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1. 发明专利

JP2009248551A Substrate position and angle correction device in screen printing machine 有权
标题翻译：屏幕位置和角度校正装置在屏幕打印机中
公开(公告)号：JP2009248551A
公开(公告)日：2009-10-29
申请号：JP2008103193
申请日：2008-04-11
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： B41F15/26 , B41F15/08
摘要： PROBLEM TO BE SOLVED: To reduce costs by simplifying a substrate position and angle correction means with respect to a mask.
SOLUTION: All of the substrates 3 held on a printing table 1 are pushed up concurrently by lower suckers 5. The moving frame 7 of a positioning unit 6 is moved, and the position and angle confirmation marks 3a, 3a marked on the substrates 3 are read by a camera equipment 8. A displacement determination device 9 confirms the positions and angles of the substrates 3 according to the position and angle confirmation marks 3a, 3a of the substrates 3 read by the camera equipment 8 and determines the degree of displacement by checking them against an appropriate position and angle not causing printing displacement corresponding to a predetermined mask. With the substrates 3 sucked and lifted by an upper sucker 10, operation for correcting displacement in an X-axis direction, a Y-axis direction and a θ-direction is performed based on a result determined by the displacement determination device 9. After the forgoing process is applied to all of the substrates 3, printing is performed simultaneously on all of the substrates 3.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过简化基板位置和相对于掩模的角度校正装置来降低成本。解决方案：保持在打印台1上的所有基板3由下吸器5同时推动。定位单元6的移动框架7移动，标记在位置上的位置和角度确认标记3a，3a 基板3由相机设备8读取。位移确定装置9根据由相机设备8读取的基板3的位置和角度确认标记3a，3a确认基板3的位置和角度，并且确定通过检查它们抵抗适当的位置和不导致与预定掩模相对应的打印位移的角度来进行位移。在通过上部吸盘10吸引和提升的基板3的基础上，基于由位移判定装置9确定的结果来进行X轴方向，Y轴方向和θ方向的位移的修正。对所有基板3进行上述处理，在所有基板3上同时进行印刷。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2008130960A Ball supply cartridge 有权
标题翻译： BALL SUPPLY CARTRIDGE
公开(公告)号：JP2008130960A
公开(公告)日：2008-06-05
申请号：JP2006316817
申请日：2006-11-24
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To grasp the remaining number of balls filled inside easily, and to suppress the generation of static electricity as much as possible. SOLUTION: A ball supply cartridge 8 is arranged immediately above a trough-like hopper having a supply port provided at a bottom section, and moves along the trough-like hopper, dropping the balls filled inside. The ball supply cartridge 8 is formed of transparent glass and has a glass bottle shape, where a filling port 9 is provided at a required place and a mouth cartridge is narrowed. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：容易地掌握填充的剩余球数，并尽可能地抑制静电产生。解决方案：将球供给盒8紧靠上方设置在具有设置在底部的供给口的槽状料斗的上方，并且沿着槽状料斗移动，从而将填充内侧的球落下。球供给盒8由透明玻璃形成，并且具有玻璃瓶形状，其中在所需位置处设置有填充口9，并且嘴筒变窄。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2004082463A Cleaning device of screen mask of screen printing machine 审中-公开
公开(公告)号：JP2004082463A
公开(公告)日：2004-03-18
申请号：JP2002245293
申请日：2002-08-26
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： B41F15/12 , B41F35/00
摘要： PROBLEM TO BE SOLVED: To thoroughly clean printing agent adhering in the screen openings of a screen mask or printing agent adhering to the rear side of the screen mask.
SOLUTION: The cleaning device comprises an upper part side cleaning device 1 and a lower part side cleaning device 16. These devices are reciprocated respectively and simultaneously along the top side and the under side of the screen mask. The upper part side cleaning device 1 spans the middle of a wiping-up cloth 7 sent out of the feed roll 6 of the wiping-up cloth over and around a pressing stand 13. After that, solvent is jetted in the predetermined timing from a solvent jetting port 14. Then, the stained portion is taken up by the take-up roll 8 of the wiping-up cloth. The lower part side cleaning device 16 firstly coats solvent to the screen mask with a solvent coating device 26 and then wipes the solvent with a wiping-up cloth 29. Lastly, the solvent is sucked through the suction port 23 of the pressing stand 22 of the wiping-up cloth and simultaneously the air is blasted from an air jetting device 19 for accelerating the drying of the screen mask.
COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2003080049A Agitating machine for solder filled in laminated tube 有权
标题翻译：用于焊接在层压管中的焊接机
公开(公告)号：JP2003080049A
公开(公告)日：2003-03-18
申请号：JP2001281272
申请日：2001-09-17
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： B01F9/22 , B01F9/00 , B41F15/40
CPC分类号： B01F9/0021 , B01F9/0001 , B01F9/003 , B01F2003/0028 , B01F2009/0059
摘要： PROBLEM TO BE SOLVED: To prevent the solder filled in a laminated tube from rising high like heretofore in agitating the solder, to permit easy taking of a balance during rotating and to additionally improve agitation efficiency.
SOLUTION: A pair of circular supporting plates 7 and 7 are fastened near to both ends of a rotary driving shaft 2 horizontally supported at a trestle 1. The rotary driving shaft 2 is rotationally driven by a drive motor 3. Four pieces of rotary cylinders 8 and 8 respectively with opening/closing caps are borne between the pair of the circular supporting plates 7 and 7. While the rotary cylinders 8 and 8 with the opening/closing caps are respectively rotated, these cylinders are revolved in a perpendicular direction around the rotary driving shaft 2.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了防止填充在层压管中的焊料像搅拌焊料那样升高，允许在旋转期间容易地取得平衡并且另外提高搅拌效率。解决方案：一对圆形支撑板7和7紧固在水平支撑在支架1上的旋转驱动轴2的两端附近。旋转驱动轴2由驱动马达3旋转驱动。四个旋转圆筒8 分别具有开/关盖的8和8分别在一对圆形支撑板7和7之间。当具有开/关盖的旋转缸8和8分别旋转时，这些气缸围绕旋转体在垂直方向上旋转驱动轴2。

