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1. 发明专利

JP2009247437A Bioadhesive composition and application method therefor 审中-公开
标题翻译：生物组合物及其应用方法
公开(公告)号：JP2009247437A
公开(公告)日：2009-10-29
申请号：JP2008096123
申请日：2008-04-02
申请人： Nitto Denko Corp , Omura Toryo Kk , Tottori Univ , 国立大学法人鳥取大学 , 大村塗料株式会社 , 日東電工株式会社
发明人： UEDA HIROKO , KASAHARA TAKESHI , MINAMI SABURO , OMURA YOSHIHIKO , RENBUTSU EIKO
IPC分类号： A61L24/00
摘要： PROBLEM TO BE SOLVED: To provide a bioadhesive composition demonstrating prompt bioadhesion and sufficient coating strength by being photocured with irradiation of ultraviolet rays or visible light beams, and reducing damages on body tissue by suppressing heat generation that occurs in photopolymerization reaction as much as possible, and to provide an application method therefor. SOLUTION: The bioadhesive composition contains: a chitin-chitosan derivative including a 3-component unit indicated by formula (I) (In the formula, l, m and n are each independently denotes 0 COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供通过用紫外线或可见光束的照射光固化而显示出快速的生物粘附和足够的涂层强度的生物粘合剂组合物，并且通过抑制在光聚合反应中发生的热量而减少身体组织的损伤并提供其应用方法。生物粘合剂组合物含有：甲壳质壳聚糖衍生物，其包含式（I）所示的3-成分单元（式中，l，m和n各自独立地表示0 <1 <1,0

2. 发明专利

JP2008029814A PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR MEDICAL TREATMENT 审中-公开
公开(公告)号：JP2008029814A
公开(公告)日：2008-02-14
申请号：JP2007114758
申请日：2007-04-24
申请人： NITTO DENKO CORP
发明人： UEDA HIROKO , FUNAKOSHI SHIGEO , HATANAKA HIROSHI , KASAHARA TAKESHI , KOMORI KENJI
IPC分类号： A61F13/02
摘要： PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape or sheet for medical treatment having a good cutting surface, easy to cut by the hand and having an excellent feeling. SOLUTION: The pressure-sensitive adhesive tape or sheet for medical treatment is equipped with a support obtained by stacking many nonwoven fabrics different in fiber diameter and treated with a sealant and the pressure-sensitive adhesive layer overlying one side of the support. At least the support is subjected to drilling treatment for forming a large number of holes arranged at least in one direction by drilling and the ratio (b/a) of the interval (a) of the drilled parts and the interval (b) of non-drilled parts in one direction is 1-1.5 while the ratio (c/d) of the tensile strength (c) in the longitudinal direction of the support and the tensile strength (d) in the width direction thereof is 0.8-1.7. By this method, the pressure-sensitive adhesive tape or sheet for medical treatment having the excellent filling and easily out by the hand without using a cutter such as scissors while providing the good cut surface is provided. COPYRIGHT: (C)2008,JPO&INPIT

3. 发明专利

JP2008000198A Adhesive tape or sheet 有权
标题翻译：胶带或薄片
公开(公告)号：JP2008000198A
公开(公告)日：2008-01-10
申请号：JP2006170163
申请日：2006-06-20
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： UEDA HIROKO , KOMORI KENJI , HATANAKA HIROSHI , FUNAKOSHI SHIGEO , KASAHARA TAKESHI
IPC分类号： A61F13/02
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet having comfortable touch which prevents skin rush and irritation.
SOLUTION: The adhesive sheet 10 comprises a support 1 and an adhesive layer 2 disposed on one side of the support 1. The support 10 comprises a first substrate 3 and a second substrate 4 disposed on at least one side of the first substrate 3 and is treated with a filling agent. The first substrate 3 is made of a melt blow nonwoven fabric and the second substrate 4 is made of a span band nonwoven fabric having a bulk density of 0.05-0.3 g/cm
3 . The second substrate 4 is arranged on the outermost layer 5 of the adhesive sheet 10.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有舒适触感的粘合片，防止皮肤瘙痒和刺激。解决方案：粘合片10包括支撑体1和设置在支撑体1的一侧上的粘合剂层2.支撑体10包括设置在第一基底的至少一侧上的第一基底3和第二基底4 3并用填充剂处理。第一基板3由熔喷无纺布制成，第二基板4由堆积密度为0.05-0.3g / cm 3的跨距带无纺布制成。第二基板4布置在粘合片10的最外层5上。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JPH06172571A SEMICONDUCTIVE OR CONDUCTIVE COMPOSITE, ITS PRODUCTION, AND ITS USE 失效
公开(公告)号：JPH06172571A
公开(公告)日：1994-06-21
申请号：JP2820393
申请日：1993-02-17
申请人： NITTO DENKO CORP
发明人： ABE MASAO , UETANI YOSHIHIRO , UEDA HIROKO , SHINOMURA TOSHIHIKO
IPC分类号： C08J9/00 , C08J9/40 , C08L79/00 , G03G5/06 , G03G5/07
摘要： PURPOSE:To provide the title composite which comprises an insulating# organic polymer and a conductive material having a volume resistivity in a semiconductive region and being reduced in the dispersion of the volume resistivity and excellent in the environmental stability of the volume resistivity and which can give a molding excellent in mechanical properties. CONSTITUTION:An organic polymer consisting mainly of quinonediimine structural units of the general formula wherein m and n are molar fractions of quinonediimine structural units and phenylenediamine structural units, respectively; 0

