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1. 发明专利

JP2008180754A Optical sheet and method for manufacturing the same 审中-公开
标题翻译：光学片及其制造方法
公开(公告)号：JP2008180754A
公开(公告)日：2008-08-07
申请号：JP2007012186
申请日：2007-01-23
申请人： Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社
发明人： SUZUKI TAKANOBU , NIIMI KAHORU
IPC分类号： G02B5/02 , B32B17/04 , B32B27/18 , B32B27/30 , G02B1/04 , G02F1/1333
摘要： PROBLEM TO BE SOLVED: To provide an optical sheet which is more lightweight and excellent in transparency, smoothness, and optical characteristics, has good bending property, and can be manufactured at a lower cost, and to provide a method for manufacturing the same.
SOLUTION: The optical sheet is characterized in that at least a (meth)acrylate resin layer 7, formed by the cross-linking of an active energy ray curable composition 8, and an inorganic layer 9 are laminated. At this time, it is preferable that the inorganic layer 9 is a layer obtained by impregnating glass fibers with the active energy ray curable composition 8.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供更轻便，透明性，光滑性和光学特性优异的光学片，具有良好的弯曲性能，并且可以以较低的成本制造，并且提供一种制造方法相同。光学片的特征在于，至少通过活性能量射线固化性组合物8的交联形成的（甲基）丙烯酸酯树脂层7和无机层9层叠。此时，优选无机层9是通过用活性能量射线固化性组合物8浸渍玻璃纤维而得到的层。（C）2008，JPO＆INPIT

2. 发明专利

JP2008056831A Active energy ray-curable composition, cured film comprised of the same, and optical disk using the film 审中-公开
标题翻译：活性能量可固化组合物，包括其的固化膜和使用电影的光盘
公开(公告)号：JP2008056831A
公开(公告)日：2008-03-13
申请号：JP2006237002
申请日：2006-08-31
申请人： Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社
发明人： SUZUKI TAKANOBU , NIIMI KAHORU
IPC分类号： C08F2/44 , C08J5/18 , C08K5/00 , C08L33/12 , C08L67/04 , G11B7/24 , G11B7/254 , G11B7/257
摘要： PROBLEM TO BE SOLVED: To provide an active energy ray-curable composition that is transparent and little in optical distortion and excellent in heat deformation resistance, and to provide a cured film comprised of the same and an optical disk containing the cured film layer as a part of the component member. SOLUTION: The active ray-curable composition comprises 70-90 pts.mass poly(methyl methacrylate), 10-30 pts.mass polylactic acid, and 1-50 pts.mass active ray-curable polyfunctional compound, and the optical disk is prepared by laminating the cured film layer made of the composition on a supporting board as a protecting membrane or as a light transmitting layer. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供透明且光学变形小，耐热变形性优异的活性能量射线固化性组合物，提供由其构成的固化膜和含有固化膜的光盘层作为组件成员的一部分。解决方案：活性可光固化组合物包含70-90聚体（甲基丙烯酸甲酯），10-30质量份聚乳酸和1-50质子活性可光固化的多官能化合物，光学通过将由组合物制成的固化膜层作为保护膜或作为透光层层压在支撑板上来制备盘。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2005353420A Conductive material, carrier sheet of conductive material, and charging method and device of conductive material 审中-公开
标题翻译：导电材料，导电材料载体片，以及导电材料的充电方法和装置
公开(公告)号：JP2005353420A
公开(公告)日：2005-12-22
申请号：JP2004173018
申请日：2004-06-10
申请人： Mitsubishi Plastics Ind Ltd , Sony Corp , ソニー株式会社 , 三菱樹脂株式会社
发明人： ITO SHIGEYASU , OGAWA MINORU , OTANI MOTOHIKO , YAMADA SHINGETSU , SUZUKI TAKANOBU , KUROSAKI NORIAKI
IPC分类号： H05K1/09 , H01B1/20 , H01B5/14 , H05K3/10 , H05K3/12 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a conductive material filled flatly in a through-hole even with thermosetting treatment by filling it once in a substrate.