5. 发明专利

JP2010180265A Lamination method of plate material 审中-公开
标题翻译：板材的层压方法
公开(公告)号：JP2010180265A
公开(公告)日：2010-08-19
申请号：JP2009022364
申请日：2009-02-03
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： C09J5/00 , C09J163/00 , C09J183/04
摘要： PROBLEM TO BE SOLVED: To prevent a situation such as peeling, rupture or the like at a laminated portion of two plate materials by causing gas within a space expanded when heated after lamination to escape through a portion of an adhesive agent as a sealing layer. SOLUTION: A glass plate 3 is laminated on a silicone plate 1 so that a space S for accommodating a part 2 using an adhesive agent 4 for laminating these plates as a sealing layer is formed between them. The adhesive agent 4 comprises an adhesive agent 4A which allows neither a liquid nor a gas to permeate therethrough and an adhesive agent 4B which allows not a liquid but a gas to permeate therethrough, and the adhesive agents 4A and 4B are laminated so that they cross orthogonally to the laminated plane of the silicone plate 1 and the glass plate 3 to be laminated. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了防止在两个板材的层压部分上的剥离，破裂等的情况，通过在层压之后被加热时膨胀的空间内的气体通过粘合剂的一部分逸出，作为密封层。解决方案：玻璃板3层叠在硅树脂板1上，从而在它们之间形成用于容纳部分2的空间S，该空间S使用用于层压这些板作为密封层的粘合剂4。粘合剂4包括粘合剂4A，其不允许液体和气体渗透通过，并且粘合剂4B不允许液体而是气体渗透通过，并且粘合剂4A和4B被层压，使得它们交叉与硅树脂板1的层叠平面和待层压的玻璃板3垂直。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009147249A Method of mounting electronic component on printed wiring board 审中-公开
标题翻译：印刷电路板上电子元件安装方法
公开(公告)号：JP2009147249A
公开(公告)日：2009-07-02
申请号：JP2007325450
申请日：2007-12-18
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： H05K3/46
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To reduce the thickness of the mounted state of an electronic component and to pile up and mount a different electronic component on the upper surface of a printed wiring board on which an electronic component is already mounted.
SOLUTION: In a mounting method, the printed wiring board 1 is composed of two upper and lower overlapping plates 2 and 3. First, on the upper surface of the plate 3 on the lower side, a circuit pattern 5 is formed and solder bumps 6 and 6, etc., are formed by printing in the circuit pattern 5. Then, the electronic components 7 and 8 are mounted through the solder bumps 6 and 6, etc. Then, the plate 2 on the upper side is overlapped on the upper surface of the plate 3 on the lower side and is attached in that state. At that time, the opening of a prescribed size is provided so as to settle the electronic component mounted on an opening provided on the plate on the upper side. Further, a sealing resin is filled by printing in the opening of the plate on the upper side so as to be flat with the upper surface of the plate on the upper side, and drying is performed thereafter.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了减小电子部件的安装状态的厚度，并且在已经安装有电子部件的印刷电路板的上表面上堆积并安装不同的电子部件。解决方案：在安装方法中，印刷电路板1由两个上重叠板2和下重叠板3组成。首先，在下侧的板3的上表面上形成电路图案5，焊料凸块6和6等通过在电路图案5中印刷形成。然后，电子部件7和8通过焊料凸块6和6等安装。然后，上侧的板2重叠在下侧的板3的上表面上，并且在该状态下被安装。此时，设置规定尺寸的开口以使安装在设置在上侧的板上的开口的电子部件定位。此外，通过在上侧的板的开口中印刷密封树脂以与上侧的板的上表面平坦，然后进行干燥。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2008311477A Led display and method of manufacturing the same 审中-公开
