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1. 发明专利

JP2007086210A Method of manufacturing photoelectric compound substrate 有权
标题翻译：制造光电复合基片的方法
公开(公告)号：JP2007086210A
公开(公告)日：2007-04-05
申请号：JP2005272653
申请日：2005-09-20
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： NAKASHIBA TORU , YAGYU HIROYUKI , HASHIMOTO SHINJI , KASAI YUKI
IPC分类号： G02B6/42 , G02B6/122 , G02B6/13 , H01S5/022 , H05K3/28
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a photoelectric compound substrate on which a photoelectric converting element is accurately and simply mounted. SOLUTION: The method is characterized in that the method comprises: a process in which a mounting land preliminarily formed on a substrate surface is covered with a solder resist; a process in which a reference point is set on a light deflecting part; the coordinate of the center of an electrode pad for mounting the photoelectric converting element from the reference point is specified on the solder resist so that the center of the light receiving/emitting part of the photoelectric converting element is superimposed on the light deflecting part when the photoelectric converting element is mounted; and a part of the solder resist is opened by taking the specified coordinate as a reference and the electrode pad for mounting the photoelectric converting element is formed by exposing the mounting land. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种制造其上准确且简单地安装光电转换元件的光电复合基板的方法。解决方案：该方法的特征在于该方法包括：预先形成在基板表面上的安装焊盘用阻焊剂覆盖的工艺; 将参考点设置在光偏转部上的处理; 在阻焊剂上指定用于将光电转换元件从基准点安装的电极焊盘的中心的坐标，使得当光电转换元件的光接收/发射部分的中心重叠在光偏转部分上时安装光电转换元件; 并且通过以指定的坐标为基准来打开阻焊剂的一部分，并且通过暴露安装台面形成用于安装光电转换元件的电极焊盘。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2005070558A Optical waveguide, and light/electricity consolidated substrate 审中-公开
标题翻译：光波导和光电综合基板
公开(公告)号：JP2005070558A
公开(公告)日：2005-03-17
申请号：JP2003301900
申请日：2003-08-26
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： HASHIMOTO SHINJI , KURAI HIROYUKI , MATSUKAWA YOZO , NAKAMURA MASASHI , KODERA KOHEI , YAGYU HIROYUKI , NAKASHIBA TORU , MATSUSHITA YUKIO , KASAI YUKI
IPC分类号： G02B6/12 , C08G59/32 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide an optical waveguide which has a high heat resistance and excellent photoconduction wave performance and can be manufactured at a low cost by a simple process and a light/electricity consolidated substrate. SOLUTION: At least either of a core 11 and clads 5 and 12 is formed of a resin composition containing an oligomer expressed by general formula (A) and a cured material thereof. In the formula; R 1 represents a glycidyl group, R 2 represents a glycidyl group or allyl group; R 3 and R 4 represent methyl groups or hydrogen; and (n) represents an integer of ≥0. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决的问题：提供一种具有高耐热性和优异的光电导波性能的光波导，并且可以通过简单的工艺和光/电固化的基板以低成本制造。解决方案：芯11和包层5和12中的至少任一个由含有由通式（A）表示的低聚物和其固化材料的树脂组合物形成。在公式; R SB 1表示缩水甘油基，R SB 2表示缩水甘油基或烯丙基; R SB 3和R SB 4代表甲基或氢; 和（n）表示≥0的整数。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004341454A Manufacturing method of optical circuit-electric circuit consolidation substrate 有权
标题翻译：光电路电路基板的制造方法
公开(公告)号：JP2004341454A
公开(公告)日：2004-12-02
申请号：JP2003149814
申请日：2003-05-27
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： YAGYU HIROYUKI , KODERA KOHEI , MATSUSHIMA CHOMEI , MATSUSHITA YUKIO , NAKANISHI HIDEO , HASHIMOTO SHINJI , NEMOTO TOMOAKI , NAKASHIBA TORU , KASAI YUKI , USHIYAMA NAOKI
IPC分类号： G02B6/13 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of an optical circuit-electric circuit consolidation substrate with which a high-quality optical circuit-electric circuit consolidation substrate can be obtained with a simple method using the conventional printed wiring board manufacturing method. SOLUTION: In this manufacturing method, laminated material 3 which is equipped at least with a photosensitive resin layer 1 which consists of photosensitive transparent resin whose solubility or refractive index is changed through irradiation with an active energy beam and a metal layer 2 is used. Then, the laminated material 3 is processed with processes which include (a) a process for forming core parts 4a of an optical waveguide 4 by irradiating the photosensitive transparent resin layer 1 with the active energy beam, (b) a process for forming a deflection part 5 which deflects light propagating the optical waveguide 4 and emits it to the outside or which deflects light from the outside of the optical waveguide 4 and makes it enter into the optical waveguide 4 and (c) a process for forming an electric circuit 6 by working the metal layer 2. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供可以通过使用传统印刷线路板制造方法的简单方法获得高质量的光电路电路固结基板的光电路电路固结基板的制造方法。解决方案：在该制造方法中，至少配备感光性树脂层1的层叠材料3，其由通过用活性能量束照射而溶解度或折射率变化的感光性透明树脂和金属层2组成用过的。然后，利用包括（a）通过用活性能量束照射感光透明树脂层1来形成光波导4的芯部4a的工艺的工艺来处理层压材料3，（b）用于形成偏转的工艺部分5使传播光波导4的光偏转并将其发射到外部或偏转来自光波导4的外部的光并使其进入光波导4中，以及（c）通过以下步骤形成电路6的处理：加工金属层2.版权所有（C）2005，JPO＆NCIPI