SOLUTION: The conductive material, containing at least thermosetting binder resin and a conductive filler, gets solid state at room temperature by being heated beforehand at a temperature in which hardening reaction does advance to let a substantial volume of solvent evaporated, and is softened as the binder resin is heated up to a temperature lower than a hardening reaction starting temperature.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：即使通过在基板中填充一次而通过热固化处理来提供平坦地填充在通孔中的导电材料。
解决方案：至少含有热固性粘合剂树脂和导电填料的导电材料在室温下通过预先加热固化反应的温度，使大量溶剂蒸发而得到固态，并且随着粘合剂树脂被加热到低于硬化反应开始温度的温度而软化。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005330440A Composite clay/polypropylene film 审中-公开
标题翻译：复合粘土/聚丙烯膜
公开(公告)号：JP2005330440A
公开(公告)日：2005-12-02
申请号：JP2004152277
申请日：2004-05-21
申请人： Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社
发明人： SUZUKI TAKANOBU
IPC分类号： C08L23/10 , C08K9/04 , C08L45/00
摘要： PROBLEM TO BE SOLVED: To provide a composite clay/polypropylene resin film excellent in gas barrier properties.
SOLUTION: The film comprises 40 to 100 pts. wt. polypropylene resin comprising at least one member selected from the group consisting of a polypropylene homopolymer and a copolymer of propylene with at least another unsaturated hydrocarbon monomer, 60 to 0 pt. wt. at least one polycycloolefin resin selected from the group consisting of a polycycloolefin homopolymer, a copolymer of a cycloolefin with at least another unsaturated hydrocarbon monomer and hydrogenates thereof, and 0.5 to 15 pts. wt., per 100 pts. wt., in total, above polypropylene resin and above polycycloolefin resin, clay treated with a 30C or higher tetralakylammonium.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供阻气性优异的复合粘土/聚丙烯树脂膜。
解决方案：该膜包含40至100个点。重量。包含选自聚丙烯均聚物和丙烯与至少另一种不饱和烃单体的共聚物中的至少一种的聚丙烯树脂为60〜0pt。重量。至少一种选自聚环烯烃均聚物，环烯烃与至少另一不饱和烃单体的共聚物及其氢化物的聚环烯烃树脂和0.5〜15重量份。重量，每100点。总共在聚丙烯树脂和聚环烯烃树脂上方，用30℃或更高的四氢萘基铵处理的粘土。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2004230729A Film for transferring thin metal film 审中-公开
标题翻译：用于传输薄膜的薄膜
公开(公告)号：JP2004230729A
公开(公告)日：2004-08-19
申请号：JP2003022349
申请日：2003-01-30
申请人： Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社
发明人： NISHIO YOSHIHIKO , SUZUKI TAKANOBU
IPC分类号： B32B15/082 , B32B15/08 , B32B15/085 , C23C14/20 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a film for transferring a thin metal film capable of eliminating crease generation during transferring and contamination of a thin metal film layer generated before and after transferring.
SOLUTION: A release layer 3 comprising a fluororesin, an olefin resin or a polyvinyl alcohol resin and a thin metal film layer 4 are successively laminated on a surface of a base material 2 with a thickness of approximately 5-200 μm to constitute the film 1 for transferring the thin metal film. By forming the release layer 3 from the fluororesin, the olefin resin or the polyvinyl alcohol resin which has an especially excellent release property among those resins which are provided with the release property, it is possible to prevent the thin metal layer 4 from being contaminated by remaining of a release resin and a solvent on the thin metal film side when the thin metal film layer 4 is released.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种转印薄膜的薄膜，其能够消除在转印期间产生的薄金属膜层的转印和污染期间产生折痕。解决方案：将包含氟树脂，烯烃树脂或聚乙烯醇树脂和薄金属膜层4的剥离层3依次层压在厚度约5-200μm的基材2的表面上以构成用于转移薄金属膜的薄膜1。通过从具有剥离性的那些树脂中的氟树脂，烯烃树脂或具有特别优异的剥离性的聚乙烯醇树脂形成剥离层3，可以防止薄金属层4被当薄金属膜层4被释放时，在薄金属膜侧保留释放树脂和溶剂。版权所有（C）2004，JPO＆NCIPI

6. 发明专利

JP2004175983A Peelable film 有权
公开(公告)号：JP2004175983A
公开(公告)日：2004-06-24
申请号：JP2002345764
申请日：2002-11-28
申请人： Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社
发明人： SUZUKI TAKANOBU
IPC分类号： C08J5/18 , B32B27/18 , B32B27/30 , C08K5/132 , C08K9/00 , C08L27/12 , C09K3/00
摘要： PROBLEM TO BE SOLVED: To prepare a fluororesin-containing peelable film excellent in visible light transparency and ultraviolet light-absorbing properties, and capable of being processed with a UV-laser.
