipation package resin.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种高散热LED发光元件，其中提高了高电流照明下的热浓度并提高了发光效率，并提供了其制造方法。解决方案：高散热LED发光元件由透明封装树脂和散热封装树脂制成，通过将散热粉末和封装树脂混合形成散热树脂。在封装中的分层散热封装中，LED发光元件的上层发光区域不影响LED发光元件的发光状态。下层散热区域通过散热封装树脂进行多次封装。当LED芯片点亮时产生的热能被引导出散热封装树脂层。热量不集中在高电流照明下。发光效率提高。将该制造方法应用于引线框架式LED发光元件。在批量生产中，不需要改变原始制造工艺和装置，而是通过使用散热封装树脂的穿透步骤来提高发光元件的散热效果。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005093985A Method of generating white light by secondary excitation system and its white light emitting device 审中-公开
标题翻译：通过二次激发系统及其白光发射装置产生白光的方法
公开(公告)号：JP2005093985A
公开(公告)日：2005-04-07
申请号：JP2004103615
申请日：2004-03-31
申请人： Nan Ya Plast Corp , 南亜塑膠工業股▲ふん▼有限公司
发明人： SHIEH SUNG-YUEH , FUNG DEIN-RUN , CHANG CHI-MING , YANG MING-FA
IPC分类号： C09K11/08 , C09K11/56 , C09K11/62 , C09K11/64 , C09K11/73 , C09K11/77 , C09K11/78 , C09K11/82 , C09K11/84 , H01J1/62 , H01L33/32 , H01L33/50 , H01L33/56 , H01L33/00
CPC分类号： C09K11/7787 , C09K11/7731 , C09K11/7734 , C09K11/7739 , C09K11/7768 , C09K11/7769 , C09K11/7774 , C09K11/778 , C09K11/7786 , C09K11/7794 , H01L33/502 , H01L33/504 , Y02B20/181
摘要： PROBLEM TO BE SOLVED: To provide a method of generating white light by a secondary excitation system and its white light emitting device.
SOLUTION: In a method of generating white light by a secondary excitation system, a light source emitting ultraviolet light or violet light (wavelength of between 360nm and 420nm) is used. Blue fluorescent powder is excited to emit a broadband primary excitation spectrum the peak of which is blue light. By this primary excitation spectrum, yellow fluorescent powder with the lower energy level is excited, and a broadband secondary excitation spectrum having yellow light as a peak is emitted. In a method of generating the white light of a multispectrum and its white light emitting device, complementary color blending of the primary excitation spectrum and the secondary spectrum that are emitted by appropriately adjusting the ratio of these two fluorescent powder is carried out.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供通过二次激励系统及其白色发光装置产生白光的方法。解决方案：在通过次级激发系统产生白光的方法中，使用发射紫外光或紫色光（波长在360nm和420nm之间）的光源。激发蓝色荧光粉以发出其峰值为蓝光的宽带初级激发光谱。通过该主激发光谱，激发具有较低能级的黄色荧光粉，并发出具有黄光作为峰值的宽带二次激发光谱。在产生多光谱的白光的方法及其白色发光装置中，通过适当调整这两种荧光粉的比例来进行主激发光谱与二次光谱的互补色混合。版权所有（C）2005，JPO＆NCIPI

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