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    • 1. 发明专利
    • QUANTUM WIRE STRUCTURE AND ITS MANUFACTURE
    • JPH07307452A
    • 1995-11-21
    • JP12454094
    • 1994-05-13
    • NIPPON TELEGRAPH & TELEPHONE
    • OSAKA JIROWAHO TAKAO
    • C30B23/08C30B29/40H01L29/06H01L29/15H01L29/66
    • PURPOSE:To form a fractional supper lattice layer on a buffer layer in a manner that a group of a blocking layer part and well layer part (both are III-V semiconductor layer) will have a highly accurate step cycle in accordance with the tilt angle from a low-index face of a III-V compound semiconductor substrate body in a facial direction and to make the layer to operate as a uniform quantum wire structure. CONSTITUTION:A quantum wire structure is provided with a III-V compound semiconductor layer 10 that is formed on the surface comprised of a step face 4a of a III-V compound semiconductor layer 4 as a first blocking layer and whose thickness is set to be at most three molecular layer through molecular beam epitaxial growth. In addition, the layer 10 is a buffer layer having a surface comprised of a step face 10a that is made of GaAs having a narrower forbidden band width than that of the layer 4 as the first blocking layer and corresponds to a step face 3a of a III-V compound semiconductor layer 3 of a III-V compound semiconductor substrate 1. Then, a fractional supper lattice layer 5 consisting of a semiconductor layer part 5B as a blocking layer and a semiconductor layer part 5W as a well layer is provided on the step 10a.
    • 3. 发明专利
    • RESONANCE TUNNELING STRUCTURE
    • JPH0485966A
    • 1992-03-18
    • JP20188590
    • 1990-07-30
    • NIPPON TELEGRAPH & TELEPHONE
    • WAHO TAKAO
    • H01L29/68H01L29/205
    • PURPOSE:To obtain a resonance current in a remarkably higher current density than a conventional structure by inserting a semiconductor laminate of a semiconductor layer as a barrier layer and a semiconductor layer as a well layer between first and second semiconductor layers under special conditions. CONSTITUTION:A semiconductor laminate 3 in which semiconductor layers B1, B2, B3 as barrier layers and semiconductor layers W1, W2 as well layers are laminated in the order of the layers B1, W1, B2, W2 and B3 is inserted between first and second semiconductor layers l and 2. The layers W1, W2 as the well layers have equal widths, and the layer B2 as the barrier layer has a thickness of 174-3/4 thinner than those of the layers W1, W2 as the well layers. When a bias voltage is applied between the layers 1 and 2, the layers B1, B3 as the barrier layers have sufficient barrier height and thickness to obtain a resonance level width of 1meV or higher, and a resonance current has a current density remarkably higher than prior art.
    • 5. 发明专利
    • SEMICONDUCTOR ELEMENT
    • JPS63204660A
    • 1988-08-24
    • JP3571987
    • 1987-02-20
    • NIPPON TELEGRAPH & TELEPHONE
    • WAHO TAKAO
    • H01L29/205H01L21/338H01L29/775H01L29/778H01L29/78H01L29/80H01L29/812
    • PURPOSE:To enable transverse extension of a channel region to be defined and to obtain a very high speed element, by providing a fourth electrode between second and third electrodes for controlling current conducted through the channel region between the second and third electrodes. CONSTITUTION:A fine wire-like doped region 405 is provided in a substrate 401. A layer 403 having a lower electron affinity is provided thereon and a layer 404 having a higher electron affinity is further provided on the layer 403. An electrode 400 connected to the doped region 405 is also provided and a predetermined voltage is applied. The doped region 405 functions as a channel inducing region so that a so-called MIS-like FET structure in which channel region formed of a carrier storing layer or carrier inversion layer is induced on the lower face of the uppermost layer is provided. In this manner, a extremely miniaturized structure can be realized, vertically along the thickness of deposited films. Further, miniaturized construction is made possible also in the transverse direction, namely along the width of the channel, without being adversely affected by surface trapping and a one-dimensional channel can be formed. Accordingly, it is made possible to obtain a very high speed element taking most advantage of rapid propagation of electron.
    • 8. 发明专利
    • RESONANCE TUNNEL DIODE
    • JPH1065186A
    • 1998-03-06
    • JP21961796
    • 1996-08-21
    • NIPPON TELEGRAPH & TELEPHONE
    • KITABAYASHI HIROTOWAHO TAKAO
    • H01L29/88
    • PROBLEM TO BE SOLVED: To enable improving peak current density, without decreasing the ratio of a peak current to a valley current in a structure having a constant barrier thickness by using a quantum well layer having a thickness, so that the resonance level of light positive holes in the quantum well layer is just above the lower end of the conduction band of an emitter layer. SOLUTION: The resonance level of light positive holes in a p-type GaSb quantum well layer 104 is just above the lower end of the conduction band of an n-type InAs emitter layer 106, so that the effective heights of AlSb barrier layers 103, 105 can be made minimum, under the condition that a resonance tunnel exists. Thereby the maximum width of resonance level can be obtained under the condition that a resonance tunnel exists. The increase in a valley current caused by that the resonance level being just above the lower end of the conduction band is not recognized. Thereby the peak current density can be improved, without decreasing the ratio of a peak current to a valley current, in the resonace tunnel diode structure having a constant barrier width.