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1. 发明专利

JPH07112112A SEPARATION OF SPECIFIED COMPONENT IN NATURAL GAS AND DEVICE THEREFOR 失效
公开(公告)号：JPH07112112A
公开(公告)日：1995-05-02
申请号：JP28446993
申请日：1993-10-19
申请人： NITTO DENKO CORP , OSAKA GAS CO LTD
发明人： KAWASHIMA TOSHIYUKI , INOUE KENICHI , YAMADA MITSUYA , OHAMA TAKASHI , SUGIYAMA OSAMU
IPC分类号： B01D53/22 , B01D53/30
摘要： PURPOSE:To reduce the range of control of concentrated gas and to rapidly return it to the original concentration by using a gas separation membrane module capable of sufficiently reducing the rate of change in concentration of a specified component in concentrated gas as compared to the rate of change in concentration of the specified component in natural gas. CONSTITUTION:In the treatment for separating a specified component from natural gas at a specified concentration by using a separator, one fan (or compressor) 3 and the other fan (or vacuum pump) 4 are driven to feed the natural gas from a natural gas source 1 to a gas separation membrane module 2. A pressure adjusting valve 6 is adjusted to set differential in pressure across the membrane of the gas separation membrane module 2 to a prescribed value and the natural gas is subjected to separation treatment. In this way, concentrated gas of the specified component is allowed to flow out from an outlet 21 on the impermeable side of the gas separation membrane module 2. The change in concentration of the specified component is detected by a gas concentration detecting element 5 and a flow control valve 7 is operated based on the detected signal, thereby the concentration of the specified component can always be kept constant.

2. 发明专利

JP2003200541A POROUS FILM WITH FILM AND WINDING THEREOF 审中-公开
公开(公告)号：JP2003200541A
公开(公告)日：2003-07-15
申请号：JP2002003216
申请日：2002-01-10
申请人： NITTO DENKO CORP
发明人： KAWASHIMA TOSHIYUKI , TAWARA SHINJI , IKEDA KENICHI
IPC分类号： B32B27/34
摘要： PROBLEM TO BE SOLVED: To provide a porous film with a film having such advantages that the heat resistance is superb and the adhesion with a resin film is appropriate and further, desirably the impregnation with a heat-curable resin is best-suitably performed, without the necessity to laminate a resin film separately and a winding obtained by winding the porous film in a roll shape. SOLUTION: This porous film comprises an aromatic polyamide with a glass transition temperature Tg of 190 to 350°C containing a total of 80 mol% or higher of a repeating unit having a methaphenylene group and shows voids of 30 to 80%. Further, the porous film with a film has a resin film directly adhering thereto at an interface or through an adhesion adjusting layer. In this porous film with a film, the release strength shown at the time of releasing the porous film from the resin film, is 0 to 50 gf/cm as measured under the test conditions that a tensile speed be 500 mm/min. at 180° peel. COPYRIGHT: (C)2003,JPO

3. 发明专利

JP2003078244A Multilayer wiring substrate and method of manufacturing the same 审中-公开
标题翻译：多层布线基板及其制造方法
公开(公告)号：JP2003078244A
公开(公告)日：2003-03-14
申请号：JP2002003067
申请日：2002-01-10
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： IKEDA KENICHI , KAWASHIMA TOSHIYUKI , TAWARA SHINJI , OUCHI KAZUO
IPC分类号： H05K1/11 , H05K1/18 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4617 , H05K1/185 , H05K3/4611 , H05K3/4647 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0355 , H05K2203/0384 , H05K2203/0733 , H05K2203/1147 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring substrate, with which even a multilayer wiring substrate having a high count of laminated layers can be easily manufactured by simultaneously performing a unifying process to form a laminate, and problems on adhesion strength between insulating layers and problems on aligning accuracy in lamination hardly occur in the obtained multilayer wiring substrate, and to provide a multilayer wiring substrate obtained by the method. SOLUTION: This method of manufacturing a multilayer wiring substrate contains a process of impregnating a porous laminate 30, which comprises porous layers 11 of two or more layers and a wiring layer 20 interposed between the porous layers 11 and formed on either of the porous layers 11, with a raw- material composite R of thermosetting resin, and making the resin half-cured or completely cured.
摘要翻译：要解决的问题：提供一种多层布线基板的制造方法，通过同时进行一体化处理以形成层叠体，即使是能够容易地制造具有高层叠层数的多层布线基板，也存在粘合强度问题在所得到的多层布线基板中几乎不发生绝缘层与层叠对准精度的问题，提供通过该方法得到的多层布线基板。解决方案：这种制造多层布线基板的方法包括浸渍多孔层压体30的方法，该多孔层压体30包括两层或多层多孔层11和布置在多孔层11之间的布线层20，并形成在多孔层11 使用热固性树脂的原料复合物R，并使树脂半固化或完全固化。

