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1. 发明专利

JP2014041966A Package for light emitting device and light emitting device 审中-公开
标题翻译：发光装置和发光装置的包装
公开(公告)号：JP2014041966A
公开(公告)日：2014-03-06
申请号：JP2012184309
申请日：2012-08-23
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： UMEDA KAZUNORI , MATSUI JUN , KATO YUKIO
IPC分类号： H01L33/62
摘要： PROBLEM TO BE SOLVED: To provide: a package capable of preventing deformation caused around the center of a resin part between lead electrodes; and a light emitting device including the package.SOLUTION: A package 2 includes lead electrodes 10, 20 and a resin molding 3 that molds the lead electrodes 10, 20 with a resin, while the resin molding 3 has a circular form and a cup part 3a for arranging a light emitting element is provided at the inside of the resin molding 3. In a light emitting device, a light emitting element 4 is mounted in the package. The lead electrode 20 is provided with a reinforcing piece part 30 extending along a side of the lead electrode 10. The reinforcing piece part 30 is buried in a corner part 3C of the resin molding 3.
摘要翻译：要解决的问题：提供：能够防止在引线电极之间的树脂部分的中心附近产生变形的封装; 以及包括封装的发光器件。解决方案：封装2包括引线电极10,20和树脂模制件3，树脂模制件3用树脂模制引线电极10,20，同时树脂模制件3具有圆形形状和杯形部分在树脂模制品3的内部设置用于布置发光元件的3a。在发光装置中，发光元件4安装在封装中。引线电极20设置有沿着引线电极10的一侧延伸的加强件部分30.加强件部件30被埋在树脂模制件3的拐角部分3C中。

2. 发明专利

JP2012000890A Sandwich structure 有权
标题翻译：三重结构
公开(公告)号：JP2012000890A
公开(公告)日：2012-01-05
申请号：JP2010138446
申请日：2010-06-17
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： KAWAHIGASHI HIROYUKI , IKEDA KATSUSHI , KATO YUKIO , NAKATANI YUICHI , TERADA KAZUYUKI
IPC分类号： B32B5/28 , B29C43/18 , B29C43/28 , B29C43/34 , B29K105/04 , B29K105/08 , B29L9/00 , C08J5/04
摘要： PROBLEM TO BE SOLVED: To provide a sandwich structure in which the flexural modulus of skin materials is high, and which has high rigidity.SOLUTION: The sandwich structure 8 includes: a core material 8a; and skin materials 8b provided to both the faces of the core material 8a. The core material 8a and the skin materials 8b are made of a fiber-reinforced resin in which short fibers are dispersed into a matrix resin at random. The content of the reinforcing fibers in the core material 8a is 20 to 80 wt.%, the content of the reinforcing fibers in the skin materials is 30 to 80 wt.%, the flexural modulus of the surface skin materials is ≥10 GPa which is indispensable, and the apparent density of the core material is 0.2 to 1.2g/cmor more. Preferably, porosity of the surface skin materials is
摘要翻译：要解决的问题：提供其中皮肤材料的弯曲模量高并且刚性高的夹层结构。夹层结构8包括：芯材8a; 以及设置在芯材8a的两面的表皮材料8b。芯材8a和表皮材料8b由纤维增强树脂制成，其中短纤维随机分散在基质树脂中。芯材8a中的增强纤维的含量为20〜80重量％，表皮材料中的增强纤维的含量为30〜80重量％，表皮材料的挠曲模量为≥10GPa，是不可缺少的，芯材的表观密度为0.2〜1.2g / cm 3以上。优选表面材料的孔隙率<10体积％，芯材的孔隙率为10〜80体积％。版权所有（C）2012，JPO＆INPIT