5. 发明专利

JP2008043461A Manufacturing method of pressure-sensitive adhesive tape or sheet for medical treatment 有权
标题翻译：用于医疗治疗的压敏胶带或薄片的制造方法
公开(公告)号：JP2008043461A
公开(公告)日：2008-02-28
申请号：JP2006220499
申请日：2006-08-11
申请人： Nitto Denko Corp , 日東電工株式会社
发明人： FUNAKOSHI SHIGEO , KOMORI KENJI , KASAHARA TAKESHI , UEDA HIROKO , HATANAKA HIROSHI
IPC分类号： A61F13/02 , B05D1/28 , B05D7/24 , B32B5/24 , B32B27/00 , B32B27/36 , D04H3/011 , D04H3/16 , D06M15/00 , D06M15/263
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a pressure-sensitive adhesive tape or sheet for medical treatment hard to turn stuffy and good in the feel, reduced in manufacturing cost and friendly to an environment.
SOLUTION: In the manufacturing method of the pressure-sensitive adhesive tape or sheet for medical treatment constituted by making a base material comprising paper and/or cloth and laminating a pressure-sensitive adhesive layer overlie at least one side of the laminated base material, the laminated base material is coated with a sealant to be subjected to sealing treatment and the coated base material is subsequently coated with a pressure-sensitive adhesive solution by direct transfer method and dried.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于医疗的压敏胶带或片材的制造方法，其难以变得闷热和良好的手感，降低了制造成本并且对环境友好。解决方案：在通过制造包含纸和/或布的基材和层压压敏粘合剂层的层压基底的至少一侧而构成的用于医疗的压敏粘合带或片材的制造方法中，材料中，层压基材涂覆有密封剂以进行密封处理，并且涂覆的基材随后通过直接转印法用压敏粘合剂溶液涂布并干燥。版权所有（C）2008，JPO＆INPIT

6. 发明专利

JPH06207010A PRODUCTION OF CONDUCTIVE ORGANIC POLYMER 失效
公开(公告)号：JPH06207010A
公开(公告)日：1994-07-26
申请号：JP350893
申请日：1993-01-12
申请人： NITTO DENKO CORP
发明人： OTANI AKIRA , ABE MASAO , UETANI YOSHIHIRO , UEDA HIROKO
IPC分类号： C08G73/00 , C08K5/09 , C08L79/00 , H01B1/12
摘要： PURPOSE:To efficiently obtain a highly conductive polyaniline film by oxidizing the polyaniline in a stable solution of an organic polymer composition containing an imino-p-phenylene type polyaniline and doping the organic polymer with a proton acid. CONSTITUTION:An organic polymer composition containing an organic polymer having imino-p-phenylene structural units of the formula as the principal repeating units and a proton acid salt selected from ammonium and organic amine salts of proton acids is treated with an oxidizing agent to dope the organic polymer with the proton acid in the proton acid salt, or an organic polymer composition containing the organic polymer, the proton acid salt and an oxidizing agent is heat treated to dope the organic polymer with the proton acid in the proton acid salt.

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