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1. 发明专利

JP2009059287A Method for manufacturing rfid tag 有权
标题翻译：制造RFID标签的方法
公开(公告)号：JP2009059287A
公开(公告)日：2009-03-19
申请号：JP2007227760
申请日：2007-09-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANEKO KIMIHIRO , OKEGAWA HIROKATSU , IKEDA YUICHI , YAMAZAKI KOJI , RYOKI HIROSHI , MURAKAMI OSAMU , MIYAMAE TAKANOBU
IPC分类号： G06K19/077 , G06K19/07
摘要： PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a novel RFID tag installed irrespective of a conductive object or a nonconductive object without shortening a communication distance, forming no protrusion caused by an IC chip on the surface of the RFID tag to eliminate a risk of damaging the IC chip by impact or the like and moreover attaining printing by a label printer. SOLUTION: The method for manufacturing the RFID tag comprises processes for forming a cavity between an upper die and a lower die and injecting a dielectric material resin in the cavity to form a dielectric substrate, and prior to the injection of the resin, arranging a conductor foil in a recess of the lower die and arranging a film base material formed with a conductor pattern, with the IC chip placed in a recess of the upper die in a state of facing the cavity side, to form a conductor pattern on one main surface of the dielectric substrate and a grounding conductor pattern on the other main surface of the dielectric substrate simultaneously with the formation of the dielectric substrate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决方案：提供一种容易地制造新的RFID标签的方法，不管导电物体或非导电物体如何，都可以安装，而不会缩短通信距离，不会形成RFID标签表面上的IC芯片引起的突起以消除通过冲击等损坏IC芯片的风险，而且通过标签打印机进行打印。解决方案：用于制造RFID标签的方法包括在上模和下模之间形成空腔的方法，并且在空腔中注入介电材料树脂以形成电介质基板，并且在注入树脂之前，将导体箔布置在下模的凹部中，并且布置形成有导体图案的膜基材，使IC芯片以面向空腔侧的状态放置在上模的凹部中，以形成导体图案电介质基板的一个主表面和电介质基板的另一个主表面上的接地导体图案同时形成电介质基板。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2008114269A Die-casting die 审中-公开
标题翻译： DIE铸件
公开(公告)号：JP2008114269A
公开(公告)日：2008-05-22
申请号：JP2006300583
申请日：2006-11-06
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMAZAKI KOJI , KANEKO KIMIHIRO , YOSHIMOTO MASAHIRO
IPC分类号： B22D17/00 , B22D17/22
摘要： PROBLEM TO BE SOLVED: To improve working efficiency when removing the residue of molten metal from a die-casting die and working efficiency in die polishing.
SOLUTION: In the die-casting die where heat radiation fin-shaped parts 101 having a heat radiation fin shape are formed, and which is provided with an upper die 1 and a lower die 2, it comprises: divided plates 3 piercing each erected wall for forming the heat radiation fin-shaped parts 101 in the lower die 2 by being removed from the lower die 2; heat radiation fin forming members 4 inserted into each erected wall of the lower die 2 so as to form the heat radiation fin forming part 101; fastening members 5 for fixing the heat radiation fin forming members 4 to the divided plates 3; and fastening members 6 for fixing the divided plates 3 to the lower die 2.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提高从压铸模具中除去熔融金属残留物的工作效率和模具抛光中的工作效率。解决方案：在形成具有散热翅片形状的散热翅片状部件101的压铸模具中，设置有上模1和下模2，其包括：分割板3穿孔每个竖立的壁用于通过从下模2移除而在下模2中形成散热片状部分101; 插入到下模2的每个竖立壁中的散热片形成构件4，以形成散热片形成部101; 用于将散热片形成构件4固定到分隔板3的紧固构件5; 以及用于将分割板3固定到下模2的紧固构件6.版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2014232762A ボンディングワイヤ、ボールボンディング方法および半導体装置审中-公开
标题翻译：连接线，球接法和半导体器件
公开(公告)号：JP2014232762A
公开(公告)日：2014-12-11
申请号：JP2013111859
申请日：2013-05-28
申请人：三菱電機株式会社 , Mitsubishi Electric Corp , ルネサスエレクトロニクス株式会社 , Renesas Electronics Corp
发明人： YAMAZAKI KOJI , HORIBE HIROSHI , TAKADA YASUNORI
IPC分类号： H01L21/60
CPC分类号： H01L2224/05624 , H01L2224/45 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/45655 , H01L2224/48091 , H01L2224/48465 , H01L2224/78301 , H01L2224/85045 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01079 , H01L2924/013 , H01L2924/01013 , H01L2924/01078 , H01L2924/01046 , H01L2924/01047 , H01L2924/00013 , H01L2924/01012 , H01L2924/0102 , H01L2924/01025 , H01L2924/01026 , H01L2924/01028 , H01L2924/01014 , H01L2924/01082 , H01L2924/01015 , H01L2924/00012 , H01L2924/01033
摘要：【課題】安価で、200℃高温保存試験において十分な信頼性を有するボンディングワイヤ、それを用いたボールボンディング方法および半導体装置を提供すること。【解決手段】本発明のボンディングワイヤは、芯材と、該芯材の表面を被覆した被覆材を有するボンディングワイヤであって、前記芯材は、銅を主成分としアルミニウムを300〜5000ppm含むものであり、前記被覆材は、ニッケルであり、被覆材断面積/芯材断面積で定義される被覆割合(X)が、0.0500
摘要翻译：要解决的问题：提供廉价且在200℃高温保存试验中具有足够可靠性的接合线; 并提供使用接合线的球接合方法和半导体器件。解决方案：本实施例的接合线包括芯材和覆盖芯材表面的涂层材料，其中芯材主要组成的铜，并且含有300-5000ppm的铝，涂层材料是镍，并且具有（涂层材料截面积）/（芯材横截面积）的涂布比（X）为0.0500