3. 发明专利

JP2011057993A Biodegradable resin composition 审中-公开
标题翻译：可生物降解树脂组合物
公开(公告)号：JP2011057993A
公开(公告)日：2011-03-24
申请号：JP2010242602
申请日：2010-10-28
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： TANAKA KAZUYA , TAKAGI JUN , KATO YUKIO
IPC分类号： C08L67/04 , C08K3/00 , C08K5/29 , C08L67/00 , C08L79/00 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To provide a new biodegradable resin composition in which impact resistance and heat resistance of lactic acid-based resin are improved without damaging the biodegradability of the lactic acid-based resin. SOLUTION: The biodegradable resin composition contains (1) the lactic acid-based resin, (2) aliphatic polyester (except the lactic acid-based resin) having ≤0°C glass transition temperature (Tg) and ≥50 J/g crystal-melting calorie (▵Hm), (3) other aliphatic polyester (except the lactic acid-based resin) having ≤0°C Tg and ≤30 J/g ▵Hm, and (4) an inorganic filler having 1-5 μm average particle size. A biodegradable molding excellent in both of impact resistance and heat resistance can be produced from the biodegradable resin composition by a usual method. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种在不损害乳酸类树脂的生物降解性的情况下提高乳酸类树脂的耐冲击性和耐热性的新的可生物降解性树脂组合物。生物降解性树脂组合物含有（1）乳酸类树脂，（2）具有≤0℃玻璃化转变温度（Tg）和≥50J/ cm 2以下的脂肪族聚酯（乳酸类树脂除外） g结晶熔融卡路里（▵Hm），（3）Tg为≤0℃，≤30J/ g·Hm的其他脂肪族聚酯（乳酸类树脂除外），（4） 5μm平均粒径。可以通过通常的方法由生物降解性树脂组合物制造耐冲击性和耐热性都优异的生物降解性成型品。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010202889A Injection-molded product 审中-公开
标题翻译：注射成型产品
公开(公告)号：JP2010202889A
公开(公告)日：2010-09-16
申请号：JP2010144582
申请日：2010-06-25
申请人： Mitsubishi Plastics Inc , Sony Corp , ソニー株式会社 , 三菱樹脂株式会社
发明人： TANAKA KAZUYA , KATO YUKIO , TAKAGI JUN , YAMADA SHINICHIRO , MORI HIROYUKI , FUJIHIRA HIROKO
IPC分类号： C08L67/04 , C08K5/29 , C08K9/06 , C08L67/02 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To provide an injection-molded product that achieves shortening of combustion time. SOLUTION: The injection-molded product is obtained by using a resin composition comprising (A) a lactic acid-based resin, (B) a copolymer of the lactic acid-based resin with a diol and a dicarboxylic acid, (C) a metal hydroxide surface-treated with a silane coupling agent, and (D) a fatty acid, wherein the percentage of (C) the metal hydroxide surface-treated with a silane coupling agent is 10-30 mass%, and the percentage of (D) the fatty acid is 0.1-5.0 mass% in the resin composition. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够缩短燃烧时间的注塑产品。解决方案：通过使用包含（A）乳酸类树脂的树脂组合物，（B）乳酸类树脂与二醇和二羧酸的共聚物（C ）用硅烷偶联剂表面处理的金属氢氧化物，和（D）脂肪酸，其中（C）用硅烷偶联剂表面处理的金属氢氧化物的百分比为10〜30质量％，（D）树脂组合物中的脂肪酸为0.1〜5.0质量％。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2014203889A 半導体装置用パッケージ及び半導体装置审中-公开
标题翻译：半导体器件和半导体器件封装
公开(公告)号：JP2014203889A
公开(公告)日：2014-10-27
申请号：JP2013076973
申请日：2013-04-02
申请人：三菱樹脂株式会社 , Mitsubishi Plastics Inc
发明人： UMEDA KAZUNORI , MATSUI JUN , KATO YUKIO
IPC分类号： H01L33/62 , H01L23/02 , H01L23/04 , H01L23/48
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00014
摘要：【課題】吊りリードの強度および吊りリードによるパッケージの保持力が高いパッケージと、このパッケージを用いた半導体装置とを提供する。【解決手段】リード電極10,20と、該リード電極10,20を樹脂モールドする樹脂成形体3とを有し、該樹脂成形体3は環形であり、樹脂成形体3の内側に半導体素子配置用のカップ部3aが設けられているパッケージ2。このパッケージ2は吊りリード60を介してリードフレーム65に保持されている。吊りリード60の爪状部61は、先端側ほどパッケージ2の底面から離隔している。この爪状部61が樹脂成形体3に差し込まれている。【選択図】図1
摘要翻译：要解决的问题：提供悬架引线的强度和悬挂引线的封装的保持力高的封装，并提供使用该封装的半导体器件。解决方案：封装2具有引线电极10 20，树脂成形体3的环状树脂成形用树脂成形体3，树脂成型品3的内侧设置有用于配置半导体元件的盖3a。包装2为通过悬挂引线60由引线框架65保持。悬挂引线60的棘爪61从封装2的底表面朝向尖端侧分离。棘爪61插入到树脂模制件3中。