4. 发明专利

JP2003017826A Wiring board 审中-公开
标题翻译：接线板
公开(公告)号：JP2003017826A
公开(公告)日：2003-01-17
申请号：JP2001196007
申请日：2001-06-28
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： MOTOGAMI MITSURU , KAWASHIMA TOSHIYUKI , TAWARA SHINJI , IKEDA KENICHI
IPC分类号： H05K1/16 , H01G4/33 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board, which has a laminated structure that is simple, manufactured through a simple manufacturing process, equipped with a capacitor which can be reduced in size, and capable of improving a wiring unit in high-frequency characteristics and noise resistance properties. SOLUTION: A wiring board is equipped with a laminated structure provided with a capacitor-forming unit 21, where at least either of conductor layers 20 and 30 formed on both the sides of an insulation layer 10 forms the electrode of a capacitor and a wiring unit 22, which wires a circuit. The insulation layer 10 is formed of a composite porous film 11, and an insulation layer 10a, interposed in the capacitor-forming unit 21, is made to have a higher dielectric constant than an insulating layer 10b interposed in the wiring unit 22, depending on whether or not the porous film 11 filled up with a filler or by the kind of the filler filling the porous film 11.
摘要翻译：要解决的问题：为了提供一种布线板，其具有简单的层叠结构，其通过简单的制造工艺制造，其具有能够减小尺寸的电容器，并且能够改善高频特性的布线单元和抗噪声性能。解决方案：布线板配备有设置有电容器形成单元21的层叠结构，其中形成在绝缘层10两侧的导体层20和30中的至少一个形成电容器的电极和布线单元 22，它连接电路。绝缘层10由复合多孔膜11形成，并且设置在电容器形成单元21中的绝缘层10a具有比插入在布线单元22中的绝缘层10b更高的介电常数，这取决于多孔膜11是否填充有填料，或填充多孔膜11的填料种类。

5. 发明专利

JP2002344114A WIRING BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002344114A
公开(公告)日：2002-11-29
申请号：JP2001143078
申请日：2001-05-14
申请人： NITTO DENKO CORP
发明人： KAWASHIMA TOSHIYUKI , TAWARA SHINJI , IKEDA KENICHI
IPC分类号： H05K3/40 , H05K3/10 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a wiring board in which unreinforced portions and troubles caused by partial strength drops hardly occur at the time of forming recessed sections in a wiring pattern, and to provide a method of manufacturing the board. SOLUTION: In the method of manufacturing the wiring board, the recessed sections 15 are formed in the wiring pattern by arranging a top force C and a bottom force D in which different wiring patterns are respectively formed in protruding states on both surfaces of a resin board 11 having through holes 12 filled up with conductive paste 13 and maintained in a prepreg-state and curing the board 11 by pressing the forces C and D against the board 11 while the forces C and D are heated. Thereafter, wiring pattern conductors 16 composed of conducive paste, etc., are packed in the recessed sections 15 and the surfaces of the board 14 and conductors 16 are flattened. In this method, a porous film of a heat-resistant resin is used as the reinforcing material of the board 11.

6. 发明专利

JP2002337268A METAL FOIL LAMINATE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002337268A
公开(公告)日：2002-11-27
申请号：JP2001150466
申请日：2001-05-21
申请人： NITTO DENKO CORP
发明人： IKEDA KENICHI , KAWASHIMA TOSHIYUKI , TAWARA SHINJI
IPC分类号： B32B15/08 , B32B5/18 , H05K3/40 , H05K3/42 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal foil laminate which can obtain a connecting structure for conductively connecting between wiring layers without necessity of a punching work and to provide the metal foil laminate obtained by the method. SOLUTION: In the method for manufacturing the metal foil laminate comprising the steps of forming a resin porous layer 5 on the metal foil by a wet solidifying method and adhering the layer 5 onto the foil, as the foil, the metal foil 10 with a protrusion having a conductive protrusion 2a of substantially the same height as that of a film forming side face is used.