4. 发明专利

JP2008110501A Insert molding mold and method for producing mold product 有权
标题翻译：插件模具和生产模具产品的方法
公开(公告)号：JP2008110501A
公开(公告)日：2008-05-15
申请号：JP2006293587
申请日：2006-10-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： RYOKI HIROSHI , IKEDA YUICHI , KANEKO KIMIHIRO , YAMAZAKI KOJI , MURAKAMI OSAMU
IPC分类号： B29C33/18 , B29C39/10 , B29C45/14 , B29K105/20 , B29L9/00
摘要： PROBLEM TO BE SOLVED: To solve the following problem, wherein a conventional insert molding mold, so as to prevent the positional deviation of circuit patterns on a film which occurs during the injection of a resin, needs to perform molding after the film is held between the mold mating faces of a pair of molds and the molds are clamped, so that a mold product having the circuit patterns on both surfaces can not be obtained by one molding.
SOLUTION: A mold surface contacting the cavity of an insert molding mold is made a permeable porous substrate to control the mold surface to be a negative pressure. By sucking/fixing a plurality of films with patterns etc., formed along the mold surface, a cavity is formed between the films. An injection gate for injecting a fluid resin into the cavity is formed. Thus, the mold product having the circuit patterns on both surfaces is obtained by one molding.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题为了解决以下问题，为了防止在注射树脂期间发生的膜上的电路图案的位置偏移，常规的嵌入成型模具需要在膜之后进行成型被夹持在一对模具的模具配合面之间，并且模具被夹紧，使得通过一次模制不能获得具有两个表面上的电路图案的模制品。解决方案：将插入成型模具的空腔接触的模具表面制成可渗透的多孔基材，以将模具表面控制为负压。通过沿着模具表面形成的图案等吸附/固定多个膜，在膜之间形成空腔。形成用于将流体树脂注入空腔的注入口。因此，通过一次成型获得具有两面电路图案的模制品。版权所有（C）2008，JPO＆INPIT