标题翻译： LED显示器及其制造方法
公开(公告)号：JP2008311477A
公开(公告)日：2008-12-25
申请号：JP2007158670
申请日：2007-06-15
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： H01L33/50 , H01L33/54 , H01L33/56 , H01L33/62
CPC分类号： H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To precipitate almost all phosphor powders in a pasty resin onto a bottom portion in a case in a short time and to remove bubbles included in the resin in a short time and substantially completely.
SOLUTION: A lead frame 3 to which a light-emitting diode 2 is bonded is accommodated in a bottom portion within a case 1 and a pasty resin 4 with phosphor powers mixed therein is filled between the lead frame 3 and the case 1. The case 1 is rotated in a perpendicular direction to cause a centrifugal force to act on the resin 4 and with a lapse of a required time after the start of rotation, the periphery of the case 1 is gradually evacuated. The resin 4 is thereafter cured.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：在短时间内将糊状树脂中的几乎所有荧光体粉末沉淀到底部上并且在短时间内基本上完全除去树脂中包含的气泡。解决方案：将发光二极管2接合的引线框架3容纳在壳体1内的底部，并且其中混合有荧光粉功能的糊状树脂4填充在引线框架3和壳体1之间壳体1沿垂直方向旋转以使离心力作用在树脂4上，并且在旋转开始后经过所需时间，壳体1的周边逐渐抽真空。然后树脂4固化。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2008296159A Mixing and defoaming device 有权
标题翻译：混合和缺陷装置
公开(公告)号：JP2008296159A
公开(公告)日：2008-12-11
申请号：JP2007146395
申请日：2007-06-01
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： B01D19/00 , B01F9/22
摘要： PROBLEM TO BE SOLVED: To provide a mixing and defoaming device which can be manufactured at a low cost and can be compactly constituted.
SOLUTION: A rotary arm 6 is rotated on a revolution axis line 6A by driving a revolution motor 3, and in connection with this, container holders 11, 11 pivotably attached to both ends of the rotary arm 6 are revolved to be tilted by centrifugal force. Annular flanges 13, 13 installed integrally to the container holders 11, 11 are brought into contact with an annular stopper 15 when the rotation axis line 11A of the container holder 11, 11 is tilted at an angle of approximately 45° with respect to the revolution axis line 6A. Thereby, the annular flanges 13, 13 are rotated and moved along the lower surface of the annular stopper 15 and the container holders 11, 11 integrated to the annular flanges 13, 13 are rotated. The inside of a closed chamber with a cover 17 is gradually evacuated in synchronization with this action.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供可以以低成本制造并且可以紧凑构成的混合和消泡装置。解决方案：旋转臂6通过驱动旋转电动机3而在旋转轴线6A上旋转，并且与此相关联，可旋转地附接到旋转臂6的两端的容器保持器11,11旋转以倾斜通过离心力。当容器保持器11,11的旋转轴线11A相对于旋转角大约成45°的角度倾斜时，与容器保持器11,11整体地安装的环形凸缘13,13与环形止动件15接触轴线6A。由此，环形凸缘13,13沿着环形止动件15的下表面旋转移动，并且与环形凸缘13,13相结合的容器保持架11,11旋转。具有盖17的封闭室的内部与该动作同步地逐渐抽真空。版权所有（C）2009，JPO＆INPIT