4. 发明专利

JP2006094102A Supervisory control system, and address setting method 审中-公开
标题翻译：监控控制系统和地址设置方法
公开(公告)号：JP2006094102A
公开(公告)日：2006-04-06
申请号：JP2004276681
申请日：2004-09-24
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KASAI YUKI , YAMAMOTO TOMOKAZU , HASHIME AKIHIKO
IPC分类号： H04L12/40
摘要： PROBLEM TO BE SOLVED: To make it possible to easily add a measuring terminal in a supervisory control system which is constructed connecting many measuring terminals to a supervisory control device through a common communication line.
SOLUTION: A variable address part 14a of the measuring terminals T1 to Tn is established as a temporary address defined beforehand in an initial state, and a control unit 24 of the supervisory control device T0 transmits a polling signal to the terminal devices of the temporary address together with terminal devices of memorized address of the address list of the memory 23. If the control unit 24 receives an answer signal from the temporary address responding this, the control unit discriminates vacant addresses other than the temporary address, makes the vacant address as a formal address, returns to the terminal device of the temporary address together with an address setting signal, and makes the device rewrite the address. Therefore, terminals can be easily added to the system even if the address of the measuring terminal T is not established by manual at the time of installation, or a measuring terminal T is added.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了能够容易地将测量终端添加到通过公共通信线路连接许多测量终端到监视控制设备的监控系统中。解决方案：测量端子T1至Tn的可变地址部分14a被建立为在初始状态下预先定义的临时地址，并且监控装置T0的控制单元24将轮询信号发送到终端设备临时地址与存储器23的地址列表的存储地址的终端设备一起。如果控制单元24从临时地址接收到应答信号，则该控制单元鉴别临时地址以外的空闲地址，地址作为正式地址，返回临时地址的终端设备和地址设置信号，并使设备重写地址。因此，即使测量终端T的地址在安装时没有通过手动建立，或者添加了测量终端T，也可以方便地将终端添加到系统。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2004203943A Light-transmitting sealing material, optical module sealed with the light-transmitting sealing material and method for producing the optical module 有权
公开(公告)号：JP2004203943A
公开(公告)日：2004-07-22
申请号：JP2002371881
申请日：2002-12-24
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： HASHIMOTO SHINJI , KITAMURA KENJI , NEMOTO TOMOAKI , NAKASHIBA TORU , YAGYU HIROYUKI , KODERA KOHEI , USHIYAMA NAOKI , MATSUSHIMA CHOMEI , MATSUSHITA YUKIO , KASAI YUKI , KURAI HIROYUKI
IPC分类号： C08L63/00 , C08G59/40 , C08L71/02 , H01L23/29 , H01L23/31 , H01L33/00
摘要： PROBLEM TO BE SOLVED: To provide a light-transmitting sealing material which can reinforce metal bumps and simultaneously reduce the loss of light transmission in a light-binding portion, in an optical module in which a semiconductor part having a light-receiving or emitting portion is connected to a circuit substrate having an optical / electric composite circuit through the metal bumps, to provide an optical module sealed with the light-transmitting sealing material, and to provide a method for producing the optical module.
SOLUTION: This light-transmitting sealing material 10 for sealing the space 9 of the optical module 1 (1a, 1b) which has the semiconductor part 4 (4a, 4b) and the circuit substrate 7, in which the light-receiving or emitting portion 3 faces the binding portion, and in which electrodes 2 are connected to electrodes 5 through metal bumps 8, respectively, is an epoxy resin composition containing a prescribed amount of an alkylpolyetheramine compound and the like. The light-transmitting sealing material 10 ensures high light transmittance and simultaneously improves fillet formability on the reinforcement of the metal bumps. Thereby, temperature recyclability can be improved.
COPYRIGHT: (C)2004,JPO&NCIPI