5. 发明专利

JP2004249654A Mold for injection molding 审中-公开
公开(公告)号：JP2004249654A
公开(公告)日：2004-09-09
申请号：JP2003044101
申请日：2003-02-21
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KANEKO KIMIHIRO , YAMAZAKI KOJI
IPC分类号： B22D17/22 , B22C9/06 , B29C33/38 , B29C45/26
摘要： PROBLEM TO BE SOLVED: To obtain a mold for injection molding wherein a cooling piping is not required separately from the mold, and a hole for inserting the cooling piping is not required to be processed on the core side mold by a tool such as a drill, and a cooling passage with a free shape matched to a shape of a product can be formed at a position which is not restricted by a mold part to avoid the mold part such as an ejector pin in the core side mold, and the whole mold can be cooled at an approximately uniform temperature.
SOLUTION: In the mold for injection molding for forming a cavity 3 with the shape of the product between a cavity side mold 2 and the core side mold 1, the core side mold 1 is shaped by a rabbit prototyping using a metal material and the cooling passage 6 approaching the surface of the cavity side is formed in the core side mold 1.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2004207941A Waveguide 审中-公开
公开(公告)号：JP2004207941A
公开(公告)日：2004-07-22
申请号：JP2002373682
申请日：2002-12-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： MUKUDA MUNEAKI , INUZUKA TAKAYUKI , HENMI KAZUHISA , YAMAZAKI KOJI
IPC分类号： H01P1/04
摘要： PROBLEM TO BE SOLVED: To obtain waveguides which can be connected by easy work, and which will not produce gaps on the inner walls in their connections.
SOLUTION: The peripheries of junction ends of a first waveguide 1a and a second waveguide 1b to be joined to each other, are provided with a first protrusion 2a and a second protrusion 2b being annular. To the first and second protrusions 2a, 2b, a first ring member 3a and a second ring member 3b adhere closely. Into the first and second waveguides 1a, 1b, a male ring screw 4 and a female ring screw 5 are fitted respectively via the ring members. By screwing the male screw 4 into the female screw 5, the first protrusion 2a and the second protrusion 2b are pushed in the directions of joint surfaces 7 of the first and second waveguides via the ring members, and the joint surfaces 7 are pressure-welded. In this way, the first and second waveguides 1a, 1b are connected.
COPYRIGHT: (C)2004,JPO&NCIPI

7. 发明专利

JP2014237170A 超音波はんだ接合用鉛フリーはんだ合金及びそれを用いた超音波はんだ接合方法审中-公开
标题翻译：无铅焊接合金超级焊接和超级焊接焊接方法
公开(公告)号：JP2014237170A
公开(公告)日：2014-12-18
申请号：JP2013121908
申请日：2013-06-10
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： YAMAZAKI KOJI , ARAKI TAKESHI
IPC分类号： B23K35/26 , B23K1/08 , B23K1/19 , C22C13/02
摘要：【課題】超音波はんだ接合法による接合時間を短縮化することができ且つ優れた耐熱性を有する超音波はんだ接合用鉛フリーはんだ合金を提供すること。【解決手段】Sbを5質量%以上18質量%以下、Cuを0.5質量%以上2質量%以下、セラミック粒子を0.001質量%以上0.05質量%以下含み、残部がSn及び不可避不純物からなることを特徴とする超音波はんだ接合用鉛フリーはんだ合金である。はんだ合金に含まれるセラミック粒子は、SiC、AlN、Al2O3及びZrO2からなる群から選択されるものであることが好ましい。【選択図】図1
摘要翻译：要解决的问题：为了提供一种用于超音速焊接的无铅焊料合金，可以通过超音速焊接方法缩短焊接时间，并且还具有优异的耐热性。解决方案：用于超音速焊接的无铅焊料合金含有5质量％以上且18质量％以下的Sb，0.5质量％以上2质量％以下的Cu，0.001质量％以上且0.05质量％以下的陶瓷颗粒，余量为Sn 和不可避免的杂质。包含在焊料合金中的陶瓷颗粒优选选自由SiC，AlN，AlO和ZrO组成的组。

8. 发明专利

JP2014163527A Humidification device and humidifier using the same 审中-公开
标题翻译：加湿装置和使用该装置的加湿器
公开(公告)号：JP2014163527A
公开(公告)日：2014-09-08
申请号：JP2013031968
申请日：2013-02-21
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMAZAKI KOJI , ARAKI TAKESHI
IPC分类号： F24F6/06 , F24F6/16
摘要： PROBLEM TO BE SOLVED: To maintain humidification performance over a long period even when city water is used.SOLUTION: Each tabular porous body 3 has a center part 21 located on a center in a width direction (depth direction: y-axis direction) and a pair of peripheral parts 22 adjacent to both the sides of the center part 21. The center part 21 is located on a position closer to a rotation center C than the peripheral parts 22. Thereby, centrifugal force at rotation is smaller on the center part 21 than the peripheral parts 22. Porosity of the center part 21 is higher than the porosity of the peripheral parts 22. The tabular porous body 3 arranged on a position deviated from the rotation center C is curved so that the center in the width direction is projected to the rotation center C side on a cross section orthogonal to the rotation center C.
摘要翻译：要解决的问题：即使使用城市用水，也可以长时间保持加湿性能。解决方案：每个平板状多孔体3具有位于宽度方向（深度方向：y轴方向）中心的中心部21，与中心部21的两侧相邻的一对周边部22。中心部21位于比周缘部22更靠近旋转中心C的位置。由此，中心部的旋转离心力较小中心部分21的孔隙率高于周边部分22的孔隙率。布置在偏离旋转中心C的位置的平板状多孔体3是弯曲的，使得宽度方向上的中心是在与旋转中心C正交的横截面上投影到旋转中心C侧

