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    • 10. 发明专利
    • RESIST COMPOSITION
    • JPH03107162A
    • 1991-05-07
    • JP24392589
    • 1989-09-20
    • NIPPON ZEON CO
    • OIE MASAYUKIKAWADA MASAJIYAMADA TAKAMASA
    • G03F7/039G03F7/004G03F7/038H01L21/027H01L21/30
    • PURPOSE:To obtain a positive mold adequate for fine working of a semiconductor element having high sensitivity and resolution by constituting a resist material which can form patterns by irradiation with far UV rays of the compsn. contg. an alkaline-soluble hydrogenated phenolic resin, a compd. which can be acid-cloven by the irradiation with active rays, and a compd. which crosslinks in the presence of an acid. CONSTITUTION:The condensation reaction product of phenols and aldehydes and the condensation reaction product of phenols and ketones, a vinyl phenol polymer, isopropenyl phenol polymer are used as the alkaline-soluble hydrogenated phenolic resin. The compd. which can be acid-cloven by the irradiation with active rays, i.e., photoacid generator, is not particularly limited if the compd. is the material which generates Bronsted acid or Lewis acid; for example, an onium salt and halogenated org. compd. are used. The compd. which crosslinks in the presence of the acid is satisfactory if the compd. is the material which degrades the solubility of the hydrogenated phenolic resin in an alkaline developing agent; for example, a compd. having a C-O-R (group) (R is an alkyl group) is used.