6. 发明专利

JP2004140268A Manufacturing method of multilayer printed circuit board for high frequency 审中-公开
标题翻译：高频多层印刷电路板的制造方法
公开(公告)号：JP2004140268A
公开(公告)日：2004-05-13
申请号：JP2002305088
申请日：2002-10-18
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： FUKUYA KENICHI , YONEMOTO KAMIO , KASAI YUKI
IPC分类号： H05K3/38 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer printed circuit board by which the transmission loss of an electric signal in high frequency use can be reduced and close adhesion property of a copper circuit and resin can be improved. SOLUTION: An inner layer circuit substrate is formed by providing the copper circuit on the surface of a resin insulation layer with a copper foil of ≤2.0μm surface roughness. The surface roughness of the copper circuit is lowered to be ≤2.5μm by performing inner layer treatment to the surface of the copper circuit provided on this inner layer circuit substrate. After this, the resin insulation layer is overlapped on the surface of the inner layer circuit substrate to form a multilayered laminate. The adhesiveness of the copper circuit and the resin can be improved by performing the inner layer treatment to the surface of the copper circuit. The transmission loss of an electric signal in high frequency use can be reduced by setting the upper limit of the surface roughness of the copper circuit after the inner layer treatment to be 2.5μm. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供可以降低高频用电信号的传输损耗的多层印刷电路板的制造方法，并且可以提高铜电路和树脂的紧密的附着性。解决方案：通过在具有≤2.0μm表面粗糙度的铜箔的树脂绝缘层的表面上设置铜电路来形成内层电路基板。通过对设置在该内层电路基板上的铜电路的表面进行内层处理，将铜电路的表面粗糙度降低至≤2.5μm。之后，树脂绝缘层重叠在内层电路基板的表面上，形成多层叠层。通过对铜电路的表面进行内层处理，可以提高铜电路和树脂的粘合性。通过将内层处理后的铜电路的表面粗糙度的上限设定为2.5μm，可以降低高频使用中的电信号的传输损耗。版权所有（C）2004，JPO

