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1. 发明专利

JP2009274336A Manufacturing method of resin composition for encapsulating semiconductor element 有权
标题翻译：用于封装半导体元件的树脂组合物的制造方法
公开(公告)号：JP2009274336A
公开(公告)日：2009-11-26
申请号：JP2008128035
申请日：2008-05-15
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ONO HIROBUMI , KIMURA SHOICHI , YAMANE MINORU
IPC分类号： B29B7/90 , B29B13/10 , B29K63/00 , C08J3/12 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin composition for encapsulating a semiconductor element having a process of feeding a mixture from a feeding vessel such as a hopper, a ribbon mixer or the like to a melting and kneading machine to melt and knead the same, the method capable of preventing stagnation of a component in the feeding vessel without being affected by a shape or a volume of the feeding vessel thereby to manufacture the resin composition for encapsulating the semiconductor element having a stable physical property. SOLUTION: The manufacturing method of the resin composition for encapsulating the semiconductor element containing components of an epoxy resin (A), a curing agent (B) and an inorganic filler (C) comprises a process of preparing a mixture of the component (A), the component (B) and the component (C), the average particle diameter of each component being adjusted to be 5 to 50 μm, a process of storing the mixture in the vessel for feeding the mixture to the melting and kneading machine, a process of feeding the stored mixture from the vessel to the melting and kneading machine to make the molten kneaded mixture, and a process of cooling and solidifying the molten kneaded mixture, and then pulverizing the solidified mixture. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于封装半导体元件的树脂组合物的制造方法，该半导体元件具有将来自诸如料斗，带式混合器等的进料容器的混合物进料到熔融捏合机使其熔融捏合，该方法能够防止供给容器中的组分停滞而不受供料容器的形状或体积的影响，从而制造用于密封具有稳定物理性质的半导体元件的树脂组合物。解决方案：包含环氧树脂（A），固化剂（B）和无机填料（C）的组分的半导体元件的树脂组合物的制造方法包括制备组分（A），成分（B）和成分（C）中，将各成分的平均粒径调整为5〜50μm，将混合物保存在容器内进行熔融混炼的工序机器，将储存的混合物从容器进料到熔融捏合机以制备熔融捏合混合物的过程，以及将熔融捏合混合物冷却和固化的过程，然后粉碎固化的混合物。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2005048173A Manufacturing method for tablet for sealing semiconductor, tablet for sealing semiconductor obtained thereby, and semiconductor device using the same 有权
标题翻译：用于密封半导体的片材的制造方法，用于密封获得的半导体的片和使用其的半导体器件
公开(公告)号：JP2005048173A
公开(公告)日：2005-02-24
申请号：JP2004207170
申请日：2004-07-14
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ONO HIROBUMI , YAMANE MINORU , INA YASUNOBU , UMENO SHOICHI
IPC分类号： C08J3/12 , C08G59/62 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a tablet for sealing a semiconductor capable of reducing the occurrence of a void within a package by increasing the density of the tablet.
SOLUTION: The manufacturing method for the tablet for sealing the semiconductor comprises producing an epoxy resin composition containing the following components (A)-(C) as essential components, thereafter molding a kneaded product of the above composition into a sheet-like product having a sheet density ratio of 98 % or higher, crushing the sheet-like product, thereafter tabletting the crushed material into a tablet-like product having a tablet density ratio of 94 % or higher and lower than 98 %. (A): an epoxy resin. (B): a phenol resin. (C): an inorganic filler.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于密封半导体的片剂的制造方法，其能够通过增加片剂的密度来减少封装内的空隙的发生。解决方案：用于密封半导体的片剂的制造方法包括制备含有以下组分（A） - （C）作为必要组分的环氧树脂组合物，然后将上述组合物的捏合产物模制成片状片材密度比为98％以上的产品，粉碎片状产品，然后将破碎材料压片成片剂密度比为94％以上且低于98％的片状产品。（A）：环氧树脂。（B）：酚醛树脂。（C）：无机填料。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JPH07314440A PRODUCTION OF SEMICONDUCTOR-SEALING RESIN 失效
公开(公告)号：JPH07314440A
公开(公告)日：1995-12-05
申请号：JP10997994
申请日：1994-05-24
申请人： NITTO DENKO CORP
发明人： YAMANE MINORU , KOMOTO MAMORU
IPC分类号： B29B7/42 , B29B7/46 , B29B7/84 , B29B11/10 , B29C45/02 , H01L23/10
摘要： PURPOSE:To prevent clogging of a vent port and obtain a semiconductor-sealing resin containing a reduced amount of volatile content at a sealing temperature by a method wherein the vent port has a longitudinal distance longer than a screw pitch by a specific factor or more and a width distance equal to or longer than the width dimension of a cylinder. CONSTITUTION:A material loaded in a material supply port 2 is fed to a first paddle part 6a by a first screw part 5a in a cylinder 1 to be heated and kneaded therein, thereafter being fed to a second paddle part 6b by a second screw part 5b. In the feeding path, the volatile content of the compound is discharged through a vent port 7 by the action of a vacuum pump. After that, the compound kneaded by the second paddle part 6b is taken out of a delivery port 3 provided in the front end part of the cylinder 1 as a semiconductor-sealing resin. In the vent port 7, a distance between front and rear walls 7a is set to be not less than 1.5 times as long as the screw pitch of the second screw part 5b, and a distance between right and left walls 7b is set to be not less than a width dimension of the cylinder 1.

