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1. 发明专利

JP2012158730A Epoxy resin composition and semiconductor sealing material using same 有权
标题翻译：环氧树脂组合物和半导体密封材料使用相同
公开(公告)号：JP2012158730A
公开(公告)日：2012-08-23
申请号：JP2011021363
申请日：2011-02-03
申请人： Namics Corp , ナミックス株式会社
发明人： HOSONO YOHEI , HONMA HIROKI
IPC分类号： C08G59/56 , C08K3/36 , C08K5/55 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： C08L63/00 , C08G59/226 , C08G59/24 , C08G59/4284 , C08G59/5073 , C08G59/56 , C08K5/1515 , C08K5/3445 , C08L61/06 , H01L23/293 , H01L2924/0002 , H01L2924/00 , C08L61/04
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has a low viscosity, can be cured at a low temperature in a short time, has excellent heat resistance, voltage resistance, electrical insulating properties, moisture resistance, mechanical strength, and adhesive properties, has excellent solder ball reinforcing properties during sealing, and has a long pot life; and a semiconductor sealing material using the epoxy resin composition.SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) 1,4-cyclohexanedimethanol diglycidyl ether, (C) an imidazole-based latent curing agent, and (D) a phenolic resin, wherein the content of (B) the 1,4-cyclohexanedimethanol diglycidyl ether relative to the total mass of (A) the epoxy resin and (B) the 1,4-cyclohexanedimethanol diglycidyl ether is 0.5-80 mass%, the content of (C) the imidazole-based latent curing agent relative to the total mass of all the components in the epoxy resin composition is 5-25 mass%, and the content of (D) the phenolic resin relative to the total mass of all the components in the epoxy resin composition is 0.5-25 mass%.
摘要翻译：要解决的问题为了提供一种具有低粘度的环氧树脂组合物，可以在短时间内在低温下固化，具有优异的耐热性，耐电压性，电绝缘性，耐湿性，机械强度，和粘合性能，在密封过程中具有优异的焊球增强性能，使用寿命长; 以及使用该环氧树脂组合物的半导体密封材料。环氧树脂组合物包含（A）环氧树脂，（B）1,4-环己烷二甲醇二缩水甘油醚，（C）咪唑类潜在性固化剂和（D）酚醛树脂，其中含量（B）1,4-环己烷二甲醇二缩水甘油醚相对于（A）环氧树脂的总质量和（B）1,4-环己烷二甲醇二缩水甘油醚的总质量为0.5〜80质量％，（C）相对于环氧树脂组合物中所有组分的总质量，咪唑基潜固化剂为5-25质量％，（D）酚醛树脂相对于环氧树脂中所有组分的总质量的含量组成为0.5〜25质量％。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2014125631A Liquid epoxy resin composition 有权
标题翻译：液体环氧树脂组合物
公开(公告)号：JP2014125631A
公开(公告)日：2014-07-07
申请号：JP2012286122
申请日：2012-12-27
申请人： Namics Corp , ナミックス株式会社
发明人： HOSONO YOHEI
IPC分类号： C08G59/50 , C08K3/36 , C08K5/16 , C08K5/55 , C08L61/10 , C09J11/04 , C09J11/06 , C09J161/06 , C09J163/00 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L23/295 , C08G59/182 , C08G59/5073 , C08G59/621 , C08K3/013 , C08K5/55 , C08L61/06 , C08L63/00 , H01L21/563 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition which is excellent flowability of the epoxy resin composition even when containing an inorganic filler, and has a long pot life due to suppression of thickening during storage.SOLUTION: A liquid epoxy resin composition contains (A) a liquid epoxy resin, (B) an epoxy adduct curing agent of an amine compound, (C) an inorganic filler, (D) triisopropyl borate, and (E) a phenol resin. The component (C) is 20-65 pts.mass, the component (D) is 0.02-0.15 pts.mass, and the component (E) is 0.3-15.0, with respect to 100 pts.mass of the liquid epoxy resin composition.
摘要翻译：要解决的问题：提供一种液体环氧树脂组合物，即使在含有无机填料时也具有优异的环氧树脂组合物的流动性，并且由于在储存期间抑制增稠而具有长的适用期。溶液：液体环氧树脂组合物含有（A）液体环氧树脂，（B）胺化合物的环氧加合物固化剂，（C）无机填料，（D）硼酸三异丙酯和（E）酚醛树脂。组分（C）为20-65重量份，组分（D）为0.02-0.15重量份，组分（E）为0.3-15.0，相对于100重量份的液体环氧树脂组合物。

3. 发明专利

JP2014156519A Liquid resin composition, flip chip mounting body, and method for manufacturing the same 有权
标题翻译：液体树脂组合物，片状芯片安装体及其制造方法
公开(公告)号：JP2014156519A
公开(公告)日：2014-08-28
申请号：JP2013026998
申请日：2013-02-14
申请人： Namics Corp , ナミックス株式会社
发明人： KATO RIEKO , IWATANI KAZUKI , HOSONO YOHEI
IPC分类号： C08G59/40 , C08F220/60 , C08L33/24 , C08L63/00 , H01L21/60 , H01L23/29 , H01L23/31
CPC分类号： H01L21/563 , C08L33/08 , H01L23/293 , H01L27/14627 , H01L2924/0002 , C08F2220/1825 , C08F220/54 , H01L2924/00 , C08L63/00 , C08L33/26
摘要： PROBLEM TO BE SOLVED: To suppress bleeding of a liquid resin composition to an imaging surface of a semiconductor chip which is not subjected to fluorine coating for improving an image quality of an image element such as an image sensor module.SOLUTION: A liquid resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) a copolymer of dimethylaminopropylacrylamide and butyl acrylate. The (B) component is preferably at least one selected from a group consisting of a phenolic curing agent, an amine curing agent, an acid anhydride curing agent, and an imidazole curing agent.
摘要翻译：要解决的问题：为了抑制液体树脂组合物渗透到不经受氟涂层的半导体芯片的成像表面的渗出，以提高诸如图像传感器模块的图像元素的图像质量。解决方案：液体树脂组合物含有（A）环氧树脂，（B）固化剂，和（C）二甲基氨基丙基丙烯酰胺和丙烯酸丁酯的共聚物。（B）成分优选为选自酚类固化剂，胺固化剂，酸酐固化剂和咪唑固化剂中的至少一种。

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