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1. 发明专利

JP2005303322A Processing method of wiring board, processing apparatus, and head for laser beam machining 审中-公开
标题翻译：接线板加工方法，加工设备和激光束加工头
公开(公告)号：JP2005303322A
公开(公告)日：2005-10-27
申请号：JP2005139840
申请日：2005-05-12
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TAKENO YOSHIMIZU , KANEKO MASAYUKI , MORIYASU MASAHARU , YUYAMA TAKAYUKI
IPC分类号： B26F1/26 , B23K26/00 , B23K26/06 , B23K26/14 , B23K26/38 , B23K26/40 , B23K101/42 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To provide a processing method and processing apparatus of a wiring board which does not cause deterioration such as peeling of a copper foil and a solder which form a circuit pattern when divided, and performs processings efficiently, with no sticking of a carbide and no residual crack on the surface of the wiring board and a cutting plane after processing. SOLUTION: A cyclic pulsed laser beam is made to scan along a processing line, a forming process to form a processed groove which is shallower in depth as compared with a totally processed depth is repeated two times or more, by which the processed depth of the processed groove becomes gradually deeper, then processings such as piercing, grooving, and cutting of an outline are performed through processing of the totally processed depth. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：为了提供一种布线板的处理方法和处理装置，其不会在划分时不引起形成电路图案的铜箔和焊料的剥离等劣化，并且无效地进行处理在接线板的表面和加工后的切割面上粘附碳化物并且不残留裂纹。解决方案：循环脉冲激光束沿着处理线进行扫描，与完全处理的深度相比，形成深度较浅的加工槽的成形工艺重复两次或更多次，由此加工经处理的槽深度逐渐变深，然后通过处理完整深度进行加工，例如穿孔，切槽和轮廓切割。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JPH07232289A LASER CUTTING METHOD 失效
公开(公告)号：JPH07232289A
公开(公告)日：1995-09-05
申请号：JP2698094
申请日：1994-02-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： KANEOKA MASARU , MORI HOMARE , YUYAMA TAKAYUKI , TAKENO YOSHIMIZU
IPC分类号： B23K26/382 , B23K26/00 , B23K26/14 , B23K26/36 , B23K26/38
摘要： PURPOSE:To prevent the deterioration of cut surface quality and the generation of erosion in machining at a switching part of machining condition and at a corner part in laser cutting. CONSTITUTION:At a switching part of machining condition, once cut locus is retreated, after machining condition is switched, machining is continued while subjecting to cooling or not. In machining a corner part, after a corner tip part is machined and machining is executed from the tip part with low input machining condition, machining condition is again changed. Right after piercing, cooling is once executed, subsequently, cutting is started. By this method, at a machining condition switching part, erosion is not generated on cutting surface so as to obtain good cut quality with low defect. In machining a corner part, erosion is not generated so as to obtain good cut quality with a low defect incidence. At a switching part from piercing to cutting, erosion is not generated so as to obtain good cut quality with a low defect incidence.

3. 发明专利

JPH1197821A LASER PROCESSING 失效
公开(公告)号：JPH1197821A
公开(公告)日：1999-04-09
申请号：JP25820697
申请日：1997-09-24
申请人： MITSUBISHI ELECTRIC CORP
发明人： YUYAMA TAKAYUKI , KANEOKA MASARU
IPC分类号： B23K26/382 , H05K3/00 , B23K26/00
摘要： PROBLEM TO BE SOLVED: To conduct the drilling of a printed board with high quality and good productivity by dividing the number of pulses of laser beam into 'n', successively irradiating the laser beam into each hole in each process and repeating the drilling processes just for only the number corresponding to the number of processes. SOLUTION: A laser beam is made to be irradiated for n1 pulses in accordance with a specified oscillation frequency (n1 pulse irradiating holes 18). In other words, the laser beam is irradiated on all the holes within the area, n1 pulses for each, with one hole at a time. After that, laser beam is irradiated on all the holes beginning with the first hole in the area according to the specified frequency, each of 2n pulses per hole at a time ((n1+n2) pulse laser irradiating holes 20). In such manner, laser beam irradiation is repeated until the final process, wherein laser beam is irradiated with, nn pulses for each. At this time, the total number of pulses irradiated on each hole becomes n1+n2+...nn=N. 'n' represents the number into which the N (the total number of pulses) is divided. In this way, the total number of pulses N is divided by 'n' and process in which several pulses of laser beam is irradiated for each process is repeated.

