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1. 发明专利

JP2012199596A Semiconductor module 审中-公开
标题翻译：半导体模块
公开(公告)号：JP2012199596A
公开(公告)日：2012-10-18
申请号：JP2012165135
申请日：2012-07-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： GOTO YOICHI , GOTO MASAKI , KITAI KIYOFUMI , YOKOYAMA DAISAKU
IPC分类号： H01L23/467 , H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To efficiently transmit heat generated from a semiconductor chip to heat radiation fins and improve the heat exhaust properties of the heat radiation fins.SOLUTION: A ventilation passage 2 and openings 3a to 3e communicating with the ventilation passage 2 are formed at a ventilation box body 1. Semiconductor packages 4a to 4e are attached to the ventilation box body 1 through the openings 3a to 3e, respectively, to form a semiconductor module. Heat radiation fins 16 provided at the semiconductor packages 4a to 4e are arranged along the ventilation passage 2.
摘要翻译：要解决的问题：为了有效地将从半导体芯片产生的热量传递到散热片并提高散热片的散热性能。解决方案：通风通道2和与通风通道2连通的开口3a至3e形成在通风箱体1上。半导体封装4a至4e分别通过开口3a至3e附接到通风箱主体1 ，以形成半导体模块。设置在半导体封装4a至4e处的散热片16沿着通风通道2布置。版权所有（C）2013，JPO＆INPIT

2. 发明专利

JP2011035267A Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：JP2011035267A
公开(公告)日：2011-02-17
申请号：JP2009181769
申请日：2009-08-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： GOTO YOICHI , GOTO MASAKI , KITAI KIYOFUMI , YOKOYAMA DAISAKU
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To efficiently conduct the heat generated from a semiconductor chip to a heat radiation fin, and improve the property of exhausting heat of the heat radiation fin. SOLUTION: In a ventilation box 1, a ventilation path 2 is formed, and opening parts 3a to 3e communicating with the ventilation path 2 are formed. Semiconductor packages 4a to 4e are each mounted on the ventilation box 1 through the opening parts 3a to 3e, and thereby form a semiconductor module. Heat radiation fins 16 provided in the semiconductor packages 4a to 4e are arranged along the ventilation path 2. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了有效地将从半导体芯片产生的热量传导到散热片，并且提高散热片的排热性能。解决方案：在通气箱1中，形成通气路径2，形成与通气路径2连通的开口部3a〜3e。半导体封装4a〜4e分别通过开口部3a〜3e安装在通气箱1上，形成半导体模块。设置在半导体封装4a至4e中的散热片16沿着通风路径2布置。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2010278669A Da conversion circuit 有权
标题翻译： DA转换电路
公开(公告)号：JP2010278669A
公开(公告)日：2010-12-09
申请号：JP2009128142
申请日：2009-05-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KAJIURA GOICHI , GOTO YOICHI
IPC分类号： H03M1/82
摘要： PROBLEM TO BE SOLVED: To improve conversion resolution without increasing a conversion cycle of a DA conversion circuit, and also suppress complication of a circuit configuration. SOLUTION: A PWM circuit 11 generates a pulse width modulation pulse P(A) to which pulse width modulation is performed on the basis of an X for a higher order N (N is a positive integer) bit of a digital input value Din. A superposition part 20 disperses a unit pulse U for 1 clock corresponding to a Z for a lower order m (m is a positive integer) bit of the digital input value Din for a final 1 clock of a conversion cycle T corresponding to the upper order N bit of the digital input value Din. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提高转换分辨率而不增加DA转换电路的转换周期，并且还抑制电路配置的复杂性。解决方案：PWM电路11产生脉冲宽度调制脉冲P（A），脉冲宽度调制脉冲P（A）基于数字输入值的高阶N（N是正整数）位的X，声浪。叠加部分20将对应于数字输入值Din的低阶m（m为正整数）的Z的1个时钟的单位脉冲U分散在与上位相对应的转换周期T的最后1个时钟 N位数字输入值Din。版权所有（C）2011，JPO＆INPIT

