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1. 发明专利

JP2006303262A Cooling device of semiconductor module 有权
标题翻译：半导体模块冷却装置
公开(公告)号：JP2006303262A
公开(公告)日：2006-11-02
申请号：JP2005124466
申请日：2005-04-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI
IPC分类号： H01L23/473
摘要： PROBLEM TO BE SOLVED: To solve the problem wherein a device is upsized since space for forming a path is needed around an electrical heating element for providing a discharge path of a leaked liquid at a position that is lower than the electrical heating element.
SOLUTION: A cooling device of semiconductor modules comprises a storage 22 of a coolant that has an edge 21 in a shape nearly corresponding to the outer periphery of the heat radiation surface of a semiconductor module, while being provided at a portion that opposes a heat radiation surface 14a of the semiconductor module 10; a first sealing member 23 interposed along the edge between the outer periphery of the heat radiation surface of the semiconductor module and the edge; an outer-periphery encircling section 24 that is extended toward the upper portion of the outside from the edge integrally and is formed so that it encircles the outer periphery of the semiconductor module via a gap 40, and receives the coolant leaked from the first sealing member at the gap; and the discharge path 25 for allowing the gap to communicate with the outside.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题为了解决由于在用于在低于电加热元件的位置提供泄漏液体的排出路径的电加热元件需要用于形成路径的空间的装置而增大的问题。解决方案：半导体模块的冷却装置包括冷却剂的存储器22，其具有与半导体模块的散热表面的外周几乎对应的形状的边缘21，同时设置在与半导体模块相对的部分半导体模块10的散热表面14a; 沿着半导体模块的散热表面的外周边缘与边缘之间插入的第一密封构件23; 一个外缘环绕部分24，其一体地从该边缘向外部的上部延伸并且形成为使其经由间隙40环绕半导体模块的外周，并且接收从第一密封构件泄漏的冷却剂在间隙; 以及用于允许间隙与外部连通的排出路径25。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006156711A Cooling system for power semiconductor module 审中-公开
标题翻译：功率半导体模块冷却系统
公开(公告)号：JP2006156711A
公开(公告)日：2006-06-15
申请号：JP2004345266
申请日：2004-11-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI , NISHIYAMA RYOJI , KURAMOTO YUJI , ISHIBASHI SEIJI
IPC分类号： H01L23/473
CPC分类号： G05D23/192 , H01L23/34 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling system for a power semiconductor module by estimating a change in a transfer rate of heat from the power semiconductor module to a cooling fluid, and controlling the cooling capability of the cooling fluid depending on a result of the estimation to properly continue the operation of a load. SOLUTION: The power semiconductor module 70 is provided with a controller 190 that estimates a change in the transfer rate of heat from the power semiconductor module 70 to the cooling water, on the basis of output information Tj of a temperature sensor provided to a semiconductor element provided to the power semiconductor module 70 and acting like a heat source, and drive output information Sr of a sensor (RS) 112 for sensing the number of revolutions of a pump motor (M) 111 provided to a cooling pump (P) 110; and controls the cooling capability by the cooling water through the control of the number of revolutions of the pump motor (M) 111 on the basis of the result of estimation. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过估计从功率半导体模块到冷却流体的热传递速率的变化来提供用于功率半导体模块的冷却系统，并且根据所述冷却流体的冷却能力来控制估计的结果是正确地继续负载运行。解决方案：功率半导体模块70设置有控制器190，该控制器190基于提供给功率半导体模块70的温度传感器的输出信息Tj来估计从功率半导体模块70到冷却水的热传递速率的变化提供给功率半导体模块70并且像热源一样的半导体元件，驱动传感器（RS）112的输出信息Sr，用于感测提供给冷却泵（P）的泵马达（M）111的转数）110; 并且通过基于估计结果控制泵电动机（M）111的转数来控制冷却水的冷却能力。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2007209184A Power converter 审中-公开
标题翻译：电源转换器
公开(公告)号：JP2007209184A
公开(公告)日：2007-08-16
申请号：JP2006028666
申请日：2006-02-06
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI , KURAMOTO YUJI , MAEKAWA HIROTOSHI , NISHIYAMA RYOJI
IPC分类号： H02M7/48 , H02M7/04 , H05K7/06
CPC分类号： H05K7/1432