7. 发明专利

JP2003344684A Material for optoelectric hybrid substrate 有权
标题翻译：光电混合基板材料
公开(公告)号：JP2003344684A
公开(公告)日：2003-12-03
申请号：JP2002154809
申请日：2002-05-28
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： NAKASHIBA TORU , KODERA KOHEI , MATSUSHIMA CHOMEI , MATSUSHITA YUKIO , NAKANISHI HIDEO , HASHIMOTO SHINJI , NEMOTO TOMOAKI , YAGYU HIROYUKI , KASAI YUKI
IPC分类号： G02B6/13 , H05K1/02 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a material for an optoelectric hybrid substrate which allows the manufacture of the high quality optoelectric hybrid substrate by a simple method, using a conventional technique for manufacturing a printed wiring board. SOLUTION: The printed wiring board is formed of a first resin layer 1 consisting of a light transmissible resin; a second resin layer 2 consisting of a light transmissible resin which is brought into contact with the first resin layer 1, in which the solvent solubility is varied by the irradiation with active energy rays, and in which the refractive index is higher than that of the resin forming the first resin layer 1 or the refractive index is made higher than that of the resin forming the first resin layer 1, by the irradiation of the active energy rays; and a metal layer 13 provided on the side of the first resin layer 1 reverse to the second resin layer 2. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种光电混合基板的材料，其通过简单的方法制造高质量的光电混合基板，使用传统的制造印刷线路板的技术。解决方案：印刷电路板由由透光树脂构成的第一树脂层1形成; 第二树脂层2，其由与第一树脂层1接触的透光树脂组成，其中溶剂溶解度通过用活性能量射线照射而变化，并且其中折射率高于通过照射活性能量射线，形成第一树脂层1的树脂或折射率的树脂比形成第一树脂层1的树脂的树脂高。以及设置在与第二树脂层2相反的第一树脂层1侧的金属层13.版权所有（C）2004，JPO