4. 发明专利

JP2010141034A Semiconductor device and manufacturing method of the same 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010141034A
公开(公告)日：2010-06-24
申请号：JP2008314639
申请日：2008-12-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YOSHIHARA HIROYUKI , KIKUCHI MASAO , GOTO YOICHI
IPC分类号： H01L23/29 , H01L23/36
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device designed to be miniaturized and low-cost by improving the attachment structure of a heat dissipating fin. SOLUTION: The semiconductor device includes a power element 1, a metal base 4 on which the power element 1 is mounted, and a plurality of heat dissipating fins 7 for dissipating the heat generated in the power element 1 mounted on the metal base 4, wherein the power element 1 is mounted on the one face side of the metal base 4 via an insulating resin layer 3 on which patterns 2a, 2b are formed, an attachment part 7a of the bending part side of the heat dissipating fin 7, the cross section of which forms a U-shape, is closely attached to the other face side; and the metal base 4, including the power element 1 and the insulating resin layer 3 and the proximity of the attachment part 7a of the heat dissipating fin 7, are formed as one unit by sealing with a molding resin 8. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过改进散热片的附接结构来设计成小型化和低成本的半导体器件。解决方案：半导体器件包括功率元件1，安装功率元件1的金属基座4和用于耗散安装在金属基座上的功率元件1中产生的热的多个散热片7 如图4所示，其中功率元件1经由其上形成图案2a，2b的绝缘树脂层3，散热片7的弯曲部分侧的安装部分7a安装在金属基座4的一个面上，其横截面形成U形，紧贴在另一面侧; 并且通过用模制树脂8密封将包括功率元件1和绝缘树脂层3的金属基底4以及散热片7的安装部分7a的附近形成为一个单元。版权所有：（C）2010，JPO＆INPIT