6. 发明专利

JP2013030561A Lead frame, molding die, semiconductor device, and package 审中-公开
标题翻译：导线框架，模具，半导体器件和封装
公开(公告)号：JP2013030561A
公开(公告)日：2013-02-07
申请号：JP2011164710
申请日：2011-07-27
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： UMEDA KAZUNORI , KATO YUKIO
IPC分类号： H01L23/48 , B29C45/02 , B29C45/27 , B29C45/34 , H01L21/56 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To ensure air to be blown out from a cavity of a molding die to the exterior thereby preventing the occurrence of molding defects due to insufficient resin filling and improving the yield when a package of a semiconductor device is molded.SOLUTION: When a package 2, integrated with a resin molding by installing a lead frame 1 having a terminal lead 13 in a molding die and performing the resin mold, is molded, multiple hanging leads 14, 14 each of which connects with and supports a peripheral part of the resin molding, are provided at the lead frame 1. Multiple vent grooves 14a are formed on surfaces of the hanging leads 14, 14 to blow out air in a cavity from the vent grooves 14a to the exterior.
摘要翻译：要解决的问题：为了确保空气从成形模的空腔吹出到外部，从而防止由于树脂填充不充分而引起的模制缺陷的发生，并且当半导体器件的封装被模制时提高产量。解决方案：当通过在成型模具中安装具有端子引线13的引线框架1并执行树脂模具而与树脂模制件集成的封装2被模制时，多个悬挂引线14,14与并且在引线框架1处设置有树脂模制件的周边部分。多个通气槽14a形成在悬挂引线14,14的表面上，以将空腔中的空气从排气槽14a吹送到外部。版权所有（C）2013，JPO＆INPIT

