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1. 发明专利

JPH0787125A METHOD FOR SECTIONING FAULT PART IN MODULE 失效
公开(公告)号：JPH0787125A
公开(公告)日：1995-03-31
申请号：JP17609593
申请日：1993-06-23
申请人： NIPPON TELEGRAPH & TELEPHONE , NEC CORP , HITACHI LTD , OKI ELECTRIC IND CO LTD , FUJITSU LTD
发明人： NITTA MASASHI , ITO ARATA , TAKAGI KOJI , MIYAYASU KENJI , SUZUKI KOJI , HORIE YOSHIHIRO , KIMURA NAOHIRO , NAKAMURA TAKESHI , KIMURA AKIO
IPC分类号： H04M3/22 , H04L12/70 , H04L12/48
摘要： PURPOSE:To section the fault part in a route judged as abnormal in detail by referring to an identifier given to a conductor test circuit in a communication path and a test cell and inserting a new test cell identifier into a line in the reverse direction. CONSTITUTION:A test cell is sent from a conductor test circuit in a communication line to a line correspondence part 2-2. The test cell which comes to the line correspondence part 2-2 through the SW-IN is folded by a test cell folding mechanism and sent it to the opposite line correspondence part 1-2. The coming test cell is folded through the SW-OUT in the line correspondence part 1-2 and sends it to the conductor test circuit in the communication line. The pattern of the test cell which comes in the test circuit is collated with the pattern of the test cell to judge the normal and abnormal of the conductor test. The fault sectioning test in the ATM exchange system is performed by combining the route judged as normal with the route judged as abnormal.

2. 发明专利

JPH09247170A NON-HIT CHANGEOVER METHOD FOR ATM CELL LEVEL 失效
公开(公告)号：JPH09247170A
公开(公告)日：1997-09-19
申请号：JP5134596
申请日：1996-03-08
申请人： NIPPON TELEGRAPH & TELEPHONE , NEC CORP , HITACHI LTD , FUJITSU LTD , OKI ELECTRIC IND CO LTD
发明人： NARITA SHINYA , SHIMOE TOSHIO , HORIE YOSHIHIRO , MINAMIMURA KEIZO , NOGUCHI SEIJI
IPC分类号： H04L1/22 , H04L12/28 , H04L12/70 , H04L12/713 , H04Q3/00
摘要： PROBLEM TO BE SOLVED: To provide a method for changing over line controllers with duplex configuration in an ATM cell level without occurrence of data loss. SOLUTION: A system is constituted of a pre-stage device 400, the line controllers 300 and 310 with duplex configuration having operation-system information setting function parts 302, 312 and flow rate control processing function parts 301, 311 and a post-stage device (ATM cell SW) 200. The flow of the ATM cell from the pre-stage device towards the operation-system line controllers is temporarily stopped, the ATM cell stored in the flow rate control processing function parts is transmitted to the post-stage device during the stop and an information transfer route by way of the line controllers with duplex configuration is changed-over after transmission is completed. When the flow of the ATM cell is temporarily stopped, information from a subscriber is stored in the pre-stage device and the flow of the ATM cell from the pre- stage device is re-started after the information transfer route is changed over. At the time of changing over the information transfer route, the ACT bit is inverted between the duplex line controllers.

3. 发明专利

JPH077753A CHANNEL DEVICE 失效
公开(公告)号：JPH077753A
公开(公告)日：1995-01-10
申请号：JP14774993
申请日：1993-06-18
申请人： HITACHI LTD , NIPPON TELEGRAPH & TELEPHONE , NEC CORP , FUJITSU LTD , OKI ELECTRIC IND CO LTD
发明人： KOBASHI ICHIRO , HORIE YOSHIHIRO , HIRANO YOSHITAKA , MINAMIMURA KEIZO , SUZUKI KOJI , TAKECHI RYUICHI , MUNAKATA KOICHI
IPC分类号： H04M3/22 , H04Q1/02 , H04Q3/52 , H04Q11/04
摘要： PURPOSE:To reduce the number of cables by accommodating a 1st selector mounting printed circuit board in a same nuit as a printed circuit board with a line correspondence section mounted thereon. CONSTITUTION:Signals from line correspondence sections 100-107, 110-117 are outputted to switch sections 200, 210 and signals from the line correspondence sections 100-107, 110-117 are outputted to inter-link sections 300, 310 by using a back wiring board printed wire of the line correspondence section 100 because the printed circuit board with the inter-link sections 300, 310 mounted thereon is accommodated in the line correspondence unit 00. Thus, when the output of signals from the line correspondence sections 100-107, 110-117 to the switch sections 200, 210 is executed by using a BWB printed wiring, one cable per one half system is enough to connect the units 00, 10 to output a speech signal from the inter-link sections 300, 310 to the switch sections 200, 210. Thus, the hardware quantity of the inter-link section connecting 0, 1 system of the line correspondence section is reduced.

