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JP2005109136A Modular component and its manufacturing method 审中-公开
标题翻译：模块化组件及其制造方法
公开(公告)号：JP2005109136A
公开(公告)日：2005-04-21
申请号：JP2003340432
申请日：2003-09-30
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAWARA KYOKO , OISHI JUNJI
IPC分类号： H05K1/14 , H01L23/52 , H05K3/36
摘要： PROBLEM TO BE SOLVED: To achieve the miniaturization of a modular component by using a plurality of mounting substrate on which a plurality of electronic components are mounted with simple configuration.
SOLUTION: This modular component comprises a plurality of mounted components sandwiched between a first substrate 6a and a second substrate 6b. The modular component has at least two or more first reference mounted components 3a, out of a plurality of mounted component which are mounted on the first substrate 6a taller than other mounted components and as tall as the components, the second substrate 6b provided along the top surface of at least two or more first reference mounted components 3a, and a plurality of first resin pillars 1 for positioning and holding the first substrate 6a and the second substrate 6b, wherein the first substrate 6a and the second substrate 6b are electrically connected together via the first reference mounted component 3a.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过使用其上以简单的构造安装有多个电子部件的多个安装基板来实现模块化部件的小型化。解决方案：该模块化部件包括夹在第一基板6a和第二基板6b之间的多个安装部件。模块化部件具有至少两个或更多个第一参考安装部件3a，多个安装部件安装在第一基板6a上，比其他安装部件高，并且与部件一样高，沿着顶部设置的第二基板6b 至少两个以上的第一基准安装部件3a的表面和用于定位和保持第一基板6a和第二基板6b的多个第一树脂柱1，其中第一基板6a和第二基板6b通过第一参考安装部件3a。版权所有（C）2005，JPO＆NCIPI

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