4. 发明专利

JPH1177343A LASER WORKING METHOD AND LASER WORKING DEVICE FOR LAMINATED MEMBER 失效
公开(公告)号：JPH1177343A
公开(公告)日：1999-03-23
申请号：JP24406197
申请日：1997-09-09
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKENO YOSHIMIZU , MORIYASU MASAHARU , KANEKO MASAYUKI , NISHIDA SATOSHI , YUYAMA TAKAYUKI
IPC分类号： B23K26/00 , B23K26/382 , B23K101/42 , H01S3/00 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To attain the complete removement of resin without reducing the working rate, i.e., to enable the consistency of high reliability with high efficiency in a laminated member. SOLUTION: This layer working method is the one that a pore part 19 is formed on a laminated member 16 composed of plural conductor layers and resin layers provided on the space between the plural conductor layers. Furthermore, the pore part 19 is irradiated with laser light 22 short in beam ON time and high in peak power to remove residual resin 20 in the pore part 19 which has not been removed in the pare part forming stage.

5. 发明专利

JPH09168877A METHOD AND DEVICE FOR MACHINING WIRING BOARD 失效
公开(公告)号：JPH09168877A
公开(公告)日：1997-06-30
申请号：JP33381595
申请日：1995-12-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKENO YOSHIMIZU , KANEKO MASAYUKI , MORIYASU MASAHARU , YUYAMA TAKAYUKI
IPC分类号： B23K26/364 , B23K26/00 , B23K26/082 , B23K26/142 , B23K26/36 , B23K101/42 , H05K3/00 , B23K26/08 , B23K26/14
摘要： PROBLEM TO BE SOLVED: To prevent sticking of carbide to a cat section or generation of cracking by repeating plural times a grooving process for forming shallow machining grooves and gradually increasing the depth up to full depth. SOLUTION: The light quantity of plume 16 emitted from a machined part is detected by a photodiode 44 during the cutting; and then, a ratio is calculated between this light quantity and that in the last grooving process stored in a storage part 40 for detected values as a rate of change by an arithmetic part 41. In a comparison part 43, the absolute value and the rate of change of the emitted light quantity are compared with a reference value of an absolute value and a change rate preliminarily set in a reference value setting part 42. If the absolute value is smaller than the reference value, or if the rate of change is larger than the reference value, a controller 24 gives a stop command to a laser beam oscillator control part 22 and a machining table control part 23, and stopping the machining.

6. 发明专利

JP2000176661A LASER BEAM MACHINING METHOD AND ITS DEVICE 失效
公开(公告)号：JP2000176661A
公开(公告)日：2000-06-27
申请号：JP36242298
申请日：1998-12-21
申请人： MITSUBISHI ELECTRIC CORP
发明人： YUYAMA TAKAYUKI
IPC分类号： B23K26/00 , B23K26/066 , G02B27/09 , H01S3/00 , H01S3/10 , B23K26/06
摘要： PROBLEM TO BE SOLVED: To obtain a laser beam machining method and its device capable of enhancing reproducibility of high quality machining. SOLUTION: As a laser beam machining method, in the case of forming an optical system provided with an aperture 3 in the optical path of a laser beam from a laser generator 4 to the lens, an intensity distribution is detected for the laser beam passing through the aperture 3 and, on the basis of the detected information, the laser beam diameter through the aperture 3 is adjusted for the machining.

7. 发明专利

JPH08267263A LASER BEAM MACHINING METHOD AND LASER BEAM MACHINE 失效
公开(公告)号：JPH08267263A
公开(公告)日：1996-10-15
申请号：JP7121995
申请日：1995-03-29
申请人： MITSUBISHI ELECTRIC CORP
发明人： YUYAMA TAKAYUKI , KANEOKA MASARU , MURAI TORU
IPC分类号： B23K26/00 , B23K26/02 , B23K26/38
摘要： PURPOSE: To improve cutting quality and to eliminate labor and time for secondary working by preventing the machining completion end part in thick plate cutting f from melt down in laser beam machining. CONSTITUTION: Heat reflection is prevented by cutting the neighborhood of completion end in the opposite direction against the cutting direction up to then. Also, by combining a temp. detecting means 2 to measure the surface temp. of a work 3 therewith, the optimum machining distance is operated and then the optimum machining condition is selected. By this method, the melt-down at completion end is reduced and high quality product is produced. Further, by measuring the surface temp. of work, high quality and stable machining is made possible.