9. 发明专利

JP2014103252A Bonding wire, semiconductor device and semiconductor device manufacturing method 审中-公开
标题翻译：连接线，半导体器件和半导体器件制造方法
公开(公告)号：JP2014103252A
公开(公告)日：2014-06-05
申请号：JP2012254314
申请日：2012-11-20
申请人： Mitsubishi Electric Corp , 三菱電機株式会社 , Renesas Electronics Corp , ルネサスエレクトロニクス株式会社
发明人： YAMAZAKI KOJI , ARAKI TAKESHI , HORIBE HIROSHI , TAKADA YASUNORI
IPC分类号： H01L21/60
CPC分类号： H01L24/05 , H01L2224/04042 , H01L2224/05624 , H01L2224/4321 , H01L2224/45 , H01L2224/45015 , H01L2224/45147 , H01L2224/45565 , H01L2224/48 , H01L2224/48091 , H01L2224/4845 , H01L2224/48463 , H01L2224/48465 , H01L2224/78 , H01L2224/78268 , H01L2224/78301 , H01L2224/85 , H01L2224/85045 , H01L2224/85065 , H01L2224/85075 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2924/20106 , H01L2924/00014 , H01L2224/45655 , H01L2224/45644 , H01L2224/45669 , H01L2224/45664 , H01L2924/20752 , H01L2924/20753 , H01L2924/01007 , H01L2924/01001 , H01L2924/00 , H01L2924/00012 , H01L2924/01205
摘要： PROBLEM TO BE SOLVED: To provide a bonding wire which can ensure reliability even at a high temperature and which is inexpensive; and provide a semiconductor device equipped with the bonding wire and a manufacturing method of the semiconductor device.SOLUTION: A bonding wire 10 includes a copper-containing core material 11 and a nickel-containing coating layer 12 formed so as to cover a surface of the core material 11. A ratio of a cross sectional area of the coating layer 12 to a cross sectional area of the core material 11 in a radial direction of the core material 11 is not less than 0.052 and not more than 0.063.
摘要翻译：要解决的问题：提供即使在高温下即使在廉价的情况下也可确保可靠性的接合线; 并提供配备有接合线的半导体器件和半导体器件的制造方法。解决方案：接合线10包括含铜芯材11和形成为覆盖所述半导体器件的表面的含镍涂层12 芯材11的芯材11的横截面积与芯材11的径向的截面积的比率不小于0.052且不大于0.063。

10. 发明专利

JP2004363764A Waveguide device 有权
公开(公告)号：JP2004363764A
公开(公告)日：2004-12-24
申请号：JP2003157833
申请日：2003-06-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ASAO HIDEKI , JINNO HIROTAKA , YONEDA HISAFUMI , MUKUDA MUNEAKI , YAMAZAKI KOJI
IPC分类号： H01P1/02 , H01P1/165
CPC分类号： H01P1/025
摘要： PROBLEM TO BE SOLVED: To provide a small and light waveguide device whose frequency band is wide and which is integrated with the other waveguide component and enables metal mold forming.
SOLUTION: In the waveguide device, a waveguide polarized wave converter having a slit is connected between a vertical polarization waveguide and a horizontal polarization waveguide. A slit cross section shape of the waveguide polarized wave converter is made in a shape having an outer periphery where two square parts having centers on an X-axis on a plane in which the orthogonal X-axis and Y-axis exist with the Y-axis as a symmetric axis and a coupling part connecting squares are overlapped. The vertical polarization waveguide, the horizontal polarization waveguide and the waveguide polarized wave converter are formed into a two-division integrated structure.
COPYRIGHT: (C)2005,JPO&NCIPI

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