7. 发明专利

JP2013007043A Resin composition and injection-molded article 审中-公开
标题翻译：树脂组合物和注塑成型品
公开(公告)号：JP2013007043A
公开(公告)日：2013-01-10
申请号：JP2012180022
申请日：2012-08-15
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： TANAKA KAZUYA , KATO YUKIO
IPC分类号： C08L67/04 , B29C45/00 , C08J5/00 , C08K5/5399 , C08L101/00 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To provide an injection-molded article having a flame retardant property and heat resistance.SOLUTION: This injection-molded article is provided by using a resin composition obtained by blending a mixture of (A) a lactic acid-based resin and (B) a flame retardant having a plasticizing effect on the lactic acid-based resin (A), and (C) a thermoplastic resin having ≥0 J/g and ≤30 J/g ΔHm, provided that the occupying content of the flame retardant (B) in the total amount of the lactic acid-based resin (A), flame retardant (B) and thermoplastic resin (C) is ≥1 mass% and ≤20 mass%, and the occupying content of the thermoplastic resin (C) in the resin composition is ≥10 mass% and ≤40 mass%.
摘要翻译：要解决的问题：提供具有阻燃性和耐热性的注射成型制品。解决方案：该注塑制品通过使用通过将（A）乳酸类树脂和（B）具有增塑作用的阻燃剂的混合物混合在乳酸基树脂上而获得的树脂组合物（A）和（C）≥0J/ g和≤30J/ gΔHm的热塑性树脂，条件是在乳酸类树脂（A）的总量中阻燃剂（B）的占有量），阻燃剂（B）和热塑性树脂（C）的质量分数≥1质量％且≤20质量％，树脂组合物中的热塑性树脂（C）的占有量为≥10质量％和≤40质量％。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2011224873A Fiber reinforced resin-made sandwich structure 审中-公开
标题翻译：纤维增强树脂三明治结构
公开(公告)号：JP2011224873A
公开(公告)日：2011-11-10
申请号：JP2010097114
申请日：2010-04-20
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： KAWAHIGASHI HIROYUKI , IKEDA KATSUSHI , KATO YUKIO , NAKATANI YUICHI , TERADA KAZUYUKI
IPC分类号： B32B5/28
摘要： PROBLEM TO BE SOLVED: To provide a fiber reinforced resin-made sandwich structure provided with a surface skin material made of a fiber reinforced molded product having excellent dynamic properties and thermal conductivity by improving the breakage of carbon fiber.SOLUTION: The sandwich structure 1, 1A includes core materials 2, 4; and surface skin materials 3 provided at both sides of the core materials. At least one surface skin material is made of a fiber reinforced resin in which carbon short fiber is contained in a matrix resin in a two-dimensional random dispersed state. The tensile modulus of elasticity of the carbon short fiber in a fiber axis direction is ≥400 GPa. The ratio of the one with a fiber length of 3 to 50 mm in the carbon short fiber is ≥50 wt.%. The content of the carbon short fiber in the surface skin material is 30 to 80 wt.%.
摘要翻译：要解决的问题：提供一种纤维增强树脂制的夹层结构，其具有通过改善碳纤维的断裂而具有优异的动态特性和导热性的由纤维增强模制产品制成的表皮表层材料。夹层结构1,1A包括芯材料2,4; 以及设置在芯材两侧的表皮材料3。至少一种表皮材料由纤维增强树脂制成，其中碳短纤维以二维无规分散状态包含在基质树脂中。碳纤维短纤维在纤维轴方向的拉伸弹性模量为≥400GPa。碳短纤维中纤维长度为3〜50mm的比例为≥50重量％。表面材料中的碳短纤维的含量为30〜80重量％。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2009293034A Injection-molded product 审中-公开
标题翻译：注射成型产品
公开(公告)号：JP2009293034A
公开(公告)日：2009-12-17
申请号：JP2009169763
申请日：2009-07-21
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： TANAKA KAZUYA , TAKAGI JUN , KATO YUKIO , OHASHI AKIHIRO
IPC分类号： C08L67/04 , B29C45/00 , C08L67/02 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To provide a resin composition having excellent impact resistance and heat resistance scarcely deteriorating the inherent biodegradability of the lactic acid resin.
SOLUTION: The resin composition comprises (A) a lactic acid-based resin, (B) an aromatic-aliphatic polyester having a glass transition temperature (Tg) of not higher than 0°C and heat quantity of crystal melting (ΔHm) of 5-30 J/g, and/or an aliphatic polyester other than the lactic acid resin having a glass transition temperature (Tg) of not higher than 0°C and heat quantity of crystal melting (ΔHm) of 5-30 J/g. The resin composition contains (B) an aromatic-aliphatic polyester having a glass transition temperature (Tg) of not higher than 0°C and heat quantity of crystal melting (ΔHm) of 5-30 J/g, and/or an aliphatic polyester other than the lactic acid resin having a glass transition temperature (Tg) of not higher than 0°C and heat quantity of crystal melting (ΔHm) of 5-30 J/g at 5-25 mass%.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有优异的耐冲击性和耐热性的树脂组合物几乎不降低乳酸树脂的固有的生物降解性。解决方案：树脂组合物包含（A）乳酸类树脂，（B）玻璃化转变温度（Tg）不高于0℃的芳族 - 脂族聚酯和结晶熔融热量（ΔHm ）和/或玻璃化转变温度（Tg）不高于0℃的乳酸树脂以外的脂肪族聚酯和结晶熔融热量（ΔHm）为5〜30J的脂肪族聚酯 /G。树脂组合物含有（B）玻璃化转变温度（Tg）不高于0℃，结晶熔化热（ΔHm）为5〜30J / g的芳香族 - 脂肪族聚酯和/或脂肪族聚酯不同于玻璃化转变温度（Tg）不高于0℃的乳酸树脂和5-25质量％的结晶熔融热（ΔHm）为5-30J / g。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009062479A Heat-resistant resin composition 有权
标题翻译：耐热树脂组合物
公开(公告)号：JP2009062479A
公开(公告)日：2009-03-26
申请号：JP2007232655
申请日：2007-09-07
申请人： Mitsubishi Plastics Inc , 三菱樹脂株式会社
发明人： TANAKA KAZUYA , KATO YUKIO
IPC分类号： C08L67/04 , C08K7/04 , C08K9/04 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To provide a resin composition that contains a lactic acid-based resin and has heat resistance. SOLUTION: This resin composition includes the lactic acid-based resin (A) blended with a fibrous filler (B) coated with a thermoplastic resin having a solubility parameter of which a difference from that of the lactic acid-based resin is 1.0 or more but 2.5 or less, wherein a rate of the fibrous filler (B) in the mixture of the lactic acid-based resin (A) and the fibrous filler (B) is 10 mass% or more but 60 mass% or less; and the relative degree of crystallinity of χc(A) of the lactic acid-based resin (A), the crystallization heat quantity ΔHc(A) of the lactic acid-based resin (A), and the crystal melting heat quantity ΔHm(A) of the lactic acid-based resin (A) meet the following relationship: χc(A)=äΔHm(A)-ΔHc(A)}/ΔHm(A)≥0.90. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：待解决的问题：提供含有乳酸类树脂并具有耐热性的树脂组合物。＆lt; P＆gt;解决方案：该树脂组合物包括与涂布有热塑性树脂的纤维状填料（B）共混的乳酸类树脂（A），该热塑性树脂的溶解度参数与乳酸类树脂的溶解度参数的差异为1.0 以上且2.5以下，其中，乳酸类树脂（A）和纤维状填料（B）的混合物中的纤维填料（B）的比例为10质量％以上且60质量％以下; 乳酸类树脂（A）的χc（A），乳酸类树脂（A）的结晶化热量ΔHc（A）和结晶熔融热量ΔHm（A）的相对结晶度）χc（A）=äΔHm（A）-ΔHc（A）} /ΔHm（A）≥0.90的乳酸类树脂（A）版权所有（C）2009，JPO＆INPIT

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