SOLUTION: This peelable film contains a fluororesin and at least one kind of ultraviolet light-absorbing substance, and has an average total luminous transmittance of 60% or more in the range of 380 to 780nm as determined according to JIS K7105.
COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2004122701A Polysiloxane thin film transfer sheet 审中-公开
公开(公告)号：JP2004122701A
公开(公告)日：2004-04-22
申请号：JP2002293425
申请日：2002-10-07
申请人： Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社
发明人： SUZUKI TAKANOBU
IPC分类号： G02F1/1333 , B32B27/00 , C08J5/18
摘要： PROBLEM TO BE SOLVED: To provide a polysiloxane thin film transfer sheet in which a high quality polysiloxane thin film can be transferred, regardless of the quality and shape.
SOLUTION: In the polysiloxane thin film transfer sheet having a construction which laminates a polysiloxane thin film layer on a plastic sheet having a releasing surface or on a glass sheet having a releasing surface, the ten-point average roughness Rz on the releasing surface of the plastic sheet or the glass sheet is set to 0.5 μm or less. The releasing surface of the plastic sheet or the glass sheet is smoothed to transfer the ruggednes on the release layer surface on the surface of the polysiloxane thin film layer, increasing the haze (cloudiness), which allows the deterioration of transparency to be prevented, improving the transparency of the polysiloxane thin film to be transferred.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2005353785A Conductive paste composition for multilayer interconnection substrate 有权
标题翻译：用于多层互连基板的导电胶组合物
公开(公告)号：JP2005353785A
公开(公告)日：2005-12-22
申请号：JP2004172075
申请日：2004-06-10
申请人： Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社
发明人： SUZUKI TAKANOBU , YAMADA SHINGETSU
IPC分类号： H05K1/09 , H01B1/20 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a heating curing type conductive paste composition which assures electric reliability and a moisture absorption reflow thermal resistance by preventing an uncuring drop resistance and an exudation even when conductive paste is used for an inner layer, an outer layer wiring part, and a via hole in a multilayer interconnection substrate. SOLUTION: The conductive paste composition is used for at least one selected from the group consisting of an inner layer wiring conductor, an outer layer wiring conductor, and a via hole conductor of the multilayer interconnection substrate. The conductive paste composition contains a conductive power and a binder resin. The binder resin contains at least 20 mass% of a polyimide resin having a weight-average molecular weight of 1.0×10 3 -5.0×10 4 and containing at least 20 mass% of a polyimide resin having an alicyclic unsaturated imide component and an alkenyl component in one molecule. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决方案：提供一种加热固化型导电浆料组合物，其即使在内层使用导电性糊料的情况下，也可以通过防止未固化滴落阻力和渗出物来确保电气可靠性和吸湿回流热阻，层布线部分和多层互连基板中的通孔。＆lt; P＆gt;解决方案：导电糊组合物用于从多层互连基板的内层布线导体，外层布线导体和通孔导体中选择的至少一种。导电性糊剂组合物含有导电性和粘合剂树脂。粘合剂树脂含有至少20质量％的重均分子量为1.0×10 3 SP / SP> -5.0×10 SP 3的聚酰亚胺树脂，并含有至少20质量％％的一分子中具有脂环族不饱和酰亚胺成分和链烯基成分的聚酰亚胺树脂。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2005353781A Conductive paste composition for multilayer interconnection substrate 有权
标题翻译：用于多层互连基板的导电胶组合物
公开(公告)号：JP2005353781A
公开(公告)日：2005-12-22
申请号：JP2004172052
申请日：2004-06-10
申请人： Mitsubishi Plastics Ind Ltd , Sony Corp , ソニー株式会社 , 三菱樹脂株式会社
发明人： YAMADA SHINGETSU , SUZUKI TAKANOBU , OGAWA MINORU