4. 发明专利

JPH1034647A RESIN GRANULE FOR MOLDING AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH1034647A
公开(公告)日：1998-02-10
申请号：JP19316196
申请日：1996-07-23
申请人： NITTO DENKO CORP
发明人： YAMANE MINORU , KONDO YOSHIHIKO , KOMOTO MAMORU , KIMURA SHOICHI
IPC分类号： B29B9/06 , B29C45/00 , B29C45/02 , B29K63/00
摘要： PROBLEM TO BE SOLVED: To reduce the generation of voids by a method wherein a thermosetting resin composition, the diameter, length and true specific gravity of each of which is within the specified ranges, is kneaded and vacuum-deaerated and then discharged into the shape of a round bar and finally cut into the predetermined lengths. SOLUTION: A molding resin granule 41 is set its diameter substantially 0.5-5mm and its length 0.5-5mm. Further, the contained air and volatile component of the granule are removed so as to obtain the compressibility of 90-99% and the true specific gravity after hardening of 1.5-2.5. As a result, the molding resin granule 41 turns into a nearly cylindrical shape with both rounded end edge parts. Since no corner as is present in a ground article is present, no trouble of the generation of dust due to the breakage of a corner is hard to develop at the handling of the molding resin granule 41. Furthermore, since granulation is performed within a kneader under vacuum deaerated state, the air and volatile component containing within the granule is very small as compared with those in the ground article or the like of a thermosetting resin composition.

5. 发明专利

JP2013006171A Kneading machine 审中-公开
标题翻译：打码机
公开(公告)号：JP2013006171A
公开(公告)日：2013-01-10
申请号：JP2011266758
申请日：2011-12-06
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： TORINARI GO , ONO HIROBUMI , YAMANE MINORU , TOYODA HIDESHI , SHIMIZU YUSAKU , NISHIOKA TSUTOMU
IPC分类号： B01F7/08 , B29B7/38
CPC分类号： B29C47/6025 , B29C47/6037 , B29C47/6056 , B29C47/6093
摘要： PROBLEM TO BE SOLVED: To provide a kneading machine that can suppress the generation of pores in a kneaded product.SOLUTION: In the kneading machine 1, a kneading shaft 3 includes: paddle parts 11; and pipe parts 12 positioned closer to the side of a discharge port 5 than the paddle parts 11 between an introduction port 4 and the discharge port 5 in the axial direction of the kneading shaft 3. When a kneading object A is introduced into barrels 2 from the introduction port 4, the kneading object A is kneaded by the paddle parts 11 and then the kneaded product B is discharged from the discharge port 5 through the pipe parts 12.
摘要翻译：待解决的问题：提供一种可以抑制捏合产物中的孔产生的捏合机。解决方案：在捏合机1中，捏合轴3包括：桨叶部分11; 以及比捏合轴3的轴向上的导入口4和排出口5之间的叶片部11更靠近排出口5侧的管道部件12.当捏合对象物A从筒体2被引入到桶2中时引入口4，捏合物A被桨叶部分11捏合，然后捏合物B通过管件12从排出口5排出。版权所有：（C）2013，JPO＆INPIT