4. 发明专利

JPH09130480A ELECTRONIC EXCHANGE AND TALKIE SERVICE SYSTEM FOR FAULT NOTICE OF COMMUNICATION CABLE FOR ELECTRONIC EXCHANGE 失效
公开(公告)号：JPH09130480A
公开(公告)日：1997-05-16
申请号：JP30339495
申请日：1995-10-30
申请人： TOKYO TSUSHINKI KOGYO KK , NIPPON TELEGRAPH & TELEPHONE
发明人： HORIE YOSHIHIRO , DOI YOSHINOBU , MORIYAMA OSAMU
IPC分类号： H04M3/26 , H04M3/42 , H04Q1/14
摘要： PROBLEM TO BE SOLVED: To obtain the system to inform a cable fault to a subscriber by detecting an insertion state of a diode depending on the polarity of the diode inserted between terminals of an exchange side wiring and informing fault information to the subscriber based on the detection information. SOLUTION: A conductor chip 8 is coated on one side of a printed circuit board 9 being an insulator. A spacer 7 is provided between the two boards 9 and a diode 10 is connected between the conductor chips 8. And a case 11 housing these member is provided. Terminals (6-1, 6-2) of a cut-off piece 5 are inserted to holes 3a, 3b to couple the cut-off piece 5 and a spring 4 to allow the diode 10 to be connected between springs 1a, 1b via the conductor chip 8. On the other hand, since springs 2a, 2b are in contact with a right side face where the conductor chip 8 for the terminals 6-1, 6-2 is absent, a part between the springs 2a, 2b remains open.

5. 发明专利

JPS6431447A POWER SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6431447A
公开(公告)日：1989-02-01
申请号：JP18816387
申请日：1987-07-27
申请人： NEC CORP
发明人： HORIE YOSHIHIRO
IPC分类号： H01L23/34 , H01L23/373 , H01L23/40 , H01L23/495 , H01L29/06
摘要： PURPOSE:To improve heat dissipation and to eliminate the crack of a semiconductor element by opening a trapezoidal recess on an element substrate, so burying reinforcing metal of metal having high thermal conductivity that the rear side of the element becomes flat, and soldering the rear face to a heat sink tab. CONSTITUTION:A trapezoidal recess 8 inclined at 45 deg. with respect to a vertical direction on the tapered wall of a converted shape from the end of a part directly under a heated part 2 provided at the surface 1a of a semiconductor element 1 is opened, metal having high thermal conductivity, such as silver or gold is so buried in the recess 8 that the rear face 1b of the element 1 becomes flat by plating, as a reinforcing metal 9. The thus reinforced element 1 is die bonded by solder to a heat sink tab 4 at the rear side 1b by lead solder 5. Further, fine metal wirings 7 are connected to external leads 6 to be electrically connected. Accordingly, heat dissipation is remarkably improved, and even if the thickness of the element is reduced, it is not cracked.

6. 发明专利

JPS61260647A POWER SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61260647A
公开(公告)日：1986-11-18
申请号：JP10290485
申请日：1985-05-15
申请人： NEC CORP
发明人： HORIE YOSHIHIRO
IPC分类号： H01L23/34 , H01L21/60
摘要： PURPOSE:To ensure excellent mounting and bonding by a method wherein the end of an outer lead is held in an insulating member positioned between a junction tab and a heat-radiating tab. CONSTITUTION:A power semiconductor element 1 is installed on the upper surface of a junction tab 2. On the lower surface of the junction tab 2, a heat- radiating tab 3 is placed with the intermediary on an insulating member 4. The end of an outer lead 6 is pushed into between the junction tab 2 and heat- radiating tab 3, where the end of the outer lead 6 is held in the insulating member 4, thus insulated from its environments. The outer lead 6 and an electrode of the power semiconductor element 1 is connected to a fine metal wire 5. Sealing with resin is accomplished for the power semiconductor element 1, while the lower surface of the heat-radiating tab 3 is left exposed for unimpeded radiation of heat. By using this technique, workability is improved during the processes of mounting and bonding, and the number is reduced of troubles attributable to short-circuiting.

