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1. 发明专利

JP2009070650A Functional conductive coating, its manufacturing method, and printed wiring board 审中-公开
标题翻译：功能导电涂料，其制造方法和印刷线路板
公开(公告)号：JP2009070650A
公开(公告)日：2009-04-02
申请号：JP2007236520
申请日：2007-09-12
申请人： Maxell Hokuriku Seiki Kk , Toyama Prefecture , マクセル北陸精器株式会社 , 富山県
发明人： YANO KATSUMI , FUJISHIRO TOSHIFUMI , YOKOYAMA YOSHIYUKI , YAMAMICHI YUJI , YOSHIDA SHINOBU
IPC分类号： H01B1/22 , C09D5/24 , C09D7/12 , C09D161/10 , C09D163/00 , H01B1/00 , H01B5/14 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a low-temperature setting functional conductive coating high in adhesion with a resin board or copper foil, good in conductivity, and capable of soldering; to provide its manufacturing method and a printed wiring board.
SOLUTION: The functional conductive coating contains 70-99 wt.% metallic powder comprising at least powder of Ag-coated Ni powder or Ag powder, and has thermosetting resin containing chelate modified epoxy resin. The chelate modified epoxy resin in the thermosetting resin is contained 10-20 wt.%, and formed by adding an unsaturated fatty acid. The printed wiring board has a conductive path formed by applying the functional conductive coating to an insulating board.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供与树脂板或铜箔粘合性高的低温设置功能性导电涂层，导电性良好并且能够焊接; 以提供其制造方法和印刷线路板。
解决方案：功能性导电涂层含有至少包含Ag涂覆的Ni粉末或Ag粉末的粉末的70-99重量％的金属粉末，并且具有含有螯合改性环氧树脂的热固性树脂。热固性树脂中的螯合改性环氧树脂含有10-20重量％，并通过加入不饱和脂肪酸形成。印刷布线板具有通过将功能性导电涂层施加到绝缘板而形成的导电路径。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2006028213A Functional electroconductive coating, electronic circuit using the same and its formation method 审中-公开
标题翻译：功能电极涂层，使用它的电子电路及其形成方法
公开(公告)号：JP2006028213A
公开(公告)日：2006-02-02
申请号：JP2004204446
申请日：2004-07-12
申请人： Maxell Hokuriku Seiki Kk , Toyama Prefecture , マクセル北陸精器株式会社 , 富山県
发明人： YANO KATSUMI , FUJISHIRO TOSHIFUMI , TSUNOSAKI MASAHIRO , TERASAWA TAKASHI , YAMAMICHI YUJI , YOSHIDA SHINOBU
IPC分类号： C09D201/00 , C09D5/24 , C09D7/12 , C09D161/06 , C09D163/00 , H01B1/00 , H01B1/22 , H05K1/09 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a low-temperature-curing electroconductive coating which shows high adhesion to a resin substrate or copper foil, shows good electroconductivity and is solderable, and to provide an inexpensive, environmentally friendly functional electroconductive coating which enables simplification of a circuit manufacturing step and does not produce any waste liquid by etching, an electronic circuit using the same and its formation method.
SOLUTION: The functional electroconductive coating contains a metal powder, a binder, an unsaturated fatty acid and an organic solvent, wherein the metal powder is an Ag-coated Ni powder and an Ag powder, wherein the Ag content in the Ag-coated Ni powder is 5-20 wt.%. The compounding ratio of the Ag-coated Ni powder and the Ag powder is preferably (100-50):(0-50) by weight. The binder contains a thermosetting resin, the unsaturated fatty acid is oleic acid, and the organic solvent is butyl carbitol.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供对树脂基板或铜箔显示出高粘附性的低温固化导电涂层，显示出良好的导电性并且是可焊接的，并且提供廉价的环保功能性导电涂层，其使得能够简化电路制造步骤，并且不通过蚀刻产生任何废液，使用其的电子电路及其形成方法。解决方案：功能导电涂层含有金属粉末，粘合剂，不饱和脂肪酸和有机溶剂，其中金属粉末是Ag涂覆的Ni粉末和Ag粉末，其中Ag- 涂覆的Ni粉末为5-20重量％。 Ag涂覆的Ni粉末和Ag粉末的配混比优选为（100-50）：（0-50）重量％。粘合剂含有热固性树脂，不饱和脂肪酸为油酸，有机溶剂为丁基卡必醇。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2003054528A Disk label affixing device 审中-公开
标题翻译：磁盘标签装置
公开(公告)号：JP2003054528A
公开(公告)日：2003-02-26
申请号：JP2001248090
申请日：2001-08-17
申请人： Maxell Hokuriku Seiki Kk , マクセル北陸精器株式会社
发明人： NOKAI SHINICHI , YOSHIDA SHINOBU , SAKAGAMI YASUSHI
IPC分类号： B65D85/57 , B65C9/36
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive and convenient disk label affixing device.
SOLUTION: This label affixing device is provided with a case body 11 and a cover body 12 supported rotatively on the body 11. A label 7 is set either on the body 11 or on the cover body 12 and a disk 27 is set either on the other body 11 or on the cover body 12 where the label is not set. By rotating the body 11 and the cover body 12 relatively, the label 7 is affixed on the disk 27. An adaptor 13, having on its top face and bottom face two center hole insertion protrusive parts 24, 25 with different outer diameters depending on the inside diameter of the label 7 center hole 8, is mounted removably on the body 11 or on the cover body 12.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供便宜且方便的盘标签固定装置。解决方案：该标签固定装置设置有壳体11和旋转地支撑在主体11上的盖体12.标签7设置在主体11上或盖体12上，并且盘27设置在其他主体11或盖体12上标签未被设定。通过相对地旋转主体11和盖体12，将标签7固定在盘27上。适配器13在其顶面和底面上具有两个具有不同外径的中心孔插入突起部分24,25，标签7的中心孔8的内径可拆卸地安装在主体11上或盖体12上。