摘要： PROBLEM TO BE SOLVED: To solve the problem, in durability and reliability of a conventional power converter that flexibility in mounting with respect to mounting on vehicle is low, attention regarding the constitution is not paid to a control board for enhancing the vibration resistance, and heat dissipation of electronic components mounted on the controlled board is not sufficient. SOLUTION: A base 110 is equipped with a first fixing part 110a and a second fixing part 110b, connected each other at a desired angle. Power modules IPM1, IPM2, and IPM3 are fixed to the first fixing part 110a of the base 110. The control board 10 is so fixed that its first main surface 10a, directly or indirectly contacts the second fixing part 110b of the base 110. Components, constituting a control circuit, are mounted on the second main surface 10b. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题为了解决这个问题，在传统的电力转换器的耐久性和可靠性方面，安装方面的灵活性相对于在车辆上的安装是低的，关于构造的关注不是用于增强振动的控制板安装在受控板上的电子元件的电阻和散热是不够的。解决方案：基座110配备有以期望的角度彼此连接的第一固定部分110a和第二固定部分110b。电源模块IPM1，IPM2和IPM3固定在基座110的第一固定部分110a上。控制板10被固定成使其第一主表面10a直接或间接接触基座110的第二固定部分110b。，构成控制电路，安装在第二主表面10b上。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006166604A Power conversion apparatus 有权
标题翻译：功率转换装置
公开(公告)号：JP2006166604A
公开(公告)日：2006-06-22
申请号：JP2004354824
申请日：2004-12-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KIMURA SUSUMU , YAMABUCHI HIROSHI
IPC分类号： H01L23/473 , H01L25/07 , H01L25/18 , H02M7/48 , H05K7/20
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To reduce the thermal resistance Rth(j-w) between a power semiconductor module and cooling liquid in a water cooled power conversion apparatus. SOLUTION: The power conversion apparatus 50 includes: the power semiconductor module 30 whose electrically insulating lower face is exposed as a radiating surface; and a water channel cover 10 having a coolant inlet 11, a coolant outlet 12, and an opening portion 13. The opening portion 13 covers the lower face of the power semiconductor module 30. Thus, the water channel cover 10 and the lower face of the power semiconductor module 30 are sealed together, and coolant flowing from the inlet 11 to the outlet 12 is brought into contact with the radiating surface. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：降低水冷式电力转换装置中的功率半导体模块与冷却液之间的热阻Rth（j-w）。电力转换装置50包括：电绝缘下表面作为辐射面露出的功率半导体模块30; 以及具有冷却剂入口11，冷却剂出口12和开口部13的水通道盖10.开口部13覆盖功率半导体模块30的下表面。因此，水通道盖10和下部面功率半导体模块30被密封在一起，并且从入口11流到出口12的冷却剂与散热表面接触。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2006340569A Power unit 有权
标题翻译：动力单元
公开(公告)号：JP2006340569A
公开(公告)日：2006-12-14
申请号：JP2005165397
申请日：2005-06-06
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI , KURAMOTO YUJI , KIMURA SUSUMU
CPC分类号： H02M7/003 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H02M7/5387 , H02M2001/007 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To improve economic efficiency by high heat dissipation performance, in a power unit which is mounted to a hybrid vehicle or the like, and includes power modules and a heat sink, wherein the modules incorporate power semiconductor devices which constitute an electric power converter driving and controlling two sets of rotary machines. SOLUTION: The power semiconductor devices 20 (1 to 4) which are heat generating elements are arranged on a metal block 22 through a conductive element adherence layer 21. Leads 24, 26 to be connected to an upper face electrode and a bottom face electrode of the power semiconductor devices 20, respectively, are protruded, then the power modules 6 are constituted by being resin-sealed using the sealing resin 27 covering the metal block 22 and the power semiconductor devices 20, and the power modules 6 are provided for each drive control of each phase of two sets of the rotary machines 11, 12, respectively. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了通过高散热性能提高经济效率，在安装到混合动力车辆等的动力单元中，并且包括功率模块和散热器，其中模块包括功率半导体器件，功率半导体器件构成电力转换器驱动和控制两套旋转机。解决方案：作为发热元件的功率半导体器件20（1至4）通过导电元件粘附层21布置在金属块22上。引线24,26连接到上表面电极和底部功率半导体器件20的面电极分别突出，然后通过使用覆盖金属块22和功率半导体器件20的密封树脂27进行树脂密封而构成功率模块6，并且设置功率模块6 分别用于两组旋转机11,12的各相的每个驱动控制。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2005302898A Heat sink 有权