6. 发明专利

JP2012251157A Semiconductor element sealing resin composition and semiconductor sealing body using the same 审中-公开
标题翻译：半导体元件密封树脂组合物和半导体密封体使用相同
公开(公告)号：JP2012251157A
公开(公告)日：2012-12-20
申请号：JP2012172819
申请日：2012-08-03
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： ONO HIROBUMI , KIMURA SHOICHI , YAMANE MINORU
IPC分类号： C08G59/18 , B29B7/90 , B29K63/00 , B29K105/16
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor element sealing resin composition, which is obtained by a special manufacturing method in which the stay of a component in a container for feeding can be prevented without being affected by the shape or capacity of the container for feeding, and in which the physical properties are stable, and to provide a semiconductor sealing body using the same.SOLUTION: The semiconductor element sealing resin composition includes the following (A)-(C) components, wherein (A) component, (B) component, and (C) component which are adjusted so that the volume average particle sizes may become at least 5 μm and at most 50 μm, are mixed so that the globular conversion weight in the volume average particle size of the (A) component and (B) component may become 0.4-20 times of the globular conversion weight in the average particle size of the (C) component, and the semiconductor sealing body using the same is disclosed. (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler.
摘要翻译：解决的问题：提供一种半导体元件密封树脂组合物，其是通过特殊的制造方法获得的，其中可以防止组分在用于进料的容器中的滞留而不受其形状或容量的影响用于进料的容器，其物理性能稳定，并提供使用其的半导体密封体。解决方案：半导体元件密封树脂组合物包括以下（A） - （C）组分，其中（A）组分，（B）组分和（C）组分被调节以使体积平均粒径可以（A）成分和（B）成分的体积平均粒径的球状转化重量相对于平均粒径为球状转化重量的0.4〜20倍，公开了（C）成分的粒径和使用其的半导体密封体。（A）环氧树脂，（B）固化剂，（C）无机填料。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2001189407A MANUFACTURING METHOD FOR SURFACE-TREATED INORGANIC FILLER, EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2001189407A
公开(公告)日：2001-07-10
申请号：JP37492599
申请日：1999-12-28
申请人： NITTO DENKO CORP
发明人： NISHIOKA TSUTOMU , TANIGUCHI TAKASHI , YAMANE MINORU , IKEMURA KAZUHIRO
IPC分类号： C08G59/62 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor which is superior in moldability. SOLUTION: This epoxy resin composition for sealing a semiconductor comprising epoxy resin, phenol resin, and surface-treated organic filler, where after an inorganic filler is heated to 120-250 deg.C, is added with a silane coupling agent while being agitated, which is depressurized while the agitation is maintained so that volatile components are removed, thus providing a surface-treated inorganic filler.