4. 发明专利

JP2010090264A Functional electroconductive coating and method for production of printed circuit board using the same 审中-公开
标题翻译：功能电极涂层及使用其制造印刷电路板的方法
公开(公告)号：JP2010090264A
公开(公告)日：2010-04-22
申请号：JP2008261260
申请日：2008-10-08
申请人： Ai Create:Kk , Japan Science & Technology Agency , Toyama Prefecture , 富山県 , 有限会社アイクリエイト , 独立行政法人科学技術振興機構
发明人： YANO KATSUMI , FUJISHIRO TOSHIFUMI , YOKOYAMA YOSHIYUKI , YAMAMICHI YUJI , YOSHIDA SHINOBU , IKEHATA YOSHIO
IPC分类号： C09D201/00 , C09D5/24 , C09D7/12 , C09D161/06 , H01B1/22 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a low temperature-curable functional electroconductive coating that exhibits high adhesion to a resin substrate or copper foil and good electroconductivity and can be strongly soldered, and to provide a method for production of a printed circuit board using the same. SOLUTION: The functional electroconductive coating comprises phthalocyanine and/or a phthalocyanine complex, a metal powder and a thermosetting resin. The metal powder is an Ag-coated Ni powder and/or an Ag powder. The phthalocyanine complex is Ag phthalocyanine. In the functional electroconductive coating, an unsaturated fatty acid is blended. The unsaturated fatty acid is oleic acid while the thermosetting resin is a resol-type phenolic resin. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种对树脂基板或铜箔具有高粘附性和良好的导电性并能够被强烈焊接的低温可固化功能导电涂层，并提供一种生产印刷电路板的方法使用相同解决方案：功能性导电涂层包括酞菁和/或酞菁络合物，金属粉末和热固性树脂。金属粉末是Ag涂覆的Ni粉末和/或Ag粉末。酞菁络合物是Ag酞菁。在功能性导电涂层中，混合不饱和脂肪酸。不饱和脂肪酸是油酸，而热固性树脂是甲阶酚醛树脂型酚醛树脂。版权所有（C）2010，JPO＆INPIT

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