7. 发明专利

JP2002204069A CONDUCTIVE CONNECTION METHOD BETWEEN METAL LAYERS 失效
公开(公告)号：JP2002204069A
公开(公告)日：2002-07-19
申请号：JP2000400486
申请日：2000-12-28
申请人： NITTO DENKO CORP
发明人： KAWASHIMA TOSHIYUKI , IKEDA KENICHI , TAWARA SHINJI
IPC分类号： H05K3/40 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a conductive connection method between metal layers which keeps a durability and a good reliability of a conductive connection and reduces the number of steps and the raw material cost. SOLUTION: The conductive connection method between metal layers comprises a step of forming a thermosetting resin layer 4 partly exposed at the surface of a porous resin layer 3 laminated on a first metal layer 1, a step of forming an opening 5 extending from the surface of the resin layer 4 to the first metal layer 1, a step of filling the opening 5 with a conductive paste 6 with the surface height approximately equal to the height of the surrounding object and a step of hot pressing the filled laminate together with a second metal layer 2, hereby reducing the total thickness.

8. 发明专利

JP2002200616A METHOD FOR MANUFACTURING WIRING BOARD PREPREG 失效
公开(公告)号：JP2002200616A
公开(公告)日：2002-07-16
申请号：JP2000400467
申请日：2000-12-28
申请人： NITTO DENKO CORP
发明人： KAWASHIMA TOSHIYUKI , IKEDA KENICHI , TAWARA SHINJI
IPC分类号： B05D7/24 , B29B11/16 , B32B5/00 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board prepreg capable of preventing the generation of wrinkles or the like by reducing the effect of a solvent in a thermosetting resin at the time of impregnation with it or the deformation caused by stress. SOLUTION: The method for manufacturing the wiring board prepreg includes a process for coating the surface of a base material with a raw material solution of the thermosetting resin containing the solvent, a process for obtaining a solid coating film by removing the solvent from a coated raw material solution, and a process for laminating the solid coating film on a porous film or sheetlike fiber aggregate along with the base material under pressure while heating the same and impregnating the porous film or sheetlike fiber aggregate with at least a part of the solid coating film.

9. 发明专利

JP2002037906A POROUS FILM FOR PREPREG AND PREPREG FOR CIRCUIT BOARD 失效
公开(公告)号：JP2002037906A
公开(公告)日：2002-02-06
申请号：JP2000224456
申请日：2000-07-25
申请人： NITTO DENKO CORP
发明人： IKEDA KENICHI , TABATA HARUO , SASAKI KIMIMITSU , KAWASHIMA TOSHIYUKI , SHINTANI TAKUJI , TAWARA SHINJI
IPC分类号： C08J5/24 , C08J9/28 , C08J9/42 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain both a porous film for a prepreg capable of excellently being subjected to a laser via processing of fine pitch and suitably being impregnated with a thermosetting resin and a prepreg for a circuit board using the same. SOLUTION: This porous film for a prepreg comprises an open cell porous film of a polyamide-based resin. This prepreg for a circuit board comprises a semicured material of a thermosetting resin impregnated into the pores of the porous film.

10. 发明专利

JP2002037905A POROUS FILM FOR PREPREG AND PREPREG FOR CIRCUIT BOARD 失效
公开(公告)号：JP2002037905A
公开(公告)日：2002-02-06
申请号：JP2000220060
申请日：2000-07-21
申请人： NITTO DENKO CORP
发明人： TAWARA SHINJI , TABATA HARUO , SASAKI KIMIMITSU , IKEDA KENICHI , SHINTANI TAKUJI , KAWASHIMA TOSHIYUKI
IPC分类号： C08J5/24 , C08J9/28 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To obtain both a porous film for a prepreg capable of excellently being subjected to a laser via processing of fine pitch, having excellent heat resistance and capable of being suitably impregnated with a thermosetting resin and a prepreg for a circuit board using the same. SOLUTION: This porous film for a prepreg comprises an open cell porous film of a polyimide-based resin, has >=0.05 μm average particle diameter on both obverse and reverse sides and 30-98% porosity. This prepreg for a circuit board comprises a semicured material of a thermosetting resin impregnated into the pores of the porous film.

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