8. 发明专利

JP2007142774A Surveillance device 有权
标题翻译：监控设备
公开(公告)号：JP2007142774A
公开(公告)日：2007-06-07
申请号：JP2005333287
申请日：2005-11-17
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： KASAI YUKI
IPC分类号： H04Q9/00 , G08C15/00
摘要： PROBLEM TO BE SOLVED: To provide a surveillance device in which power source construction is not necessary, and workability is excellent.
SOLUTION: The surveillance device 1 is provided with an interface 13 with a power receive function corresponding to a PoE(R)(Power over Ethernet) through a communication line 3b to a hub 5 corresponding to the PoE, a power/data separator 13b of the interface 13 separates data and power, and the separated power is supplied to a power source 14. After the power source 14 converts input electric power to a predetermined direct current voltage which is supplied to each section in the surveillance device 1 as operation electric power.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种不需要电源结构并且可操作性优异的监视装置。解决方案：监视设备1具有通过通信线路3b将对应于PoE（R）（以太网供电）的功率接收功能的接口13连接到与PoE相对应的集线器5，电源/数据接口13的分离器13b分离数据和电力，并且将分离的电力提供给电源14.在电源14将输入电力转换为提供给监视装置1中的每个部分的预定直流电压之后，如操作电力。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007094436A Manufacturing method of optical-electrical consolidated substrate 审中-公开
标题翻译：光电综合基板的制造方法
公开(公告)号：JP2007094436A
公开(公告)日：2007-04-12
申请号：JP2006348643
申请日：2006-12-25
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： NAKASHIBA TORU , KODERA KOHEI , MATSUSHIMA CHOMEI , MATSUSHITA YUKIO , NAKANISHI HIDEO , HASHIMOTO SHINJI , NEMOTO TOMOAKI , YAGYU HIROYUKI , KASAI YUKI
IPC分类号： G02B6/13 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of an optical-electrical consolidated substrate permitting to manufacture a high quality optical-electrical consolidated substrate by a simple method using a conventional manufacturing method of a printed wiring board. SOLUTION: Manufactured is a material for the optical-electrical consolidated substrate formed comprising: a first resin layer 1 made of a light transmissive resin; a second resin layer 2 made of the light transmissive resin which is arranged in contact with the first resin layer 1, changing in solvent solubility by irradiation of active energy rays, having a higher refractive index than the resin forming the first resin layer 1, or having a refractive index becoming higher than that of the resin forming the first resin layer 1 by irradiation of active energy rays; and a metal layer 13 which is arranged on the surface of the opposite side of the first resin layer 1 to the second resin layer 2. After irradiated with the active energy rays for pattering, the second resin layer 2 is developed with a solvent, and thereby an optical waveguide is formed with the second resin layer 2 remaining after development as a core layer 26 and the first resin layer 1 as a cladding layer 27; after that, electric wiring 24 is formed by printed wiring processing of the metal layer 13. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过使用印刷电路板的传统制造方法的简单方法制造高质量的光电固结基板的光电固结基板的制造方法。解决方案：制造的光学电气固化衬底的材料形成包括：由透光树脂制成的第一树脂层1; 由与第一树脂层1接触的透光性树脂构成的第二树脂层2，通过具有比形成第一树脂层1的树脂的折射率高的活性能量射线的照射改变溶剂溶解度，或折射率比通过活性能量射线的照射形成第一树脂层1的树脂的折射率高; 以及金属层13，其布置在第一树脂层1的与第二树脂层2相反的表面上。在用活性能量射线照射图案之后，第二树脂层2用溶剂显影，从而形成光波导，第二树脂层2作为芯层26，第一树脂层1作为包覆层27，显影后剩下第二树脂层2。之后，通过金属层13的印刷布线处理形成电线24.版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2006039965A Equipment monitoring apparatus and equipment monitoring system 有权
标题翻译：设备监控设备和设备监控系统
公开(公告)号：JP2006039965A
公开(公告)日：2006-02-09
申请号：JP2004219172
申请日：2004-07-27
申请人： Matsushita Electric Works Ltd , 松下電工株式会社
发明人： HASHIME AKIHIKO , YAMAMOTO TOMOKAZU , KASAI YUKI
IPC分类号： G06F13/00 , H04Q9/00
摘要： PROBLEM TO BE SOLVED: To provide an equipment monitoring apparatus and equipment monitoring system dealing with extension and deletion automatically and allowing a browsing apparatus to browse monitor information on each equipment without requiring a server which generally controls each equipment monitoring apparatus. SOLUTION: The equipment monitoring apparatus comprises: a first processing part for returning an URL of self-equipment when the transmission of the URL is requested; a second processing part for requesting other equipment to transmit the URL in an addition mode to connect the self-equipment to a second communication network on line, generating a Web page file of a link linked to the URL of the returned other equipment and the URL of the self-equipment, and storing it; a third processing part for transmitting the Web page file of the link to the other equipment by multiaddress calling when the Web page file of the link is generated; a fourth processing part for updating the Web page file of the link from the other equipment when received; and a fifth processing part for having a browser display the Web file of the link to the browsing apparatus when there is an access from the browsing apparatus. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种处理自动扩展和删除的设备监视设备和设备监控系统，并允许浏览设备浏览每个设备的监控信息，而不需要通常控制每个设备监控设备的服务器。解决方案：设备监控装置包括：第一处理部分，用于当请求传送URL时返回自身设备的URL; 第二处理部分，用于请求其他设备以附加模式发送所述URL，以将所述自身设备连接到第二通信网络，生成链接到返回的其他设备的URL的链接的网页文件，以及URL 的自备设备，并存储; 第三处理部件，用于当生成链接的网页文件时通过多地址呼叫将链接的网页文件传送到其他设备; 第四处理部件，用于在接收时从其他设备更新链接的网页文件; 以及第五处理部分，用于当存在来自浏览装置的访问时，使浏览器显示与浏览装置的链接的Web文件。版权所有（C）2006，JPO＆NCIPI

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