8. 发明专利

JPH07236985A LASER BEAM CUTTING METHOD AND DEVICE THEREFOR 失效
公开(公告)号：JPH07236985A
公开(公告)日：1995-09-12
申请号：JP3009294
申请日：1994-02-28
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKENO YOSHIMIZU , MORIYASU MASAHARU , YUYAMA TAKAYUKI , ISAKA HISAO , KANEOKA MASARU
IPC分类号： B23K26/38 , B23K26/00
摘要： PURPOSE:To prevent the turbulence of streaks or melting down causing on a cutting surface of a work to be cut and improve the quality of work to be cut by applying a cutting energy larger than a cutting time on the work to be cut in a specific time from a crossing point of time of a laser beam and the work to be cut. CONSTITUTION:When an emitting light generated at the time of crossing of a laser beam and the work to be cut 2 is detected with a photoelectric sensor 6, the X axial movement is stopped, a working lens 3 is moved to a set cutting position, and then the focus position is changed to the upper side of the work to be cut. After then, a cutting head 5 is moved in the X axis, next a gas supplying path is changed to a supplying path of oxygen 4-1, and the oxygen is made to blow on the cutting part from a nozzle for a set time. Then, the laser beam output is increased, and further the laser beam moving velocity is increased. In such a way, the turbulence of streaks or melting down caused on the cutting surface of the work to be cut can is prevented.

9. 发明专利

JPH10335567A SEMICONDUCTOR INTEGRATED-CIRCUIT DEVICE 失效
公开(公告)号：JPH10335567A
公开(公告)日：1998-12-18
申请号：JP14212897
申请日：1997-05-30
申请人： MITSUBISHI ELECTRIC CORP
发明人： MURAKI KENJI , YUYAMA TAKAYUKI
IPC分类号： H01L23/12 , H01L21/56 , H01L23/31 , H01L23/485 , H01L23/498 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To facilitate manufacture and attain downsizing and thinning by providing a conductive layer having an external connection portion and a chip connection portion, and a wiring portion for connecting these connection portions, formed as a single layer, on insulating base material having a specific thermal expansion coefficient. SOLUTION: A plurality of conductive layers 3, each formed as a single layer, are provided on the surface of insulating base material 11 having a thermal expansion coefficient of 4 to 16×10 deg.C , corresponding to a plurality of conductive pads 8 of a semiconductor chip 1. The insulting base material 11 and the conductive layers 3, each comprising an external connection portion, a chip connection portion and a wiring portion, construct an insulating substrate. Then, the semiconductor integrated- circuit device is formed by using an insulating film of fiber-enhanced plastic material as the insulating base material, thus attaining thinning and downsizing. Further, as holes 15 with the external connection portion 4 of the conductive layer 3 as their bottom are provided in the insulating base member 11 to electrically connect the conductive pads 8 and external connection terminals 7 of the semiconductor chip 1, through hole processing or the like with respect to the insulating base material 11 can be omitted.

10. 发明专利

JPH08290285A LASER MACHINING METHOD 失效
公开(公告)号：JPH08290285A
公开(公告)日：1996-11-05
申请号：JP9368195
申请日：1995-04-19
申请人： MITSUBISHI ELECTRIC CORP
发明人： KANEOKA MASARU , MURAI TORU , YUYAMA TAKAYUKI
IPC分类号： B23K26/382 , B23K26/046 , B23K26/142 , B23K26/38 , B23K26/14 , B23K26/00 , B23K26/04
摘要： PURPOSE: To perform cutting satisfactorily, in the laser cutting of a plate, by removing molten metal stuck to the surface of a work W to be machined at the time of transferring from piercing to cutting. CONSTITUTION: In cutting a work W by means of a laser beam, in transferring from piercing to cutting, the height of a machining head 3 in the Z-axis direction is gradually raised with the laser output from the laser generator 1 kept constant, and an assist gas is ejected simultaneously, thereby removing molten metal, an obstacle to the cutting process, around the through-hole.

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