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    • 5. 发明专利
    • MANUFACTURE OF AMORPHOUS SOLAR CELL
    • JPH01152768A
    • 1989-06-15
    • JP31274087
    • 1987-12-10
    • MATSUSHITA ELECTRIC IND CO LTD
    • HANABUSA AKIRASAITO YASUHIROOSAWA MICHIOONO MASAHARUMORI KOSHIRO
    • H01L31/04
    • PURPOSE:To realize a fine amorphous solar cell having high yield by depositing a transparent conductive film while being insulated from an effective generating region formed in the outer circumference of a light-transmitting insulating substrate on the inside of the outer circumference and depositing an amorphous silicon layer onto the whole surface. CONSTITUTION:A section 2 required for outputting power and a transparent conductive film 4 insulated from the periphery of the section 2 are deposited onto a light-transmitting insulating substrate 1 through vacuum deposition, and a P-type amorphous silicon layer 5, an I-type amorphous silicon layer 6 and an N-type amorphous layer 7 are deposited successively extending over the whole surface through glow discharge without a metallic mask. The transparent conductive film 4 and the amorphous silicon each layer 5-7 in a peripheral section are scribed and cut simultaneously by a glass cutter, thus cutting out separate amorphous solar cell 10. Accordingly, the adhesive properties of the amorphous silicon layers in the periphery of the substrate can be improved and no metallic mask is also required, thus easily manufacturing the low-cost amorphous solar cells having excellent yield and high reliability.
    • 6. 发明专利
    • THIN FILM PHOTOSENSOR
    • JPS6436084A
    • 1989-02-07
    • JP19198687
    • 1987-07-31
    • MATSUSHITA ELECTRIC IND CO LTD
    • OSAWA MICHIOARITA TAKASHIHANABUSA AKIRASAITO YASUHIROONO MASAHARUMORI KOSHIRO
    • H01L31/04H05K3/40H05K3/44
    • PURPOSE:To make it possible to reduce the series resistance even if the substrate is thick in the case of small throughholes, by providing throughholes in a part of a substrate having a photovoltaic cell formed on one surface thereof, applying a conductive paste on the inside of the throughholes and part of the other surface of the substrate, and connecting electronic parts to the circuit pattern formed on the other surface of the substrate with the conductive paste, thereby forming an electric circuit. CONSTITUTION:On the rear side B of a metallic substrate 1 having a conductive layer 11 formed on the inner surface of throughholes 9a, 9b, a conductive paste is applied by a screen printing method, thereby forming pads 12a, 12b for lead wire connection and circuit patterns 13a, 13b. At this time, a conductive paste 14 is caused to encroach into the throughholes 9a, 9b by the pressure of the squeegee, and the conductive paste 14 in the throughhole 9a takes an electrical contact of a lower electrode 3 in a region I with the pad 12a for lead wire connection. The conductive paste 14 in the throughhole 9b takes an electrical contact with a transparent electrode 5 in a region IV.