5. 发明专利

JP2009295808A Resin-molded semiconductor module 有权
标题翻译：树脂模制半导体模块
公开(公告)号：JP2009295808A
公开(公告)日：2009-12-17
申请号：JP2008148234
申请日：2008-06-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KIMURA SUSUMU , GOTO YOICHI
IPC分类号： H01L23/34 , H01L23/28 , H01L23/36
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To obtain a resin-molded semiconductor module which is capable of contributing to the improvement of yield by suppressing poor adhesion between a heat sink and a mold when molding a resin-based material while enhancing a heat dissipating capability of the heat sink. SOLUTION: A resin-molded semiconductor module 2 includes: a lead frame 8; a semiconductor element 6 mounted on a front surface 8c of the lead frame; a heat sink 4 which has an adhesion surface 5a to be bonded to a rear face 8d of the lead frame, on one surface side and has an irregular part 10 for heat dissipation and a flat surface 5c formed around the irregular part, on the other surface side; and a resin molding part 9 which covers the heat sink except the irregular part and the flat surface to integrally mold the lead frame and the semiconductor element. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了获得树脂模制的半导体模块，其能够通过在模制树脂基材料时同时提高散热能力来抑制散热器和模具之间的差的粘附性而有助于提高产量的散热器。解决方案：树脂模制半导体模块2包括：引线框8; 安装在引线框架的前表面8c上的半导体元件6; 一个散热器4，其具有粘合表面5a以在一个表面侧上粘合到引线框架的后表面8d，并且具有用于散热的不规则部分10和形成在不规则部分周围的平坦表面5c 表面以及除了不规则部分和平坦表面之外覆盖散热器以使引线框和半导体元件整体模制的树脂模制部9。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2010199494A Semiconductor device and manufacturing method of the same 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2010199494A
公开(公告)日：2010-09-09
申请号：JP2009045605
申请日：2009-02-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KIMURA SUSUMU , GOTO YOICHI
IPC分类号： H01L23/29 , H01L21/60
CPC分类号： H01L2224/48091 , H01L2224/48247 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which can improve its yield, while enhancing the radiation performance of its heat sink, and reducing a failure of adhesion between a heat sink and mold when molding a resin material. SOLUTION: The semiconductor device includes a semiconductor element 6 which is mounted on a surface of a lead frame 8, a heat sink 4 which has an adhesion portion 5a to be adhered on the back 8d of the lead frame 8 on one side and has a rugged portion 10 for heat radiation on another side, and a resin mold 9 which molds the lead frame 8 and the semiconductor element 6 integrally. The mold resin 9 is prevented from leaking out to the rugged portion 10 by forming a protrusion 5c around the rugged portion 10 so as to make the tip of the protrusion 5c closely contact with the mold. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种可以提高其产量的半导体器件，同时提高其散热器的辐射性能，并且当模制树脂材料时减少散热器和模具之间的粘合失败。解决方案：半导体器件包括安装在引线框架8的表面上的半导体元件6，散热器4，该散热器4具有粘附部分5a，以粘附在引线框8的一侧的背面8d上并且具有用于另一侧的热辐射的粗糙部分10和一体地模制引线框架8和半导体元件6的树脂模9。通过在凹凸部10周围形成突起5c，防止模具树脂9泄漏到粗糙部10，使突起5c的前端与模具紧密接触。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2009284741A Inverter apparatus, inverter system, and connector for inverter apparatus 有权
标题翻译：逆变器装置，逆变器系统和逆变器装置的连接器
公开(公告)号：JP2009284741A
公开(公告)日：2009-12-03
申请号：JP2008137243
申请日：2008-05-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KAJIURA GOICHI , GOTO YOICHI
IPC分类号： H02M7/48 , H02M7/493
摘要： PROBLEM TO BE SOLVED: To supply power to a microcomputer and peripheral equipment even if a self control power source is in off state because a commercial power source is not available in an inverter apparatus. SOLUTION: The inverter apparatus is provided with: a main circuit 12 which operates only when electric power is supplied from an AC power source 50; an internal circuit power source 14 which is generated by using the AC power source 50; a supply control circuit 18 which operates so as to supply control power supply voltage generated by the internal circuit power source 14 to the outside when the electric power is supplied from the AC power source 50 and operates so as to feed the control power supply voltage generated outside to the inside when the electric power is not supplied from the AC power source 50; and a control circuit 16 which includes a communication circuit 16c to send and receive various kinds of information through a communication line with the outside, and operates by receiving supply of the internal circuit power source 14 or the control power supply voltage generated outside. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使自动控制电源处于关闭状态，即使在逆变器装置中没有商业电源，也可以向微型计算机和外围设备供电。解决方案：逆变器装置设置有：主电路12，其仅在从AC电源50供电时操作; 通过使用AC电源50产生的内部电路电源14; 电源控制电路18，其在从交流电源50供给电力的同时，将由内部电路电源14产生的控制电源电压供给到外部，进行动作，供给控制电源电压当不从AC电源50供电时，在外部到内部; 以及控制电路16，其包括通过与外部的通信线路发送和接收各种信息的通信电路16c，并且通过接收内部电路电源14的供应或外部产生的控制电源电压进行操作。版权所有（C）2010，JPO＆INPIT