IPC分类号： H05K1/09 , H01B1/22 , H01B1/24 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a conductive paste composition which can assure sufficient substrate reliability for a moisture absorption reflow thermal resistance, a resistance value, etc. even when a crystalline thermoplastic resin is used for an inner layer, an outer layer and conductor wiring of a via hole in a batch multilayer interconnection substrate using a crystalline thermoplastic resin for an insulation base material, in a heat curing type conductive paste composition used for the multilayer interconnection substrate. SOLUTION: The conductive paste composition for the multilayer interconnection substrate is used for the multilayer interconnection substrate obtained by batch laminating the interconnection substrate containing a conductive paste composition on the front surface of an insulating base material obtained from a crystalline thermoplastic resin composition and in the via hole by heat fusion bonding. The conductive paste composition contains a conductive powder, and an additional type thermosetting imido monomer. The curing peak temperature of a polyimide induced from the additional type thermosetting imido monomer is the glass transition temperature (Tg) minus 15°C of the crystalline thermoplastic resin composition to lower than the crystallization peak temperature (Tc). COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种导电性糊剂组合物，即使当结晶性热塑性树脂用于内层时，也可以确保吸湿回流热阻，电阻值等的足够的基材可靠性，外层以及在用于多层互连基板的热固化型导电浆料组合物中使用用于绝缘基材的结晶热塑性树脂的批量多层互连基板中的通孔的导体布线。解决方案：用于多层互连衬底的导电糊组合物用于通过在由结晶热塑性树脂组合物获得的绝缘基材的前表面上分批层压含有导电糊组合物的互连基板而获得的多层互连基板和在通孔中通过热熔粘合。导电糊组合物含有导电粉末和另外的热固性酰亚胺单体。从附加型热固性酰亚胺单体引发的聚酰亚胺的固化峰值温度是结晶热塑性树脂组合物的玻璃化转变温度（Tg）减去15℃，低于结晶峰温度（Tc）。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005353387A Electrically conductive paste composite for multi-layer wiring board 有权
标题翻译：用于多层接线板的电导电胶复合材料
公开(公告)号：JP2005353387A
公开(公告)日：2005-12-22
申请号：JP2004172067
申请日：2004-06-10
申请人： Kyoto Elex Kk , Mitsubishi Plastics Ind Ltd , 三菱樹脂株式会社 , 京都エレックス株式会社
发明人： YAMADA SHINGETSU , SUZUKI TAKANOBU , MORISHIMA NOBUAKI
IPC分类号： H05K1/09 , H01B1/22 , H01B1/24 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide thermosetting property electrically conductive paste composite used for a multi-layer wiring board with which sufficient wiring board reliability about moisture absorption reflow thermal resistance, resistance value and so on can be secured, even if the paste composite is used as electrically conductive wiring in internal layers on outer layers and in viaholes of a collective multi-layer wiring board of which insulating base members are made of crystalline thermoplastic resin. SOLUTION: The electrically conductive paste composite is used for the multi-layer wiring board which is formed by collective lamination using thermal fusion of wiring boards having the electrically conductive paste composite on surfaces and in the viaholes of the insulating base members made of crystalline thermoplastic resin composite. The electrically conductive paste composite contains electrically conductive powder and resin mixture including epoxy resin and curing agent. Curing peak temperature of the resin mixture is equal to crystalline thermoplastic resin composite glass transition temperature (Tg) -15°C or more and less than crystalline peak temperature (Tc) of the crystalline thermoplastic resin composite. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供用于多层布线基板的热固性导电糊料复合物，即使该糊状物能够确保具有足够的布线板对吸湿回流的可靠性，耐热性，电阻值等的可靠性复合材料用作绝缘基材由结晶热塑性树脂制成的外层和内层多层布线板的通孔中的导电布线。
解决方案：导电浆料复合材料用于通过使用具有导电浆料复合物的布线板的热熔融和在绝缘基底构件的通孔中的集中层压形成的多层布线板结晶热塑性树脂复合材料。导电性糊料复合体含有导电性粉末和包含环氧树脂和固化剂的树脂混合物。树脂混合物的固化峰值温度等于结晶热塑性树脂复合玻璃化转变温度（Tg）-15℃以上且小于结晶热塑性树脂复合体的结晶峰值温度（Tc）。版权所有（C）2006，JPO＆NCIPI

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