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    • 2. 发明专利
    • COOLING DEVICE FOR HIGHLY HEATING EQUIPMENT
    • JPS60223993A
    • 1985-11-08
    • JP7961884
    • 1984-04-20
    • NIPPON TELEGRAPH & TELEPHONE
    • ICHIMURA MITSURUSUENAGA TETSUONAKAO MASAKIISHIGAMI AYAOKUDOU KENICHIROU
    • F28D15/02F28D19/00
    • PURPOSE:To permit to cool the highly heating equipment without spoiling the functions thereof by a method wherein second heat exchanger is provided at a higher position than first heat exchanger, these heat exchanger are connected circularly through pipeline and low boiling point refrigerant, vaporized in atmosphere, is sealed into the pipeline. CONSTITUTION:The heat exchanger 2 is provided above an electronic switch- board 1 and the heat exchanger 2, provided at the outside of a room 8, is arranged at higher position than the heat exchanger 2. The heat exchanger 2, refrigerant pipelines 4 and the heat exchanger 3 are connected so as to form a closed loop and the low boiling point refrigerant, evaporated in the atmosphere, such as Freon or the like for example, is sealed into the pipelines. The refrigerant is the low boiling point refrigerant capable of being evaporated in the atmosphere, therefore, it is evaporated instantaneously even in case leakage of the same is caused and there is no possibility to spoil the switchboard 1. The circulation of the low boiling point refrigerant is effected utilizing the principle of thermosyphon, therefore, the trouble of the device may be reduced and the reliability of the same may be improved. Further, the possibility of dewing on the surface of the heat exchanger 2 may be very few.