8. 发明专利

JP2009218396A Heat radiator 有权
标题翻译：散热器
公开(公告)号：JP2009218396A
公开(公告)日：2009-09-24
申请号：JP2008060871
申请日：2008-03-11
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： OKA SEIJI , AKIYOSHI MASAO , OI TAKESHI , GOTO YOICHI , GOTO MASAKI
IPC分类号： H01L23/40 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To provide a heat radiator in which heat contact between a base plate 1 and a fin body 2 is stably secured even in long-term use. SOLUTION: In the heat radiator, the fin body 2 is molded so as to include U-shaped portions in a cross-sectional view. Further, the base plate 1 is arranged in contact with the outer circumferential surfaces of the U-shaped portions and elastic bodies 3 are arranged in contact with the inner circumferential surfaces of the U-shaped portions. Further, a retaining plate 4 presses the elastic bodies 3 to the base plate 1 to bring the U-shaped portions into press-contact with the base plate 1. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：即使长期使用也能够稳定地确保基板1和翅片体2之间的热接触的散热器。解决方案：在散热器中，翅片体2被模制成在截面图中包括U形部分。此外，基板1与U形部的外周面接触地配置，弹性体3与U字状部的内周面抵接。此外，保持板4将弹性体3按压到基板1，以使U形部与基板1压力接触。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2009289831A Storage structure of power conversion device 有权
标题翻译：电力转换装置的存储结构
公开(公告)号：JP2009289831A
公开(公告)日：2009-12-10
申请号：JP2008138541
申请日：2008-05-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YOSHIHARA HIROYUKI , GOTO YOICHI , GOTO MASAKI , KITAI KIYOFUMI , KOMATSU TSUNEO
IPC分类号： H01L25/07 , H01L23/28 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a storage structure of a power conversion device which is made lightweight, improved in vibration resistance, improved in productivity, and made low-cost by reducing the amount of necessary insulating material. SOLUTION: A main circuit board 2 and a control circuit board 3 are fixedly arranged, side by side, at a bottom of a resin case 1 having a wiring member insert-molded. The control circuit board 3 has its reverse surface bonded and fixed to a pedestal 11 projecting from the bottom of the resin case. The main circuit board 2 is fixed having its top surface at substantially the same position as a bottom surface of the resin case. An insulating resin 4 is injected from an inflow hole 13 to fill a top surface of the control circuit board 3 and the top surface of the main circuit board 2 while filling the reverse surface side of the control circuit board 3. Void formation is suppressed on the reverse surface side of the control circuit board 3. A resin flow is made fast and a flow rate is increased on the reverse surface side of the control circuit board 3 to shorten the filling time. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：解决的问题：提供一种轻量化的电力转换装置的存储结构，提高耐振动性，提高生产率，并且通过减少必要的绝缘材料的量来实现低成本。解决方案：主电路板2和控制电路板3并排固定地布置在具有镶嵌成型的布线构件的树脂壳体1的底部。控制电路板3的背面粘接并固定在从树脂壳体的底部突出的台座11上。主电路板2被固定，其顶表面与树脂壳体的底表面处于基本相同的位置。从流入孔13注入绝缘树脂4，在填充控制电路基板3的背面侧的同时填充控制电路基板3的上表面和主电路基板2的上表面。控制电路板3的反面侧。控制电路板3的反面侧的树脂流动快，流量增加，缩短填充时间。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2009033065A Fin-integrated semiconductor module, and manufacturing method thereof 审中-公开
标题翻译：精密集成半导体模块及其制造方法
公开(公告)号：JP2009033065A
公开(公告)日：2009-02-12
申请号：JP2007198128
申请日：2007-07-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KITAI KIYOFUMI , GOTO YOICHI
IPC分类号： H01L23/36
CPC分类号： H01L2224/48091 , H01L2224/48472 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a fin-integrated semiconductor module having high quality wherein crack and breakage of a substrate and a mounting member, etc. caused by stress at manufacturing and heat history at driving, etc. are prevented. SOLUTION: This module includes a substrate 11 which is made of metal or ceramics and has groove 11a on its one surface side surface and a circuit pattern 15 formed on another surface side surface, a semiconductor chip 19 mounted on the circuit pattern via a solder 25, and a mold member 21 made of epoxy resin which is so provided as to cover another surface side surface of the substrate including the semiconductor chip. A heat radiating fin 23 is engaged in the groove of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有高品质的翅片集成半导体模块，其中防止由制造过程中的应力引起的基板和安装部件等的破裂和断裂等。解决方案：该模块包括由金属或陶瓷制成并在其一个表面侧表面上具有凹槽11a的基板11和形成在另一个表面侧表面上的电路图案15，安装在电路图案上的半导体芯片19经由焊料25和由环氧树脂制成的模具构件21，其设置成覆盖包括半导体芯片的基板的另一表面侧表面。散热片23与衬底的凹槽接合。版权所有（C）2009，JPO＆INPIT

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