9. 发明专利

JP2008130956A Ball supply method and device 有权
标题翻译：球提供方法和装置
公开(公告)号：JP2008130956A
公开(公告)日：2008-06-05
申请号：JP2006316629
申请日：2006-11-24
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To drop balls into the through holes of a mask efficiently and reliably, and to confirm that the balls enter all through holes of the mask easily.
SOLUTION: Solder balls 21 are dropped and supplied to a trough-like hopper 5 from a solder ball supply means 10. The solder balls 21 are dropped onto the mask from a supply port 6 of the trough-like hopper 5 in the course of movement. Simultaneously, air jet devices 14, 14, 14, 14 provided around the trough-like hopper 5 prevent the solder balls from being diffused to unnecessary places on the mask 15 and roll the solder balls by wind pressure. The solder balls 21 entering the through hole of the mask 15 are received to up to the middle of the through hole for shutting off the passage temporarily. When it is confirmed that the solder balls have entered all the through holes of the mask 15, the solder balls are passed. In this case, atmospheric pressure in a room 1 is increased for pressurization from the upper surface side of the mask 15.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：有效且可靠地将球落入掩模的通孔中，并且确认球容易地进入面罩的所有通孔。解决方案：焊球21从焊球供给装置10落下并供给到槽状的料斗5.焊球21从槽式料斗5的供给口6落下到掩模上运动过程同时，设置在槽状料斗5周围的空气喷射装置14,14,14,14防止焊球扩散到掩模15上的不必要位置，并通过风压滚动焊球。进入掩模15的通孔的焊球21被接收到通孔的中间，以暂时关闭通道。当确认焊球已进入掩模15的全部通孔时，焊球通过。在这种情况下，房间1中的大气压力增加，从面具15的上表面侧加压。（C）2008，JPO＆INPIT

10. 发明专利

JP2005353965A Reflow equipment 有权
标题翻译： REFLOW EQUIPMENT
公开(公告)号：JP2005353965A
公开(公告)日：2005-12-22
申请号：JP2004175316
申请日：2004-06-14
申请人： Minami Kk , ミナミ株式会社
发明人： MURAKAMI TAKEHIKO
IPC分类号： B23K1/008 , B23K3/00 , B23K31/02 , B23K101/42 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To extract air bubbles in a solder bump by performing vacuum degassing when making the solder bump carry out reflow in case of forming the solder bump fixing an electronic component to a printed circuit board.
SOLUTION: A reflow equipment is provided with a taking in/off space 4; a heat insulation chamber for preheating 5, 6, 7; a heat insulation chamber for regular heating 8; and a heat insulation chamber for cooling 9. These are circularly disposed at even intervals in the horizontal direction inside a circular box-type base frame 1 with a printed board feeding port 3 at the side wall. Further, a hot plate 11 is installed at the lower position than the place where the supporting frame rotates for supporting a printed board transfer apparatus inside the heat insulating chambers for preheating and cooling. A heating means 12, 13 comprising the hot plate and the like are provided inside the heat insulating chamber for regular heating. The printed board transfer apparatus 16 is installed for intermittently rotating in the horizontal direction, thus providing a vacuum degassing device 18 for performing vacuum degassing operation.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：在形成将电子部件固定到印刷电路板的焊料凸块的情况下，当制造焊料凸块进行回流时，通过进行真空脱气来提取焊料凸块中的气泡。
解决方案：回流设备配有进/出空间4; 用于预热5,6,7的隔热室; 用于常规加热的隔热室8; 以及用于冷却的隔热室9.这些在圆形盒型底架1内以水平方向以均匀间隔圆形设置，在侧壁上具有印刷板供给口3。此外，热板11安装在比用于支撑框架旋转的位置的下部位置处，用于在用于预热和冷却的隔热室内部支撑印刷板传送装置。在隔热室的内部设有由热板等构成的加热装置12,13，用于规则的加热。安装印刷电路板传送装置16以在水平方向上间歇旋转，从而提供用于进行真空脱气操作的真空脱气装置18。版权所有（C）2006，JPO＆NCIPI

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