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1. 发明专利

JP2009092610A Method for observing x-ray tomographic image of printed circuit board, and device using the same 审中-公开
标题翻译：用于观察印刷电路板的X射线图像的方法以及使用其的装置
公开(公告)号：JP2009092610A
公开(公告)日：2009-04-30
申请号：JP2007265947
申请日：2007-10-11
申请人： Nagoya Electric Works Co Ltd , Yoshida Industry Co Ltd , 吉田工業株式会社 , 名古屋電機工業株式会社
发明人： SOFUE AKIHIRO , HINO SEIZO , AOKI MASAMITSU
IPC分类号： G01N23/04 , G01B15/04 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a nondestructive inspection method capable of grasping the state of an internal layer circuit of a multilayer printed circuit board from any angle, even for any type of multilayered printed circuit board. SOLUTION: The method includes the steps of measuring the internal circuit structure of the printed circuit board using a fixed X-ray generator, a fixed vertical transmission X-ray generator, and movable inclined transmission X-ray generators of 2N (an integer of N≥1) units or larger; detecting X-rays passing through the printed circuit board using the fixed vertical transmission X-ray generator, and movable inclined transmission X-ray generators of 2N (an integer of N≥1) units or larger; converting the intensity of X-rays detected by these detectors to a signal; and three-dimensionally displaying the circuit profile from an external layer to an internal layer in the printed circuit board by using this signal. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：即使对于任何类型的多层印刷电路板，提供能够从任何角度掌握多层印刷电路板的内层电路的状态的非破坏性检查方法。解决方案：该方法包括以下步骤：使用固定的X射线发生器，固定的垂直透射X射线发生器和2N的可移动倾斜透射X射线发生器测量印刷电路板的内部电路结构 N≥1）单位以上; 使用固定的垂直透射X射线发生器检测穿过印刷电路板的X射线，以及2N（整数N≥1）或更大的可移动倾斜透射X射线发生器; 将由这些检测器检测的X射线的强度转换为信号; 并且通过使用该信号从印刷电路板的外部层到内层三维地显示电路轮廓。版权所有（C）2009，JPO＆INPIT

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