8. 发明专利

JP2001085576A MANUFACTURE OF EPOXY RESIN COMPOSITION FOR SEALING SEMICONDCUTOR, AND EPOXY RESIN COMPOSITION FOR SEALING THE SEMICONDUCTOR AND SEMICONDUCTOR DEVICE OBTAINED THEREBY 失效
公开(公告)号：JP2001085576A
公开(公告)日：2001-03-30
申请号：JP25969399
申请日：1999-09-14
申请人： NITTO DENKO CORP
发明人： NISHIOKA TSUTOMU , TANIGUCHI TAKASHI , YAMANE MINORU , IKEMURA KAZUHIRO
IPC分类号： C08K3/10 , C08K5/17 , C08K5/49 , C08L61/06 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of an epoxy resin composition for sealing a semiconductor of superior moldability. SOLUTION: In this manufacturing method, first a whole or a part of mixing components, excluding components of C and D, are mixed in advance among the mixing components containing the components of A-D. Next, the components C and D and the remaining exees components are mixed in this mixture. An epoxy resin composition for sealing of a semiconductor containing the following components A-D is manufactured through such processes, as, A:epoxy resin, B:phenol resin, C:antimony compound and D:hardening accelrator.

9. 发明专利

JP2001081284A PREPARATION OF SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR SEALING EPOXY RESIN COMPOSITION OBTAINED THEREBY, AND SEMICONDUCTOR DEVICE SEALED THEREWITH 失效
公开(公告)号：JP2001081284A
公开(公告)日：2001-03-27
申请号：JP25969499
申请日：1999-09-14
申请人： NITTO DENKO CORP
发明人： NISHIOKA TSUTOMU , TANIGUCHI TAKASHI , YAMANE MINORU , IKEMURA KAZUHIRO
IPC分类号： B29B7/84 , B29K63/00 , C08K5/541 , C08L63/00 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in moldability and soldering resistance by kneading a component essentially consisting of an epoxy resin, a phenolic resin, and a silane coupling agent solution with a vented kneader to lower the content of volatiles to a specified or lower value. SOLUTION: The content of volatiles of the obtained resin composition is at most 0.1 wt.%. The vented kneader used is desirably a twin-screw type one provided with a cylinder 1 and a screw shaft 4 having first and second feed screws 5a and 5b arranged left and right in the cylinder 1 and rotating in the same direction and first and second kneading paddles 6a and 6b. Further, a rectangular tube vent port 7, which coincides with the second screw 5b in position, is provided on a part of the peripheral wall of the cylinder 1, the distance between the front and rear walls 7a's of the port 7 is set at a value at least 1.5 times higher than the screw pitch of the second screw 5b, and the distance between the left and right walls (in the direction of width) is set at a value at least equal to the width of the cylinder 1.

10. 发明专利

JP2000230032A THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE PREPARED BY USING SAME 失效
公开(公告)号：JP2000230032A
公开(公告)日：2000-08-22
申请号：JP24767399
申请日：1999-09-01
申请人： NITTO DENKO CORP
发明人： HOSOKAWA TOSHITSUGU , NISHIOKA TSUTOMU , IKEMURA KAZUHIRO , HARADA TADAAKI , MISUMI SADAHITO , TANIGUCHI TAKASHI , OIZUMI SHINICHI , YAMANE MINORU
IPC分类号： C08G18/58 , C08G59/40 , C08G59/62 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To obtain a thermosetting resin composition in which each compounding ingredient is homogeneously dispersed and which suppresses the formation of voids and is excellent in storage stability and resistance to soldering by compounding a thermosetting resin with a curing agent and a cure- acceleration-containing microcapsule having a core/shell structure. SOLUTION: This composition comprises a thermosetting resin (A) (e.g. an epoxy resin having an epoxy equivalent of 150-350 and a softening point of 50-150 deg.C); a curing agent (B) having a hydroxyl equivalent of 150-220 and a softening point of 50-90 deg.C in such an amount that the amount of hydroxyl group is 0.8-1.2 equivalents, preferably 0.9-1.1 equivalents, per equivalent of epoxy group of ingredient A; and a cure-accelerator-containing microcapsule having a core/shell structure (C) in an amount of 0.1-3 pts.wt. (based on 100 pts.wt. ingredient A) having an average capsule size of 0.05-20 μm and comprising 5-70 wt.% cure accelerator as the core part and shells which cover the accelerator and comprise a polyurea formed by using a mixture of 80-30 mol% isocyanate compound of formula I and 20-70 mol% isocyanate compound of formula II.

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