标题翻译：散热器
公开(公告)号：JP2005302898A
公开(公告)日：2005-10-27
申请号：JP2004114587
申请日：2004-04-08
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IPPOSHI SHIGETOSHI , OGUSHI TETSURO , HASHIMO SEIJI , KIMURA SUSUMU , YAMADA AKIRA , YAMABUCHI HIROSHI , MURAHATA AKIHIRO , OKAYAMA HIDEO , UEHARA NOBUAKI
IPC分类号： H01L23/473 , H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve the problem that it is difficult to attain the performance enough for sufficiently radiating heat of electronic apparatus which is manufactured in large number in recent years in the heat sink formed to improve heat transfer effect by utilizing disturbed flowing effect which is realized by providing pin-type fins in the two-dimensional flow. SOLUTION: The heat sink provided with a cooling fluid charging port, a heat transfer vessel in which a flowing path is formed, and a cooling fluid discharging port. In this heatsink, the flowing path is constituted by sequentially coupling an almost trapezoidal flowing path, in which the flowing path becomes small in the height direction of the heat transfer vessel from the side where a heat generating body is mounted, to a flowing path in which the flowing path is almost constant. Therefore, the heat transfer characteristic can be improved with the more simplified structure by generating the three-dimensional flow. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题为了解决近年来在散热片中大量制造的电子设备的充分散热的难度，难以达到的目的在于通过利用受干扰的散热来提高传热效果，通过在二维流中提供针式翅片来实现流动效应。解决方案：设置有冷却流体加料口的散热器，形成流动路径的传热容器和冷却流体排出口。在这种散热器中，流动路径通过将传热容器的高度方向上的流动路径从安装有发热体的一侧的流路变小到几乎梯形的流路而构成，流动路径几乎是恒定的。因此，通过产生三维流动，可以通过更简化的结构来提高传热特性。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2005132257A Hybrid electric automobile 审中-公开
标题翻译：混合动力汽车
公开(公告)号：JP2005132257A
公开(公告)日：2005-05-26
申请号：JP2003371809
申请日：2003-10-31
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI
IPC分类号： B60K1/04 , B60K6/26 , B60K6/28 , B60K6/40 , B60K6/485 , B60K6/54 , B60K13/04 , B60L11/14 , B60K6/04
CPC分类号： Y02T10/7077 , Y02T10/7216 , Y02T10/7241
摘要： PROBLEM TO BE SOLVED: To provide a hybrid electric automobile capable of keeping the good performance of its inverter, low-voltage line battery, DC/DC converter, and high-voltage line battery as constituent elements of the power supply system, improving the working easiness in assembling and maintenance/repair works, and shortening the lay-around length of the power wiring as much as practicable. SOLUTION: The hybrid electric automobile includes the inverter 11, the low-voltage line battery 12, the DC/DC converter 13, and the high-voltage line battery 14 as the constituent elements of the power supply system, and those except the high-voltage line battery 14 are arranged concentrically in the region in an engine room 3 having the least influence of the radiation heat, for example in the case of a vehicle of FF system, in the region on the side with a transmission 6 apart from the engine 4 and exhaust manifold 7. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供能够保持其逆变器，低压线路电池，DC / DC转换器和高压线路电池作为电源系统的组成元件的良好性能的混合电动汽车，提高装配维修工作的工作容易度，尽可能缩短电源线的铺设长度。解决方案：混合电动汽车包括逆变器11，低压线电池12，DC / DC转换器13和高压线电池14作为供电系统的组成元件，以及除了高压线路电池14同心地配置在发动机室3的区域内，该发动机室3的辐射热影响最小，例如在FF系统的车辆的情况下，在具有变速器6的一侧的区域中来自发动机4和排气歧管7.版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2003338592A Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：JP2003338592A
公开(公告)日：2003-11-28
申请号：JP2002145910
申请日：2002-05-21
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI
IPC分类号： H01L23/34 , H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2224/73265 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To secure the reliability of a power semiconductor module over a long period of time by removing heat stress between respective members constituting a heat conduction route in the power semiconductor module. SOLUTION: A power semiconductor module having IGBT elements 9 in its inside is provided with both of power conductivity and heat conductivity by bringing faces of electrodes 2, 4 and 5 composed of metal materials having high power conductivities and high heat conductivities directly into contact with power inputs and power outputs of the IGBT elements 9 without fusing members to be power and heat conduction routes in the power semiconductor module by a conductive fusing/joining member such as solder. The members to be the power and heat conduction routes in the power semiconductor module are formed as laminated structure, and an elastic member 13 for pressurizing the laminated members in a mutually press-contact state in the laminated direction is arranged in the power semiconductor module. COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题：为了通过消除构成功率半导体模块中的导热路径的各个部件之间的热应力来长时间地确保功率半导体模块的可靠性。解决方案：通过将具有高功率电导率和高导热性的金属材料构成的电极2,4和5的面直接插入到其内部具有IGBT元件9的功率半导体模块，其功率传导性和导热性均为与IGBT元件9的电源输入和电源输出接触，而不需要通过诸如焊料的导电熔接/接合部件将功能半导体模块中的功率和热传导路径的定影构件。作为功率半导体模块中的电力和热传导路径的构件形成为层叠结构，并且在功率半导体模块中布置有用于在叠层方向上以相互压接状态对叠层构件进行加压的弹性构件13。版权所有（C）2004，JPO

9. 发明专利

JP2006304522A Power unit device and power converter 有权
标题翻译：电源单元和电源转换器
公开(公告)号：JP2006304522A
公开(公告)日：2006-11-02
申请号：JP2005124457
申请日：2005-04-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI , KURAMOTO YUJI , KIMURA SUSUMU
IPC分类号： H05K7/20
CPC分类号： H05K7/20927 , B60K2001/003
摘要： PROBLEM TO BE SOLVED: To provide a power unit device that can be miniaturized so that no particular preparations for a facility and labor is required in assembling work and that is easy to assemble and excellent in versatility in terms of its manufacture. SOLUTION: This power unit device is provided with heat sinks 6 comprising a first heat-receiving portion 61 and a second heat-receiving portion 62, a power module 5 that contains power semiconductor elements 50 attached to the first heat-receiving portion to perform DC-AC conversion or AC-DC conversion for one phase, smoothing capacitors 7 that control the ripple current of the power modules attached to the second heat-receiving portion, and a fixing means 16 provided in such a way as to pass through these power modules, the heat sinks, and the smoothing capacitors. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以小型化的动力装置装置，使得在组装工作中不需要特定的设备和劳动准备，并且易于组装，并且在其制造方面的多功能性优异。解决方案：该动力单元装置设置有散热器6，散热器6包括第一受热部分61和第二受热部分62，功率模块5包含附着到第一热接收部分62的功率半导体元件50 对一相进行DC-AC转换或AC-DC转换，控制附着于第二受热部的电力模块的纹波电流的平滑电容器7以及以通过方式设置的固定装置16 这些电源模块，散热器和平滑电容器。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006303264A Cooling device of semiconductor module 有权
标题翻译：半导体模块冷却装置
公开(公告)号：JP2006303264A
公开(公告)日：2006-11-02
申请号：JP2005124473
申请日：2005-04-22
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMABUCHI HIROSHI
IPC分类号： H01L23/473 , H01L25/04 , H01L25/18
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a cooling device of a semiconductor module coping with an increase in heat generation density following the high integration, high density, and large power of a semiconductor chip. SOLUTION: The cooling device of semiconductor modules comprises a vessel 4 having a plurality of heat-taking sections 4a at an inner wall while coolant is circulated; and a plurality of nozzles 5 that are provided opposite to the plurality of heat-taking sections and inject each coolant to each heat-taking section, for thermally coupling the heat-taking section to a heat radiation surface 1a of the semiconductor module 1. In the cooling device of semiconductor modules, a partition wall 9 for preventing the interference of coolant jetted out of the nozzle is provided among the plurality of nozzles. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种半导体模块的冷却装置，其应用于半导体芯片的高集成度，高密度和大功率之后的发热密度的增加。解决方案：半导体模块的冷却装置包括在冷却剂循环时在内壁具有多个加热部分4a的容器4; 以及多个喷嘴5，其与多个热采取部分相对地设置并将每个冷却剂喷射到每个加热部分，用于将取热部分热耦合到半导体模块1的散热表面1a。半导体模块的冷却装置设置有用于防止喷射出喷嘴的冷却剂的干扰的分隔壁9。版权所有（C）2007，JPO＆INPIT

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