7. 发明专利

JPS63240550A PHOTOMASK 失效
公开(公告)号：JPS63240550A
公开(公告)日：1988-10-06
申请号：JP7531387
申请日：1987-03-27
申请人： NEC CORP
发明人： HORIE YOSHIHIRO
IPC分类号： G03F1/00 , G03F1/54 , G03F1/68 , H01L21/027 , H01L21/30
摘要： PURPOSE:To obtain the titled mask which has high matching dimensional accuracy and is usable for different steps by forming elemental patterns usable for each different steps on the both-face of a substrate plate respectively. CONSTITUTION:The titled photomask is provided with the transparent substrate plate 1, a metal film 2a which is composed of chromium and forms an emitter range as a 1st elemental pattern, and is formed on one side surface of the substrate late 1 by sputtering etc., and a metal film 2b which is composed of chromium and forms an emitter contact region of the relating part of the same element as a 2nd elemental pattern and is formed on the another side surface of the substrate plate 1 by sputtering, etc. Thus, the relatively dimensional accuracy of the both patterns is improved, and the titled photomask having the high matching dimensional accuracy is obtd.

8. 发明专利

JPS6387754A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6387754A
公开(公告)日：1988-04-19
申请号：JP23362186
申请日：1986-09-30
申请人： NEC CORP
发明人： HORIE YOSHIHIRO
IPC分类号： H01L23/50 , H01L21/60
摘要： PURPOSE:To prevent occurrences of positional shift and bending failure in outer leads, by holding top end parts of the outer leads into an insulating member disposed on a rear surface of a connection tab. CONSTITUTION:A semiconductor element 1 is mounted on upper surface of a connection tab 2, and an insulating member 3 is disposed on a rear surface of the connection tab2, and top ends parts of outer leads 5 are buried into the insulating member 3. The connection tab 2 is separated from all outer leads 5 and held in its insulating state by the outer leads 5 through the insulating member 3. Metallic thin wires 4 are connected between the outer leads 5 and electrodes of the semiconductor element 1 and next sealed with resin for sealing. The insulating member 3 is molded by pouring resin into an iron mold in which the outer lead 2 is interposed between the upper and lower molding parts. Shift of a mutual position between the outer lead 5 and the connection tab 2, and deviation in parallelism are prevented from occurring.

9. 发明专利

JPH01160031A SEMICONDUCTOR INTEGRATED CIRCUIT 失效
公开(公告)号：JPH01160031A
公开(公告)日：1989-06-22
申请号：JP31987387
申请日：1987-12-16
申请人： NEC CORP
发明人： HORIE YOSHIHIRO
IPC分类号： H01L21/66 , H01L21/60
摘要： PURPOSE:To obtain an integrated circuit capable of measuring a performance characteristic of an element by a state of a chip, by providing an opening in an insulating film covering a surface of an element above an electrode and a measuring electrode connected to the pole through the opening. CONSTITUTION:An emitter region 2, a collector region 3, a base region 4 and a resistance region 3 are formed on a substrate 1. An emitter electrode 6, a collector electrode 7, a base electrode 8 and a resistance electrode 9 are formed of gold or metal of aluminum group and an element such as a transistor and a diode is formed in accordance with a circuit construction to form an integrated circuit chip. The upper part of the emitter electrode 6, the collector electrode 7 and the base electrode 8 of the insulating film 11 covering the whole surface of the integrated circuit chip is removed by photolithography to form an opening. Through this opening, the emitter electrode 6, the collector electrode 7 and the base electrode 8 are connected to form measuring electrodes 12E, 12C and 12B of metal such as gold or aluminum on the insulating film 11. As a result, it is possible to measure a performance characteristic of an element by a state of a chip.

10. 发明专利

JPS6489355A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6489355A
公开(公告)日：1989-04-03
申请号：JP24718487
申请日：1987-09-29
申请人： NEC CORP
发明人： HORIE YOSHIHIRO
IPC分类号： H01L21/304 , H01L21/331 , H01L21/52 , H01L25/04 , H01L25/18 , H01L29/72 , H01L29/73 , H01L29/732
摘要： PURPOSE:To improve thermal characteristic and to prevent a semiconductor device from cracking by isolating heat generating sections of adjacent semiconductor elements, and forming a metal layer on a substrate. CONSTITUTION:After an emitter 2, a base 3 and a collector 4 are formed on a substrate 6, an insulating tape 5 is adhered on a semiconductor element 1. Then, the substrate 6 is reduced in thickness by chemical and mechanical treatment method from the side of the substrate 6. Then, the heat generating section 7 of the element 1 is isolated from that of its adjacent element 1. Thereafter, an insulator 8 is buried in a recess generated in the isolating step, thereby flattening the surface of the substrate. Subsequently, after a metal layer 9 is formed on the whole substrate, the tape 5 is separated, and the insulator 8 is then removed. Thus, the thermal balance with heat dissipation is improved, thereby improving thermal characteristic. Even if the size of a semiconductor element is increased, it can prevent the element from cracking.

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